• Archives of Reconstructive Microsurgery
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• v.2 no.1
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• pp.7-12
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• 1993

Traumatic loss of the fingers present significant functional disability and the index finger is an important component of hand function. Since 1900, many attempts and efforts have been done in reconstruction of amputated fingers with toes. Authors clinically analyzed 8 cases of toe-to-finger transfer in traumatic amputation of the index finger to be followed for more than one year at Korea University Hospital from August 1982 to December 1991. The results were as follows: 1. The most common cause of injury was mechanical accident in 7 of 8 cases. 2. Average interval between injury and operation was 8 year 3 months. 3. Average operation time was 5 hours 58 minutes and average ischemic time of transferred toe was 1 hour 52 minutes. 4. Skin flaps have survived in 7 of 8 cases, and the functional results in 6 of 8 cases were over than fair.

• Analytical Science and Technology
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• v.24 no.5
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• pp.336-344
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• 2011

The study attempted to find out any effect to prevent photo aging of epoxy resin used for conservation by way of adding UV stabilizer, one of plastic additives. Specimens were made by adding HALS and UVA UV stabilizer as each concentration to 3 kinds of epoxy resin, which are most frequently used for artifacts joining and restoration process, and aging effects were investigated through Color change, SEM, contact angle, FTIR analysis during UV aging experiments. Last, usage suitability was checked when UV stabilizer was added through Universal Tensile strength tester. In result, it is impossible to prevent decomposition of chemical structure in spite of adding UV stabilizer but in the case of epoxy A and R, it is believed that photo aging such as yellowing or crack can be minimized without giving a big influence to adhesive strength of epoxy resin through adding less than 0.1% of UVA. It is expected that above will solve photo aging problem of epoxy resin used for joining and restoration of artifacts and will extend its life as joining and restoration materials.

• Korean Chemical Engineering Research
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• v.50 no.3
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• pp.588-593
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• 2012

Compatibility of unsaturated polyester (UP) and low profile agent (LPA) of polystyrene (PS) have been investigated under various mixing conditions such as the ratio of UP and LPA, mixing time, mixing temperature, and input amount of 2nd UP. It was possible to obtain mixture with small particle size and low phase separation in condition of 35 g of LPA, 25 g of 1st UP input, 5 min of mixing time, 1700 rpm of mixing speed, and 45 g of 2nd UP input. It was found that compatibility of UP and LPA was very sensitive to mixing conditions. In addition, molded sample using sheet molding compound prepared by stable mixing condition appeared good properties such as low water adsorption, low shrinkage, and high gloss.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.4 no.2
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• pp.133-138
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• 2006

Chemical wastes containing small amounts of uranium can not be disposed of them after treatment as an industrial waste, because the uranium concentration in the final dry cake exceeds the exemption level. Especially for the removal of uranium in this study, the method for immobilizing Diphosil powder within alginate beads is adopted to make a bead form from a powdered resin. Sodium alginate bead itself showed a capability to uptake uranium to above 60%, but the value was decreased to below 30% after equilibrium. The adsorption rate of uranium increased with the increasing content of Diphosil in the sodium alginate bead. Diphosil resin itself showed very fast uptake of uranium from early stages, and then the rates were leveled off. Diphosil bead showed an improved capability to uptake uranium considering the pure Diphosil content in the composite bead, and provide a considerable potential for further applications of a continuous process by using Diphosil as a bead form.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.170-170
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• 2001

• Applied Microscopy
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• v.25 no.3
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• pp.82-89
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• 1995

High resolution transmission electron microscopic observations on quaternary $Zn_{1-x}Mg_{x}S_y$ $S_{1-y}$(x=0.13, y=0.16) on (001) GaAs substrate grown up to $1.2{\mu}m$ with 20nm ZnSe buffer layer at $300^{\circ}C$ by RIBER MBE system which has a single growth chamber were investigated by HRTEM working at 300kV with point resolution of 0.18nm. The ZnSe buffer layer maintains the coherency with the GaAs substrate. The stacking faults had begun at ZnSe buffer/$Zn_{1-x}Mg_{x}S_{y}S_{1-y}$ interface, whose length and spacing became larger than 60nm and wider than 40nm, respectively. The inverse triangular stacking fault was bounded by stacking faults which were formed on {111} planes with different variants. There exists rare stacking faults inside the triangular defect. The epilayer surrounded by the straight stacking faults, which had formed in the same direction, became the columnar structure.

• Polymer(Korea)
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• v.27 no.5
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• pp.493-501
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• 2003

Poly(methyl methacrylate) (PMMA) particles, denture base resin, were synthesized by suspension polymerization through control of polymerization conditions (stabilizer concentration, co-monomer concentration, and the agitation speed) and evaluated changes in molecular weight and particle size. We also investigated their mechanical properties of compression-molded samples which were from synthesized polymer powder mixed with methyl methacrylate (MMA) solution. under the condition of volumetric ratio as 2:1(PMMA powder and MMA solution). The results shows that the mechanical properties were mainly affected by particle size over 100 ${\mu}$m (in particle size) and by molecular weight under 100 ${\mu}$m (in particle size). From these results, we concluded that the most appropriate particle size of PMMA powder for heat-cured denture base resins is around 100 ${\mu}$m. and its molecular weight is around 300000 (M$\sub$n/).

• Fire Science and Engineering
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• v.31 no.6
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• pp.83-90
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• 2017

If an overcurrent exceeding the rated value is applied to an electric wire, the temperature of the electric wire increases, and the electric wire covering deteriorates to cause a short circuit. The upper limit temperature of the wire varies according to the magnitude of the overcurrent. When a short circuit occurs at each upper temperature limit, a cooling speed difference occurs during the solidification process due to the temperature difference between the short circuit temperature and the wire surface temperature. At this time, the pattern characteristics of the dendritic structure formed on the molten cross section are different. In this study, the upper temperature limit, which varied according to the overcurrent magnitude, was measured. At the time a short circuit occurred, the second branch spacing (dendrite Arm Spacing : DAS) of the dendrite was analyzed and the numerical value was quantified. The experimental results showed that the upper temperature limit increases with the magnitude of the overcurrent, and that the second branch spacing increases with increasing wire temperature.

• Korean Journal of Plant Taxonomy
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• v.44 no.2
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• pp.91-99
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• 2014

Leaf anatomical study of Pinus thunbergii collected from 12 different coastal regions of Korea was conducted to understand the adaptive variation on leaf traits. Basic anatomical features are typical pine needle type with fibrous epidermis, 2-3 layered hypodermis, sunken stomata, monomorphic mesophyll, and well-represented bundle sheath. The bundle sheath surrounds a couple of vascular bundle separated by parenchyma bands. On the basis of their position, the resin ducts are of three types; external, medial and internal of the bundle sheath. The total number of resin ducts in all samples varies from 4 to 12. The stomata were found on stomatal bands throughout the leaf surface. Important dissimilarities observed on P. thunburgii leaf are the number and position of resin ducts and the number of stomata rows in leaf surface.