• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.12
• /
• pp.792-796
• /
• 2015

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed 'Modified slurry preparation process' to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

• Korean Journal of Materials Research
• /
• v.25 no.1
• /
• pp.27-31
• /
• 2015

This paper proposes a novel way of fabricating aligned porous Sn by freeze-drying of camphene slurry with stannic oxide ($SnO_2$) coated Sn powders. The $SnO_2$ coated Sn powders were prepared by surface oxidation of the initial and ball-milled Sn powders, as well as heat treatment of tin chloride coated Cu powders. Camphene slurries with 10 vol% solid powders were prepared by mixing at $50^{\circ}C$ with a small amount of oligomeric polyester dispersant. Freezing the slurry was done in a Teflon cylinder attached to a copper bottom plate cooled at $-25^{\circ}C$. Improved dispersion stability of camphene slurry and the homogeneous frozen body was achieved using the oxidized Sn powder at $670^{\circ}C$ in air after ball milling. The porous Sn specimen, prepared by freeze-drying of the camphene slurry with oxidized Sn powder from the heat-treated Sn/tin chloride mixture and sintering at $1100^{\circ}C$ for 1 h in a hydrogen atmosphere, showed large pores of about $200{\mu}m$, which were aligned parallel to the camphene growth direction, and small pores in their internal walls. However, $100{\mu}m$ spherical particles were observed in the bottom part of the specimen due to the melting of the Sn powder during sintering of the green compact.

• Magazine of the Korea Concrete Institute
• /
• v.8 no.5
• /
• pp.163-170
• /
• 1996

Cellulose fibers, being fairly strong and stiff as well as cheap and plentiful with low energy demand during manufacture, are strong contenders for the reinforcement of cement-based materials. Cellulose fiber-cement composites, generally manufactured by slurry-dewatering procedure, can find applications in the production of flat and corrugated cement sheets and many other thin-sheet cement products. This paper presents the results of an experimental study concerned with the effects of fiber content and moisture conditions on the flexural performance of these composites. An effort was also made to study the effect of pozzolanic admixtures on the flexural performance in different moisture conditions. The test results obtained were analyzed statistically using the analysis of variance in order to derive reliable conclusions. The results generated in this study were indicative of significant effects of fiber content and moisture condition of flexural performance. There is a tendency in flexural strength to increase in increase in fiber content up to 8%: flexural toughness values continue to increase even at higher fiber contents. Moisture content has a significant effect on the flexural performance. There is a tendency in flexural strength to decrease and flexural toughness to increase with increasing moisture content Composites incorporating pozzolans showed an increase in the flexural strength while slightly reducing the flexural toughness and were sensitive to variations in moisture content.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.145-148
• /
• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.166-169
• /
• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.45-48
• /
• 2003

The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on tungsten passivation layer in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we investigated the effects of oxidizer on W-CMP process with three different kinds of oxidizers, such as $H_2O_2$, $Fe(NO_3)_3$, and $KIO_3$. In order to compare the removal rate and non-uniformity of three oxidizers, we used alumina-based slurry of pH 4. According to the CMP tests, three oxidizers showed different removal mechanism on tungsten surface. Also, the microstructures of surface layer by AFM image were greatly influenced by the slurry chemical, composition of oxidizers. The difference in removal rate and roughness of tungsten surface are believed to caused by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry. Our stabilized slurries can be used a guideline and promising method for improved W-CMP process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.11a
• /
• pp.136-139
• /
• 2003

Copper has attractive properties as a multi-level interconnection material due to lower resistivity and higher electromigration resistance as compared with Alumina and its alloy with Copper(0.5%). Among a variety of agents in Copper CMP slurry, $H_2O_2$ has commonly been used as the oxidizer However. $H_2O_2$ is so unstable that it requires stabilization to use as oxidizer Hence, stabilization of $H_2O_2$ is a vital process to get better yield in practical CMP process. In this article the stability of Hydrogen Peroxide as oxidizer of Copper CMP slurry has been investigated. When alumina abrasive was used, $\gamma$-particle Alumina C had a better stability than $\alpha$-particle abrasive. As adding KOH as pH buffering agent, $H_2O_2$ stability in slurry decreased. Urea hydrogen peroxide was used as oxidizer, an enhanced stability was gotten. When $H_3PO_4$ as $H_2O_2$ stabilizer was added, the decrease of $H_2O_2$ concentration in slurry became slower. Even though adding $H_2O_2$ in slurry after bead milling lead to better stability than in advance of bead milling, it had a lower dispersibility.

• Korean Journal of Materials Research
• /
• v.9 no.12
• /
• pp.1188-1195
• /
• 1999

The effect of aluminosilicate sol on the formation of mullite layer in zircon shell mold was investigated. Aluminosilicate sol was prepared by mixing of colloidal silica(NALCO(R) 1130) and an aqueous solution of aluminium nitrate at room temperature. The sol gelled at 50$^{\circ}C$ for 48 hrs. It was identified that the gel consists of aluminosilicate complexes and gibbsite. The coordination number of all aluminium ion bonded with silicon ion was four. Mullite phase formed by sintering above 1300$^{\circ}C$. XRD peak of mullite sharpened with increasing sintering temperature and the content of aluminium nitrate. Mullite phase displayed whisker-like 0.5~5${\mu}m $ particles. Separation between 1st and 3rd layers during sintering and the difference in thermal expansion coefficient between residual silica and mullite.

• Korean Journal of Materials Research
• /
• v.10 no.10
• /
• pp.715-720
• /
• 2000

By the mechanical alloying method. Ni-WC composite materials were prepared to improve the deformation-resistance for creep and sintering of Ni-anode at the operating temperature of $650^{\circ}C$. Mechanically alloyed powder w was initially fabricated by ball milling for 80hr, and then amorphization was occurred by the destruction of ordered crystals based on XRD analysis. In order to investigate the electrochemical performance and sheet characteristics of Ni-WC anode, tape casting process was adopted. Finally, the obtained sheet thickness of Ni- we after sintering at $1180^{\circ}C$ for 60 minutes in $H_2$ atmosphere was O.9mm and the average pore size was $3~5{\mu\textrm{m}}$ with porosities of 55%. The second phase was not observed in Ni- W matrix while W particles were finely and uniformly distributed in Ni matrix. This fine and uniform distributed W particles in Ni matrix are expected to enhance the mechanical properties of Ni anode through the dispersion and solid solution hardening mechanisms.

• Korean Journal of Materials Research
• /
• v.16 no.12
• /
• pp.731-738
• /
• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.