• 한국기계가공학회지
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• 제14권4호
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• pp.55-61
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• 2015

In this paper, the grinding characteristics of internal thrust grinding were studied with vitreous CBN wheels using a machining center. Grinding experiments were performed according to grinding conditions, such as wheel feed speed and depth of cut, workpiece speed, and rate of grinding width. Additionally, the grinding force and grinding ratio were investigated though these experiments. Based on the experimental results, the grinding characteristics of internal thrust grinding were discussed.

• 한국안전학회지
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• 제8권4호
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• pp.194-200
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• 1993

Al합금 7075에 대해서 공작물 이송속도, 연삭깊이 및 유제 공급방법이 잔류응력에 미치는 영향을 실험적으로 행하였다. 가공 변질층에 형성된 잔류응력을 측정하기 위해 X선 회절법을 사용하였다. 개발된 노즐 공급방법 (Guide noazle)은 인장 잔류응력 및 연삭저항, 표면조도 부분에서 기존 노즐보다 좋은 효과를 가져 왔다. 연삭깊이 및 공작물 이송속도를 감속시키고 아울러 스파크 아웃을 행하면 잔류응력 및 표면 조도를 감소시킬 수 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.104-107
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• 2005

Recently, according to the development of semiconductor industry, needed to high-integration and high-functionality. These changes are required for silicon wafer of large scale diameter and precision of TTV (Total Thickness variation). So, in this research, suggest that the method of monitoring system is using motor current. This method is needed for observation of silicon wafer grinding process. Motor current sensor is consisted of hall sensor. Hall sensor is known to catching of change of current. Received original signal is converted to the diginal, then, it is calculated RMS values, and then, it is analysed in computer. Generally, the change of force is relative to the change of current, So this reason, in this research tried to monitoring of motor current change, and then, it will be applied to analysis for silicon wafer grinding process. using motor current sensor.