Improved drop impact reliability of Sn-Ag-Cu solder joint using Cu-Zn solder wetting layer (Cu-Zn 합금 젖음층을 이용한 Sn-Ag-Cu 솔더 접합부의 낙하 충격 신뢰성 향상 연구)
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- Proceedings of the Materials Research Society of Korea Conference
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- 2009.05a
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- pp.35.2-35.2
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- 2009