• Title/Summary/Keyword: 소형 전자부품

Search Result 169, Processing Time 0.026 seconds

Life Prediction of Failure Mechanisms of the CubeSat Mission Board using Sherlock of Reliability and Life Prediction Tools (신뢰성 수명예측 도구 Sherlock을 이용한 큐브위성용 임무보드의 고장 메커니즘별 수명예측)

  • Jeon, Su-Hyeon;Kwon, Yae-Ha;Kwon, Hyeong-Ahn;Lee, Yong-Geun;Lim, In-OK;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.44 no.2
    • /
    • pp.172-180
    • /
    • 2016
  • A cubesat classified as a pico-satellite typically uses commercial-grade components that satisfy the vibration and thermal environmental specifications and goes into mission orbit even after undergoing minimum environment tests due to their lower cost and short development period. However, its reliability exposed to the physical environment such as on-orbit thermal vacuum for long periods cannot be assured under minimum tests criterion. In this paper, we have analysed the reliability and life prediction of the failure mechanisms of the cubesat mission board during its service life under the launch and on-orbit environment by using the sherlock software which has been widely used in automobile fields to predict the reliability of electronic devices.

Study on Development of Embedded HMI System for PLC Monitoring (PLC 모니터링을 위한 임베디드 HMI 시스템의 개발에 관한 연구)

  • Sun, Bok-Keun;Han, Kwang-Rok;Rim, Kee-Wook
    • Journal of the Institute of Electronics Engineers of Korea CI
    • /
    • v.42 no.4 s.304
    • /
    • pp.1-10
    • /
    • 2005
  • Recently, most of PLC has been using widely in automation equipment that is needed for field of industry automation. HMI is essential system for effective Control of many numbers of PLC. Even though early HMI system was consists of simple analog devices, however, HMI system could control or supervise PLC through display screen since it embeds various digital parts by development of technology in these days. HMI system consists of three parts as HMI hardware, an operating program for HMI equipment and a HMI screen editor. Among these elements, a Program for editing screen of HMI should provide various screen elements that helps users to edit each screens displayed on HMI. In this study, we design and implement screen edit program by object-oriented method for small HMI equipment and propose Prototype of embedded HMI system.

Conceptual Design of Electric-Pump Motor for 50kW Rocket Engine (50kW급 로켓 엔진용 전기펌프 모터의 개념 설계)

  • Kim, Hong-Kyo;Kwak, Hyun-Duck;Choi, Chang-Ho;Kim, Jeong
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.46 no.2
    • /
    • pp.175-181
    • /
    • 2018
  • Electric pump system is new technology for next generation propulsion unit. The system has simple structure which dose not need gas generator, injector and turbine and might better pump for low cost and low payload rocket. Therefore, this paper suggests conceptual design of electric-pump Permanent-Magnet Synchronous Motor (PMSM) which has 50 kW & 50,000 RPM for rocket. To satisfy the system's requirement, electromagnetic analysis is conducted for suitable inner and outer diameter of stator and rotor which uses 4000 Gauss cylinder magnet and Inconel 718 can to fix whole rotor. Futhermore, to confirm rotational vibration, rotordynamics analysis is conducted. By this analysis, Campbell diagram is printed. From the diagram, natural frequency could be determined for the only motor and dynamo meter test bench.

Thermal Analysis of the Heat Sink Performance using FEM (유한 요소법을 이용한 히트싱크의 성능평가를 위한 열해석 연구)

  • Lee, Bong-Gu;Lee, Min
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.15 no.9
    • /
    • pp.5467-5473
    • /
    • 2014
  • This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

Low Loss LTCC Materials in mm Wavelength Region with Use of Common Glass (공통 글라스를 이용한 mm 대역용 저손실 LTCC 소재)

  • Lee, Sung-Il;Yeo, Dong-Hun;Park, Zee-Hoon;Shin, Hyo-Soon;Hong, Youn-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.06a
    • /
    • pp.330-330
    • /
    • 2010
  • 이동통신 시스템의 소형화, 경량화, 다기능화 추세에 따라 이동통신 부품도 단위 부피당 소자의 집적도를 증가시키기 위하여 고집적화 추세로 급진전되고 있다. 이에 따라 세라믹 공정 기술도 고집적 추세로 다층화 되고 있어 수동소자의 내장화에 대한 필요성이 증대되고 있다. 이를 위하여 다양한 유전율 대역의 이종소재간 접합을 시도하지만 de-lamination, 내부 crack 등의 결함들이 발생하므로 열팽창계수 조절이 용이한 동종의 글라스를 사용하는 것이 유용하다. 본 연구에서는 공통의 글라스를 개발한 후 다양한 필러들을 혼합하여 mm파 대역에서 다양한 유전율을 갖는 LTCC 소재를 개발함으로써, 수동소자의 내장화에 따른 이종접합시의 매칭성을 극대화하고자 하였다. 이를 위하여 CaO-$Al_2O_3-SiO_2-B_2O_3$계 공통글라스에 $CaZrO_3$, $1.3MgTiO_3$, $2La_2O_3TiO_2$ 필러를 혼합하여 소결체의 미세구조, 유전특성 및 열기계적 특성을 고찰하였다. 이때 유전율 6에서 20에 이르는 저손실 소재를 개발할 수 있었다.

