• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.79-82
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• 2003

GaN nanoparticles were synthesized by the pulsed laser deposition (PLD) process on $SiO_2$substrate after irradiating the surface of the GaN sintered pellet by the ArF (193 nm) excimer laser. At this moment Ar gas pressure of 100 Pa, 50 Pa, 10 Pa and 1 Pa were applied during the ablation process and laser power of 100 mJ and 200 mJ were also applied. The synthesized fan nanoparticles were characterized by XRD, SEM, TEM, XPS and optical absorption spectra. The synthesized GaN nanoparticles had the crystallite sizes of 20~30 nm, and besides, GaN nanoparticles synthesized under low Ar gas pressure compared to the others corresponded with stoichiometry, and the optical band edge of the GaN nanoparticles was blueshifted.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.15-24
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• 2014

Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, has generated intensive interest in the application of flexible and wearable electronic devices. However, the actual use of printing technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practical drawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivity of the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage of polymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma, ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymer substrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. The advantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.

• Journal of the Korean Ceramic Society
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• v.31 no.2
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• pp.129-136
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• 1994

Si3N4 with 6w/o Y2O3 and 1.5w/o Al2O3 has been gas pressure sintered and its densification behavior and the effect of the sintering variables on the microstructure and mechanical properties were investigated. Densification rate was higher at temperature below 1775$^{\circ}C$ and between 187$0^{\circ}C$ and 195$0^{\circ}C$ than between 1775$^{\circ}C$ and 187$0^{\circ}C$. The faster densification at temperature between 187$0^{\circ}C$ and 195$0^{\circ}C$ was thought to be due to the increased amount of liquid phase resulting from the increased amount of Si3N4 dissolving in the liquid. $\beta$-Si3N4 and Y-disilicate at temperatures below 1775$^{\circ}C$, and only $\beta$-Si3N4 at 187$0^{\circ}C$ and above were detected by XRD analysis. Three different two-step schedules were employed to obtain sintered body with above 99% theoretical density and to investigate the effect of the sintering variables on the density, the microstructure and the mechanical properties of the sintered body. The sintered density did not change with the heating rate, and the microstructure became coarser as the temperature increased. The strength decreased with the width of $\beta$-Si3N4 grain, while the fracture toughness increased with the square root of it. A ceramic cutting tool made of the sintered body showed an uniform flank wear after the cutting test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.330-330
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• 2010

이동통신 시스템의 소형화, 경량화, 다기능화 추세에 따라 이동통신 부품도 단위 부피당 소자의 집적도를 증가시키기 위하여 고집적화 추세로 급진전되고 있다. 이에 따라 세라믹 공정 기술도 고집적 추세로 다층화 되고 있어 수동소자의 내장화에 대한 필요성이 증대되고 있다. 이를 위하여 다양한 유전율 대역의 이종소재간 접합을 시도하지만 de-lamination, 내부 crack 등의 결함들이 발생하므로 열팽창계수 조절이 용이한 동종의 글라스를 사용하는 것이 유용하다. 본 연구에서는 공통의 글라스를 개발한 후 다양한 필러들을 혼합하여 mm파 대역에서 다양한 유전율을 갖는 LTCC 소재를 개발함으로써, 수동소자의 내장화에 따른 이종접합시의 매칭성을 극대화하고자 하였다. 이를 위하여 CaO-$Al_2O_3-SiO_2-B_2O_3$계 공통글라스에 $CaZrO_3$, $1.3MgTiO_3$, $2La_2O_3TiO_2$ 필러를 혼합하여 소결체의 미세구조, 유전특성 및 열기계적 특성을 고찰하였다. 이때 유전율 6에서 20에 이르는 저손실 소재를 개발할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.39-39
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• 2008

이동통신 시스템의 소형화, 다기능화 추세에 따라 이동통신 부품들의 모듈화, 고집적화 추세로 급진전되고 있어, 고집적 세라믹 기판 모듈 제작을 위한 핵심공정 기술인 그린시트의 층간 정밀도 및 소성후 수축율 제어의 중요성이 증대되고 있다. 본 연구에서는 일축가압 이용한 PAS(Pressure Assisted Sintering) 법과 Al2O3를 희생층으로 이용한 Constrained Sintering법을 혼합하여 저온 동시소성 세라믹 기판의 x-y 축 수축율을 zero로 제어하고자하였다. $Al_2O_3$/LTCC/$Al_2O_3$인 샌드위치 구조로 세라믹 시트를 적층하여 Load 값과, LTCC 두께에 따른 x-y축, z축 소성 수축율 및 Edge Curvature의 Radius와 warpage 현상을 관찰하고, 이때 미세구조 및 밀도를 측정하였다. 그 결과 symmetic한 구조일 때 소성온도 $900^{\circ}C$에서 $Al_2O_3$ 두께가 $30{\mu}m$ 이상일 때 LTCC의 글라스가 $Al_2O_3$에 Infiltration 되는 두께는 $30{\mu}m$를 나타내었다. 또한 $Al_2O_3$ 두께 $500{\mu}m$, LTCC 두께 $2,000{\mu}m$, Load값이 800g/$cm^2$ 일 때 x-y 축 수축율<1%, z축 수축율 40%, 소결밀도는 2.99g/$cm^3$로 우수한 무수축 기판 특성을 나타내었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.391-392
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• 2008

