• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.97-103
• /
• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

• Journal of Korea Foundry Society
• /
• v.38 no.5
• /
• pp.103-110
• /
• 2018

The effects of a heat treatment on the carbide formation behavior and mechanical properties of the cobalt-based superalloy X-45 were investigated here. Coarse primary carbides formed in the interdendritic region in the as-cast specimen, along with the precipitation of fine secondary carbides in the vicinity of the primary carbides. Most of the carbides formed in the interdendritic region were dissolved into the matrix by a solution treatment at $1274^{\circ}C$. Solutionizing at $1150^{\circ}C$ led to the dissolution of some carbides at the grain boundaries, though this also caused the precipitation of fine carbides in the vicinity of coarse primary carbides. A solution treatment followed by an aging treatment at $927^{\circ}C$ led to the precipitation of fine secondary carbides in the interdendritic region. Very fine carbides were precipitated in the dendritic region by an aging heat treatment at $927^{\circ}C$ and $982^{\circ}C$ without a solution treatment. The hardness value of the alloy solutionized at $1150^{\circ}C$ was somewhat higher than that in the as-cast condition; however, various aging treatments did not strongly influence the hardness value. The specimens as-cast and aged at $927^{\circ}C$ showed the highest hardness values, though they were not significantly affected by the aging time. The specimens aged only at $982^{\circ}C$ showed outstanding tensile and creep properties. Thermal exposure at high temperatures for 8000 hours led to the precipitation of carbide at the center of the dendrite region and an improvement of the creep rupture lifetimes.

• Restorative Dentistry and Endodontics
• /
• v.33 no.1
• /
• pp.45-53
• /
• 2008

The purpose of this study was to determine the effects on the elastic moduli of the adhesive and the hybrid layer from thermocycling. Twenty one human molars were used to create flat dentin surfaces. Each specimen was bonded with a light-cured composite using one of three commercial adhesives (OptiBond FL [OP], Clearfil SE Bond [CL], and Xeno III [XE]). These were sectioned into two halves and subsequently cut to yield 2-mm thickness specimens; one specimen for immediate bonding test without thermocycling and the other subjected to 10,000 times of thermocycling. Nanoindentation test was performed to measure the modulus of elasticity of the adhesive and the hybrid layer, respectively, using an atomic force microscope. After thermocycling, XE showed a significant decrease of the modulus in the adhesive layer (p < 0.05). Adhesives containing hydrophilic monomers are prone to hydrolytic degradation. It may result in the reduced modulus of elasticity, which leads to the mechanically weakened bonding interface.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.23-30
• /
• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.2 s.35
• /
• pp.95-103
• /
• 2005

The interfacial reaction between 42Sn-58Bi solder (in wt.$\%$ unless specified otherwise) and electroless Ni-P/immersion Au has been investigated before and after thermal aging, with a focus on formation and growth of an intermetallic compound (IMC) layer, consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 (bare Ni), 0.1, and $1{\mu}m$ was plated on the $5{\mu}m$ thick electroless Ni-P ($14{\~}15 at.\%$P) layer. Then, the 42Sn-58Bi solder balls were fabricated on three different UBM structures by screen-printing and pre-reflow. The $Ni_3Sn_4$ layer (IMC1) was formed at the joint interface after pre-reflow for all the three UBM structures. On aging at $125^{\circ}C$, a quaternary phase (IMC2) was observed above the $Ni_3Sn_4$ layer in the Au-containing UBM structures, which was identified as $Sn_{77}Ni{15}Bi_6Au_2$ (in at.$\%$). The thick $Sn_{77}Ni{15}Bi_6Au_2$ layer deteriorated the integrity of the solder joint and the shear strength of the solder bump was decreased by about $40\%$ compared with non-aged joints.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.41 no.2
• /
• pp.125-133
• /
• 2014

The purpose of this study was to investigate the effect of various surface treatment methods on the shear bond strength of orthodontic brackets in vitro. Ninety six specimens, 6 mm in diameter and 5 mm in height, were made with composite resin ($Filtek^{TM}$ Z350 XT, 3M ESPE, USA) and treated with an aging procedure. After aging, the specimens were randomly separated in six groups: (1) control with no surface treatment, (2) 37% phosphoric acid gel, (3) 4% hydrofluoric acid gel, (4) sodium bicarbonate particle abrasion, (5) diamond bur, and (6) 1 W carbon dioxide laser for 5s. The metal brackets were bonded to composite surfaces by means of an orthodontic adhesive (Transbond XT, 3M Unitek, USA). Shear bond strength values were evaluated with a universal testing machine (R&B Inc., Korea). Analysis of variance showed a significant difference between the groups. Group 5 had the highest mean shear bond strength (11.9 MPa), followed by group 6 (11.1 MPa). Among the experimental groups, group 2 resulted in the weakest mean shear bond strength (5.22 MPa). The results of this study suggest that the repair shear bond strength of the aged composite resin was acceptable by surface treatment with a carbon dioxide laser.