  • PDF

Constrained Sintering법에 의한 $Al_2O_3$/LTCC/$Al_2O_3$ 무수축 기판의 수축율 제어

  • Jo, Jeong-Hwan;Yeo, Dong-Hun;Sin, Hyo-Sun;Hong, Yeon-U;Kim, Jong-Hui;Nam, San
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.11a
    • /
    • pp.39-39
    • /
    • 2008
  • 이동통신 시스템의 소형화, 다기능화 추세에 따라 이동통신 부품들의 모듈화, 고집적화 추세로 급진전되고 있어, 고집적 세라믹 기판 모듈 제작을 위한 핵심공정 기술인 그린시트의 층간 정밀도 및 소성후 수축율 제어의 중요성이 증대되고 있다. 본 연구에서는 일축가압 이용한 PAS(Pressure Assisted Sintering) 법과 Al2O3를 희생층으로 이용한 Constrained Sintering법을 혼합하여 저온 동시소성 세라믹 기판의 x-y 축 수축율을 zero로 제어하고자하였다. $Al_2O_3$/LTCC/$Al_2O_3$인 샌드위치 구조로 세라믹 시트를 적층하여 Load 값과, LTCC 두께에 따른 x-y축, z축 소성 수축율 및 Edge Curvature의 Radius와 warpage 현상을 관찰하고, 이때 미세구조 및 밀도를 측정하였다. 그 결과 symmetic한 구조일 때 소성온도 $900^{\circ}C$에서 $Al_2O_3$ 두께가 $30{\mu}m$ 이상일 때 LTCC의 글라스가 $Al_2O_3$에 Infiltration 되는 두께는 $30{\mu}m$를 나타내었다. 또한 $Al_2O_3$ 두께 $500{\mu}m$, LTCC 두께 $2,000{\mu}m$, Load값이 800g/$cm^2$ 일 때 x-y 축 수축율<1%, z축 수축율 40%, 소결밀도는 2.99g/$cm^3$로 우수한 무수축 기판 특성을 나타내었다.

  • PDF

Unidirectional Sintering in LTCC Substrate (LTCC 기판의 일 방향 소결)

  • Sun Yong-Bin;Ahn Ju-Hwan;Kim Seuk-Buom
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.11 no.4 s.33
    • /
    • pp.37-41
    • /
    • 2004
  • As mobile communication devices use wide bands for large data transmission, Low Temperature Co-fired Ceramic(LTCC) has been a candidate for module substrate, for it provides better electrical properties and enables various embedded passive devices compared to conventional PCB. The LTCC, however, has applied in limited area because of non-uniform shrinkage. Hybrid heating was developed to raise sample temperature uniformly in a short period of time This leads to unidirectional sintering which enables sample to be sintered layer by layer from the bottom, resulting in more stable shape of interconnection at the top surface of the sample than conventional electric furnace heating. When sintering properties of substrate and electrical/mechanical properties of interconnection were compared, hybrid heating showed possibility to be applicable to substrate miniaturization and interconnection densification superior to electric furnace heating.

  • PDF

Building the Quality Management System for Compact Camera Module(CCM) Assembly Line (휴대용 카메라 모듈(CCM) 제조 라인에 대한 데이터마이닝 기반 품질관리시스템 구축)

  • Yu, Song-Jin;Kang, Boo-Sik;Hong, Han-Kook
    • Journal of Intelligence and Information Systems
    • /
    • v.14 no.4
    • /
    • pp.89-101
    • /
    • 2008
  • The most used tool for quality control is control chart in manufacturing industry. But it has limitations at current situation where most of manufacturing facilities are automated and several manufacturing processes have interdependent relationship such as CCM assembly line. To Solve problems, we propose quality management system based on data mining that are consisted of monitoring system where it monitors flows of processes at single window and feature extraction system where it predicts the yield of final product and identifies which processes have impact on the quality of final product. The quality management system uses decision tree, neural network, self-organizing map for data mining. We hope that the proposed system can help manufacturing process to produce stable quality of products and provides engineers useful information such as the predicted yield for current status, identification of causal processes for lots of abnormality.

  • PDF

Development of Compact and Lightweight Broadband Power Amplifier with HMIC Technology (HMIC 기술을 적용한 소형화 경량화 광대역 전력증폭기 개발)

  • Byun, Kisik;Choi, Jin-Young;Park, Jae Woo
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.19 no.11
    • /
    • pp.695-700
    • /
    • 2018
  • This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

Study on the Thermal Radiation Performance of the Multi-functional Structure Made of the Carbon Fiber Composite Material (탄소섬유 복합재를 이용한 위성용 다기능 구조체의 방열성능 분석)

  • Kim, Taig-Young;Hyun, Bum-Seok;Seo, Young-Bae;Jang, Tae-Seong;Seo, Hyun-Suk;Lee, Jang-Joon;Kim, Won-Seock;Rhee, Ju-Hun
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.40 no.2
    • /
    • pp.157-164
    • /
    • 2012
  • The design strategy of the multi-functional structure is that the electrical components and the circuits are directly put on their supporting structural panel in which the radiation shields and the thermal control functions are integrated. Applying the multi-functional structure reduces the total mass and size of the space system and makes it possible to lower launch cost. In present study the performance of thermal radiation for six types of multi-functional structure are investigated by the numerical method. The effect of the rib configuration on heat transfer for the multi-functional-structure is not important alone but is meaningful considering with the structural stiffness, difficulty of manufacturing and mass increase. In heat spreading point of view, the thickness of the outer conductive layer is important rather than the rib configuration and the trade-off study with the mass and thickness is required for optimum design.