최근 나노 금속의 대량 생산에 대한 기술이 확보됨에 따라, 메탈젯을 이용한 연구가 활발히 진행되고 있다. 메탈젯의 연구 범위는 RFID, PCB, MLCC 전극, 태양전지전극, PDP 전극, EMC용재료 등 그 응용 범위를 넓혀 가고 있다. 이러한 응용 기술 대표적인 배선형성 기술인 PCB 제조에 대한 연구는 40um 이하의 고해상도 기판 개발을 요구하고 있다. 선폭은 40um 이하를 유지하면서, 두께는 10um 이상으로 CCL을 대체 하기 위한 기판 형성 기술은 응용기술은 가장 어려운 난이도의 기술이다. 메탈젯 기술은 매우 복합적인 연구분야로 나노 재료의 개발, 인쇄공정의 개발, 기재 표면처리 기술, 헤드 기술의 개발을 동시에 만족할 때 가능하다. 배선 형성을 위하여 나노 잉크를 이용하여 직접 인쇄를 진행하고, 소결하여 전도성을 얻게 된다. 본 연구에서는 미세노즐에 토출 가능한 잉크젯용 잉크 조성을 결정하고, 기판과의 신뢰성을 확보하기 위하여 접착력의 평가, 전도도의 평가, 건조 시간 조절을 통한 Crack 문제 해결, 미세 선폭의 균일성 조절에 관한 실험을 진행하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.2
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• pp.169-177
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• 2015

Because technology of the sintering process is highly advanced, the gerotor used in the internal gear pumps of vehicles has advantages for manufacturing complex profiles and obtaining durability and minimization. However, it has been necessary to continuously improve the flow rate and noise of internal gear pumps for better fuel efficiency. The existing rotor was designed using a translation algorithm. This caused a discontinuity of the rotor profile, which had adverse effects on the performance. In this study, to improve the discontinuity of the profile, a new design program using a rotation and translation algorithm was developed, and two types of combined multiple profiles (three-ellipses and ellipse 1-involute-ellipse 2) were generated. Then, the performances (flow, flow rate, specific sliding, and pressure angle) of these profiles were calculated. On the basis of the calculation results for the performances, optimal designs of the two types were carried out and verified by comparing their performances with those of the existing rotor profiles.

• Journal of the Korean Society for Railway
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• v.13 no.4
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• pp.389-395
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• 2010

This paper is about the copper slider with high electric conductivity and resistance arc. A new copper slider which has enhanced resistance against frictional wear was developed. By alteration of its material components and manufacturing process, its material property has been enhanced. To verify its enhanced wear-resisting capacity, a laboratory test and a field test were carried out. As the laboratory test, a dynamo test was performed and its test result showed that the developed new copper slider had superior wear-resisting capacity to the currently used copper slider. The new one showed double durability of the current one and normal wearing characteristics. A filed test was performed on the Metro subway lines at service by Seoul Metro. The field test showed similar results to those from the laboratory test, which the d eveloped new copper slider has double superior durability and sound wearing patterns. Authors strongly believe that the replacement of the copper slider currently in use by the developed new one will contribute to the economic and efficient operation of the subway line system

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.5
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• pp.559-566
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• 2014

Plasma coatings have been conducted to improve the mechanical properties of thermal resistance, wear resistance, corrosion resistance and thermal shock with respect to Great-Bar which is used as a carrier device for ironstone sintering under $700^{\circ}C$. The surface coatings on the upper side of the Great-Bar exposed on extreme environments of high temperature, severe wear, corrosion and thermal shock extended the life time due to the barrier coating layer. $Al_2O_3$, $Cr_2O_3$, WC coatings were applied to Great-Bar and their mechanical and chemical properties are analyzed by several experimental tests such as thermal resistance, wear resistance, corrosion resistance and thermal shock resistance. It shows excellent advantages with respect to wear, thermal shock and corrosion.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.1
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• pp.25-32
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• 2020

Generally, high-temperature, high-pressure, high-priced sintering equipment is used for diamond sintering, and conductivity is a problem for improving the surface modification of the sintered body. In this study, to improve the efficiency of diamond sintering, we identified a new process and material that can be sintered at low temperature, and attempted to develop a composite thin film that can be discharged by doping boron gas to improve the surface modification of the sintered body. Sintered bodies were sintered by mixing Si and two diamonds in different particle sizes based on CIP molding and HIP molding. In CVD deposition, CVD was performed using WC-Co cemented carbide using CH₄ and H₂ gas, and the specimen was made conductive using boron gas. According to the experimental results of the sintered body, as the Si content is increased, the Vickers hardness decreases drastically, and the values of tensile strength, Young's modulus and fracture toughness greatly increase. Conductive CVD deposited diamond was boron deposited and discharged. As the amount of boron added increased, the strength of diamond peaks decreased and crystallinity improved. In addition, considering the release processability, tool life and adhesion of the deposition surface according to the amount of boron added, the appropriate amount of boron can be confirmed. Therefore, by solving the method of low temperature sintering and conductivity problem, the possibility of solving the existing sintering and deposition problem is presented.