• Korean Journal of Materials Research
• /
• v.5 no.4
• /
• pp.476-482
• /
• 1995

TbFeCo 박막의 Facing Targets Sputtering System 조건, 조성 및 시효 처리에 따른 광자기적 특성과 산화 특성을 조사하였다. XPS와 AES를 통하여 보호막 없이 제조된 TbFeCo 박막의 표면에는 Co에 우선하여 Tb과 Fe가 안정한 산화물의 형태로 존재하며, 표면에서 3.2nm 깊이부터는 산화되지 않은 TbFeCo 박막이 존재함을 확인하였다. TbFeCo 박막을 시효 시킴에 따라 Fe 산화층의 두께는 거의 변화가 없었으며, Tb Oxide 층만이 증가하였다. TbFeCo 박막은 사용된 기판의 종류나 제조조건에 따라 열적 안정성에 큰 차이를 보였다.

• Journal of Advanced Marine Engineering and Technology
• /
• v.7 no.2
• /
• pp.36-49
• /
• 1983

최근 높은 경제성과 용접성의 우수성에 의한 마찰 용접의 응용에 있어서 내열.내식 재료가 개스터어빈, 기관, 핵 발전기등의 기계 부품 생산 공업에 널리 이용되고 있다. 따라서 이종내열 합금강의 마찰 용접된 부품을 이용함에 있어서 내식.내마모 및 용접성 뿐만 아니라 고온 피로 강도와 크리이프 강도 등의 복합 특성에 관한 연구가 요구되고 있다. 본 연구에서는 마르텐사이트계 실크롬 내열강과 오오스테나이트계 닉켈크롬 스테인레스강의 이종 내식.내열 합금강의 최적 용접조건하에서 마찰 용접된 후의 시효 열처리가 용접재의 700 .deg.C 고온 회전 굽힘 피로강도 특성에 미치는 영향에 관하여 실험과 강도해석에 의해 조사되었고 용접후의 용체화 처리와 시효 열처리법에 의한 내열강 마찰 용접강도 개선법을 개발코저한 것이다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.44-44
• /
• 2003

Scandium을 소량 첨가한 Al합금은 용체화 처리 후 시효에 의해 강화되며, 합금의 주 강화상은 Ll2 type의 규칙구조를 갖는 A1$_3$Sc상으로 열처리시 아주 미세한 정합의 구형입자로 석출한다. Scandium은 Al합금에서 첨가원소의 at%에 따른 경량화 효과가 Gold 다음으로 크다. 현재까지의 Al-Sc계 합금에 대한 연구는 시효경화에 따른 기계적 특성 변화에 대해서만 이루어져 왔으나 본 연구에서는 투과전자현미경을 이용하여 열처리에 따른 미세조직의 변화, 급냉 상태에서 생성된 A13Sc입자의 형성 및 계면구조, 시효에 따른 석출거동을 규명하였다. 실험에 사용된 alloy는 미국의 Ashurst 사에서 제조된 Al-2wt%Sc모합금과 순도 99.9%의 Al을 혼합하여 Arc melting법으로 제조하였다. Primary A13Sc상은 Ll2 type으로 응고시에 용융상태에서 먼저 핵생성되어 Al의 핵생성 site로 작용한다. 635$^{\circ}C$에서 용체화 처리한 시편에서는 수백 nm 크기를 갖는 $Al_3$Sc상이 계면과 matrix내에 구형으로 존재함을 확인하였다. 수백 nm 크기의 $Al_3$Sc상의 내부에는 역위상 경계(Antiphase boundary)이 존재로 인한 특징적인 contrast가 관찰되었으며, 이 $Al_3$Sc상은 응고시 생성된 작은 $Al_3$Sc상들이 모여져 생성된 것으로 추측된다. 수백 nm 크기 의 $Al_3$Sc사와 Al matrix 사이의 계면에는 격자상수 차이에 의한 많은 edge dislocation들이 관찰된다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2010.05a
• /
• pp.47.1-47.1
• /
• 2010

Mg합금은 모든 구조용 재료 중에서 비강도가 크며 가공성이 가장 우수하여 재료의 실제 적용시에 2차 가공비 측면에서 다른 경량재료에 비해 유리하다. 그래서 경량화를 필요로 하는 최근 산업체의 요구를 충족시킬 수 있는 재료이다. 그러나 마그네슘 합금의 적용이 매우 제한되는 이유는 결정구조가 hcp로서 냉간가공이 어렵고, 강화기구가 석출경화 및 고용강화로 제한되기 때문에 기계적 성질, 즉 강도와 연성이 모두 낮다. 특히 고온에서 기계적 성질이 급격히 저하되기 때문에 구조용 재료로써는 사용이 어렵다. 따라서, 본 연구에서는 고온에서 안정한 MgZn상과 항복강도를 향상시키는 Mg4Ag상의 석출을 보이는 Mg-Zn-Mn-Ag합금의 시효거동 및 미세조직 변화에 대해 검토하고자 하였다. 본 합금의 석출거동, 미세조직 및 경도 변화에 미치는 시효처리의 영향에 관한 연구를 수행하기 위해 Pandat Program을 이용해 열역학적 계산을 통한 상태도 해석 및 석출상을 예측 하였다. 계산된 결과는 DSC실험을 통해 비교 분석함으로써 신뢰성을 확보하였고 미세조직 및 석출상 분석을 위해 OM, SEM 그리고 XRD로 관찰하였다. 또한, 시효처리에 따른 기계적 특성을 분석하기 위해 상온 및 고온 인장시험을 하였고, 인장시험 후 파단면 분석을 통하여 재료의 파괴거동을 분석하였다.