• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.43-48
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• 2017

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1109-1112
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• 2004

This paper presents a high sensitive force sensing module to measure machining forces for a tip-based nanopatterning instrument. The force sensing module utilizing a leaf spring mechanism and a capacitive displacement sensor has been designed to provide a measuring range from 80$\mu$N to 8N. This force sensing module is mounted on a PZT driven in-feed motion stage with 1 nm resolution. The sample can be moved by a X-Y scanning motion stage with 5 nm resolution. In the patterning experiments, the machining forces were controlled and monitored by the force sensing module. Then, the patterned sample was measured by AFM. Experimental results demonstrated that the developed force sensing module can be used as an effective sensing device in the nanopatterning operation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.351-354
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• 2004

This work presents a simple and cost-effective approach for maskless fabrication of positive-tone silicon master for the replica molding of hyperfine elastomeric channel. Positive-tone silicon masters were fabricated by a maskless fabrication technique using the combination of nanoscratch by Nanoindenter ⓡ XP and XOH wet etching. Grooves were machined on a silicon surface coated with native oxide by ductile-regime nanoscratch, and they were etched in a 20 wt％ KOH solution. After the KOH etching process, positive-tone structures resulted because of the etch-mask effect of the amorphous oxide layer generated by nanoscratch. The size and shape of the positive-tone structures were controlled by varying the etching time (5, 15, 18, 20, 25, 30 min) and the normal loads (1, 5 mN) during nanoscratch. Moreover, the effects of the Berkovich tip alignment (0, 45$^{\circ}$) on the deformation behavior and etching characteristic of silicon material were investigated.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1539-1540
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• 2015

본 연구는 가공 활선 송전선로의 이상 진단을 위한 시스템 개발에 관한 것으로 송전 철탑 경간내에 설치되어 있는 송전선을 주행하며 전선의 내부 또는 외부의 열화를 확인하기 위한 것이다. 본 연구에 의한 시스템은 지상으로부터 30m 이상의 높이에서 설치되어 운행되기 때문에 바람에 의해 낙하되지 않도록 구성하였다. 또한 복도체 또는 4도체 선로를 주행하도록 설계하였으며 345kV 고압에서도 전계 및 자계의 영향을 받지 않도록 설계하였다. 전선의 이상 검지를 위해서 카메라를 설치하여 얻어진 데이터를 영상 처리 하여 이상 부위에 대한 에너지 변화를 관찰하여 이상 유무를 판단하도록 하였다. 완성된 시스템은 설치 및 이동을 위해서 경량화 시켰으며 분해 조립이 쉽도록 구성하였다. 본 시스템의 현장 적용에 의한 실험 결과 1m/sec의 이동 속도에서 1mm 이하의 스크래치에 대하여 검출이 가능하였다.

• Journal of Technologic Dentistry
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• v.40 no.1
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• pp.27-32
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• 2018

Purpose: This study was performed to investigate processability of the dental zirconia block. Most of the CAD/CAM zirconia restorations utilize the partially sintered blocks, which are sintered at a temperature lower than $1100^{\circ}C$. Methods: Partially sintered zirconia samples were prepared $40{\times}30{\times}10mm$ and surface treatment by #2000 sandpaper. Scratch hardness was determined by the procedure of ASTM G171-03 using a scratch hardness tester(KS TECH, Korea) equipped with a real time load detector to measure tangential force during scratching. The scratch rate was 30 mm/min. Results: Scratch hardness(Hs) increases steeply with increase in the loads. The highest Hs was sampl 1.42 GPa and lowest was sample 0.42 GPa. Conclusion : The machinability of partially sintered CAD/CAM zirconia blocks can be optivized by manipulation of Hs.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.136-138
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• 2007

최근 기계가공기술의 발달에 따라 내마모용 TiN 박막의 수요가 증가하였고, TiN박막은 내마모용으로 높은 경도 및 밀착력을 필요로 한다. TiN박막을 증착시키는 방법은 PVD, CVD 등 여러 가지가 있으나 본 연구에서 공구강 SKD 61기판 표면과 Radical Nitriding(RN) 처리된 SKD 61 기판에 arc ion plating(AIP)를 이용하여 TiN 박막을 증착시켜 표면경도를 향상시키고, 이 코팅층의 미세구조가 기계적 특성에 미치는 영향을 연구하였다. 그 결과 RN처리된 SKD61에서 코팅 두께가 많이 나왔고, 스크래치테스트 결과 접착력이 향상되었음을 알 수 있었다.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.108-108
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• 2018

무전해 니켈도금 층은 마모, 마찰, 스크래치, tribology 등에 대한 내구성뿐만 아니라 내식성도 우수하여 산업현장에서 널리 적용되고 있다. 일반적으로 무전해 니켈도금 층의 내구성은 경도 값과 직접적인 상관관계를 가지며, 그 값은 약 $400-500H_V$ 정도이다. 이러한 무전해 도금 층에 대하여 약 $400^{\circ}C$에서 1시간 정도 열처리를 실시하면 경도 값은 약 $800-1000H_V$ 정도로 현저히 증가되고 내구성 역시 크게 향상시킬 수 있다. 그러나 해양환경에서 발생되는 캐비테이션 침식 부식에 대한 무전해 니켈도금 층의 열처리에 관한 연구는 거의 전무한 상태이다. 따라서 본 연구에서는 회주철의 캐비테이션 침식 부식을 방지하기 위해 무전해 니켈도금 후 다양한 온도와 시간으로 열처리를 실시하여 도금 층의 캐비테이션 침식 부식 특성을 평가하고자 하였다. 무전해 니켈코팅을 위한 모재는 회주철(FC250)을 $19.5mm{\times}19.5mm{\times}5mm$의 크기로 가공하였다. 도금조로 500mL 비커를 사용하였으며, 모든 시험편은 2시간 동안 무전해 니켈도금을 실시하였다. 그리고 캐비테이션 실험은 ASTM G32 규정에 의거하여 천연해수 내 $30^{\circ}C$에서 $50{\mu}m$의 진폭으로 실시하였다. 그 결과 열처리 적용 시 EN 도금의 표면경도가 현저히 증가하여 캐비테이션 침식 부식 저항성이 상당히 개선되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.