• 제목/요약/키워드: 스페클

검색결과 151건 처리시간 0.033초

광학적 비접촉 측정에 의한 구조물 해석의 화상처리 계측 시스템 개발에 관한 연구 (A Study on the Development of Image Processing Measurement System on the Structural Analysis by Optical Non-contact Measurement)

  • 김경석
    • 한국생산제조학회지
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    • 제8권6호
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    • pp.78-83
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    • 1999
  • This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

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ESPI를 이용한 반도체 패키지 내부결함 검사에 관한 연구 (A Study on the Inner Defect Inspection for Semiconductor Package by ESPI)

  • 정승택;김경석;양승필;정현철;이유황
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1442-1447
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    • 2003
  • Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

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전단간섭계를 이용한 면외변형의 정량적 계측 (Quantitative Measurement of Out-of-plane Deformation Using Shearography)

  • 장호섭;정성욱;김경석;정현철
    • 한국정밀공학회지
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    • 제24권4호
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    • pp.131-137
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    • 2007
  • Electronic Speckle Pattern Interferometry(ESPI) is a common method for measuring out-of-plane deformation and in-plane deformation and applied for vibration analysis and strain/stress analysis. However, ESPI is sensitive to environmental disturbance, which provide the limitation of industrial application. On the other hand, Shearography based on shearing interferometer which is insensitive to vibration disturbance can directly measure the first derivative of out-of-plane deformation. In this paper a technique that extract out-of-plane deformation from results of shearography by numerical processing is proposed and measurement results of ESPI and Shearoraphy are compared quantitatively.

스페클 간섭법에 의한 Nd:YAG 레이저 용접부의 변형해석 (Strain Analysis of Nd:YAG Laser Welding Zone by Speckle Interferometry)

  • 김경석;김성식;정승택;김종수
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.85-89
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    • 2002
  • This paper used the Laser Speckle Interferometry to present the strain analysis of Nd:YAG Laser welding zone. Previous TIG welding to sheet plate, which welds only high-skilled engineer, produces residual stress nearby welding zone due to thermal effect. However, Laser welding makes sheet pate welding easy and thermal effect minimum. Thermal effect zone is measured by strain analysis of the laser-welding zone by ESPI under tensile testing of sheet plate welded by Nd:YAG laser. The ESPI results, which compared with strain gage method, are agreed within error 3 %.

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패턴 빔을 이용한 BGA 단차 측정 (BGA Height Measurement Using Pattern Beam)

  • 신상훈;유영훈
    • 한국광학회지
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    • 제20권6호
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    • pp.361-365
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    • 2009
  • 본 연구에서는 패턴 빔을 이용하여 표면이 거친 물체의 단차를 비접촉 방식으로 측정 하는 방법에 대하여 연구하였다. 본 연구에 사용된 방법은 장치가 매우 간단하고 스페클 노이지가 영상에 미치는 영향이 작아 재현성 면에서 매우 우수하였다. 특히 기준면에 문양이 없는 경우에는 기존의 자동 초점 측정 장치로는 측정하기 어려우나, 본 연구 방법에 의해 측정이 가능함을 보였다. 그리고 측정 시간이 매우 짧고 재현성이 좋으며 장치가 간단하여 산업 현장에서 응용하기 적절한 방법이다.

레이저 프로젝터의 스페클 저감을 위한 광학 소자 설계 및 제작 (Design and Fabrication of Optical Element for Speckle Reduction in Laser Projector)

  • 이재용;김영주
    • 정보저장시스템학회논문집
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    • 제10권2호
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    • pp.55-60
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    • 2014
  • Laser projector has many advantages of high brightness, high resolution and small size, but the huge drawback of image degradation called speckle which generated by coherence of laser and roughness of surface interrupts their general use. There are many methods to reduce speckle pattern, but they need effective optical systems to realize display to the far field with huge volume. We designed speckle reduction element by using microlens with controlled curvature to reduce spatial coherence. Vibration element was also applied to reduce temporal coherence which considered response time of eye. Designed element was fabricated by simple reflow method and imprinting method. From the results, the fabricated element performed 48.33% of speckle reduction efficiency and 41.29% of optical efficiency with a single doublet lens.

ESPI법에 의한 강체 회전 변위 측정에 관한 연구 (A Study on the Rotating Displacement Measurement of Rigid Body by ESPI Method)

  • 김경석;홍명석
    • 한국자동차공학회논문집
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    • 제1권2호
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    • pp.125-133
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    • 1993
  • Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

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CW 레이저 스페클 사진법에 의한 스트레인 측정에 관한 연구 (A Study of Strain measurement by continuous wave Laser speckle photography)

  • 김경석;김충원;이승건
    • 한국정밀공학회지
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    • 제7권2호
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    • pp.65-73
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    • 1990
  • Speckle photography is a simple non-contacting method for analysing surface displacement. In its basic form, the object to be studied is illuminated with a beam of laser light from any convenient direction, and a double exposure photography of the surface recorded on the fine-grain film, the object is undergone the displacement to be measured between exposures. Like this, it allows the strain field to be evaluated in two dimensions. A direct experimental comparison of speckle photography with theoretical value on a notched tensile test specimen showed that serious errors could, however, occur due to local surface tilting and due to aberra- tions of the imaging lens. Methods of minimising these effects and those of the speckle de-correlation which occurs by the various conditions are discussed.

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레이저 스페클 간섭법을 이용한 면내 변형 측정 및 해석에 대한 연구 (I) (A Study on Measurement and Analysis of In-Plane Deformations by Using Laser Speckle Interferometry (I))

  • 강영준;노경완;강형수
    • 한국정밀공학회지
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    • 제15권11호
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    • pp.121-129
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    • 1998
  • In-plane ESPI(Electronic Speckle Pattern Interferometry) was devised to measure in-plane deformations and rotation of a specimen with laser in this study. ESPI is a optical measuring method to be able to measure the deformations of engineering components and materials in industrial fields. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. And the 4-frame phase shifting method was used for the quantitative analysis. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between the experiment results and those of the FEA(Finite Element Analysis).

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대칭형 물체의 진동 진폭 분포 측정을 위한 레이디얼 전단 간섭계에 대한 연구 (A Study on Radial Electronic Shearography for Measuring Amplitudes of Vibration of Symmetrical Objects)

  • 강영준;최장섭;노경완
    • 한국정밀공학회지
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    • 제14권12호
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    • pp.9-16
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    • 1997
  • In this paper, a newly radial electronic shearography system was developed in order to study vibration characteristics of symmetrical objects. We utilized the electro-optic holography theory for quantificational analysis and a porror prism for shearing two inages radially in this study. These image data obtained by this shearography give us various distributions of the gradient of vibration amplitude, and they are useful informations to study vibrational characteristics of symmetrical objects. Finally this developed system with phase stepping and modulation was applied to fans and disks to inspect characteristics of the vibration and the blance of symmetrical objects and obtained good results.

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