• Title/Summary/Keyword: 스퀴즈 효과

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Effect of Partial Squeeze on the Quality of Casting Products in the Vacuum Die Casting (진공다이캐스팅시 국부스퀴즈 효과가 주조품질에 미치는 영향)

  • 김억수;김성준;이광학;문영훈
    • Transactions of Materials Processing
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    • v.8 no.5
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    • pp.491-497
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    • 1999
  • The effect of partial squeeze on the quality of casting products in the vacuum die casting was investigated to make defect free casting products with excellent mechanical properties. The partial squeeze and vacuum die casting process was industrially implemented in making reaction shaft support which was made of a hypereutectic Al-15%Si alloy. To combine squeezing and vacuum effects, the plunger injection system was designed and attached on the chill vent type vacuum machinery system. The combination of vacuum effect before injection and partial squeezing effect after injection resulted in defect free die casting products. The uniform distribution of fine eutectic and proeutectic Si obtained from trial process also provided excellent mechanical properties.

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Electrostatic Suspension System of Silicon Wafer using Relay Feedback Control (릴레이 제어법을 이용한 실리콘 웨이퍼의 정전부상에 관한 연구)

  • Lee, Sang-Uk;Jeon, Jong-Up
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.10 s.175
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    • pp.56-64
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    • 2005
  • A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a DC voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4-inch silicon wafer was levitated stably with airgap variation decreasing down to $1 {\mu}m$ at an airgap of $100{\mu}m$.