Spectral Element Analysis for the Electro-Mechanical Admittance of a Piezoelectric Wafer Bonded on a Plate (판구조물에 부착된 압전소자의 전기역학적 어드미턴스 스펙트럼 요소 해석)
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- Proceedings of the Computational Structural Engineering Institute Conference
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- 2009.04a
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- pp.239-242
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- 2009