• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.55-61
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• 2015

In this paper, the grinding characteristics of internal thrust grinding were studied with vitreous CBN wheels using a machining center. Grinding experiments were performed according to grinding conditions, such as wheel feed speed and depth of cut, workpiece speed, and rate of grinding width. Additionally, the grinding force and grinding ratio were investigated though these experiments. Based on the experimental results, the grinding characteristics of internal thrust grinding were discussed.

• Journal of the Korean Society of Safety
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• v.8 no.4
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• pp.194-200
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• 1993

Grinding experiments for Al 7075 alloy were carried out to study the influence of grinding conditions and supply methods of grinding fluid on residual stress and surface roughness and grinding force. The residual stress was measured by an X-ray method. The supply method of grinding fluid with a guide nozzle has large decrease value of the tensile residual stress and of grinding force than a normal nozzle. In sparking out state of the grinding work, it is desirable to decrease the depth of cut and the workpiece feedrate for improving surface roughness and mechanical properties.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.104-107
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• 2005

Recently, according to the development of semiconductor industry, needed to high-integration and high-functionality. These changes are required for silicon wafer of large scale diameter and precision of TTV (Total Thickness variation). So, in this research, suggest that the method of monitoring system is using motor current. This method is needed for observation of silicon wafer grinding process. Motor current sensor is consisted of hall sensor. Hall sensor is known to catching of change of current. Received original signal is converted to the diginal, then, it is calculated RMS values, and then, it is analysed in computer. Generally, the change of force is relative to the change of current, So this reason, in this research tried to monitoring of motor current change, and then, it will be applied to analysis for silicon wafer grinding process. using motor current sensor.