• Korean Journal of Optics and Photonics
• /
• v.23 no.5
• /
• pp.217-221
• /
• 2012

In this paper, we have fabricated by means of the "Micro-Block Stacking (MBS)" method the 8 pin mini DIL integrated Triplexer, which can transmit CATV and voice/data at the same time in a single fiber. Our MBS technique is a novel scheme of compact optical module packaging which secures precision positioning of the components on the optical beam path by prefixed stacks of ceramic blocks. The subassembly in which a laser diode, two receiver photodiodes, two WDM filters, and four micro lenses are integrated is only $5.40mm{\times}2.15mm{\times}1.05mm$ in size. As the Triplexer is aligned to the single mode fiber, the transmitter power of -14.5 dBm and the receiver sensitivities of 0.83 A/W, 0.73 A/W for 1550 nm, 1490 nm, respectively are obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.325-325
• /
• 2008

스크린 프린팅에 의한 압전 후막은 MEMS 공정을 이용하여 마이크로 펌프, 마이크로 벨브, 마이크로 센서, 마이크로 로봇 등 여러 초소형 기계부품에 응용되고 있으며, Sol-Gel, PLD를 이용해 증착된 막 등에 비해 수십${\mu}m$의 비교적 두꺼운 막을 형성시킬 수 있는 장점을 가지고 있다. 그러나 실리콘 기판을 사용하여 스크린 프린팅으로 형성된 압전 후막의 경우, 공정상 바인더를 연소시키는 과정을 거치게 되므로, 밀집된(Dense) 구조를 가지는 막을 만들기가 어렵다. 이로 인해 스크린 프린팅에 의한 후막은 전기적 특성 및 기계적 특성이 떨어지는 경향이 있다. 본 연구에서는 스크린 프린팅에 의한 압전 후막의 밀집된 구조 및 특성을 향상시키기 위해 0.01Pb$(Mg_{1/2}W_{1/2})$O3-0.41Pb$(Ni_{1/3}Nb_{2/3})O_3-0.35PbTiO_3-0.23PbZrO_3$의 powder와 Attrition 밀링 처리된 powder를 비율별로 혼합하여 입자의 크기를 변화시켜 막의 충진 밀도를 향상시켰으며, 열처리 효과를 극대화시키기 위해 RTA(Rapidly Thermal Annealing)를 통해 열처리 하였다. Attrition 밀링에 의한 파우더를 각각 비율별로 100%, 50%, 25%로 혼합하여 만든 압전 세라믹 페이스트는 P-type(100)Si Wafer sample 위에 $1{\mu}m$의 하부전극용($1100^{\circ}C$) Ag 전극을 screen print하여 소결했다. 그리고 다시 전극이 형성된 Si wafer 위에 스크린 프린팅하고, 건조 한 후 RTA로 300초 동안 열처리 한 결과 밀집된 구조를 가지는 압전 후막을 제작 수 있었다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.12 no.4
• /
• pp.1509-1514
• /
• 2011

The core of IT products, electronic components, especially the MLCC, chip inductors, chip Varistors and so on. In order to test the electrical characteristics of the chip using the Reno-pin contact test method has been used. In current chips, mass production of semiconductor manufacturing processes, high-speed production test for the chip speed up, precision is required. But Vibration displacement is a very short, so in order to overcome these shortcomings, the displacement amplification to design the structure has been actively studied. In this paper, a building structure with a flexible hinge was designed amplification instrument, semiconductor chip industry in the performance test and inspection equipment to measure the electrical characteristics of high speed linear actuators Reno-Pin using system was developed.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.2
• /
• pp.13-20
• /
• 2023

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.2
• /
• pp.141-147
• /
• 2024

The measurement of strain under an electric field has been widely employed to comprehend the fundamental principles of electro-mechanical responses in ferroelectric, piezoelectric, and electrostrictive materials. In particular, understanding the strain properties of piezoelectric materials in response to electrical stimulation is crucial for researching and developing components such as piezoelectric actuators, acoustic devices, and ultrasonic generators. This tutorial paper introduces the components and operational principles of the linear variable differential transducer (LVDT), a widely used displacement measurement device in various industries. Additionally, we present the configuration of an experimental setup using LVDT to measure the strain characteristics of ferroelectric, piezoelectric, or electrostrictive materials under the application of an electric field. This paper includes simple measurement results and analyses obtained through the LVDT experimental setup, providing valuable information on research methods for the electro-mechanical interactions of various materials.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.21 no.6
• /
• pp.618-629
• /
• 2001

This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective root cause failure analysis. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal cycling test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which might cause electrical short in underlying circuitry, can occur during curing or thermal cycle. The results can be conveniently used to quickly identify defective lots, determine $B_{10}$ life estimation each lot at the level of inspection, and detect major changes in the vendors processes. Also, the condition for dielectric breakdown was investigated for the estimation of failure rate with load-strength interference model.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.26 no.10
• /
• pp.841-850
• /
• 2015

With the rapid progress of electronics and radio communication technology, human enjoys greater freedom in information communication. However, EMW(Electro-Magnetic Wave) environments have become more complicate and difficult to control. Thus, international organizations, such as the American National Standard Institution(ANSI), Federal Communications Commission(FCC), the Comite Internationale Special des Perturbations Radio Electrique(CISPR), etc, have provided standard for controlling the EM wave environments and for the countermeasure of the electromagnetic compatibility(EMC). In this paper, fabrication of the smart EMW absorber which has heat radiating function and high performance absorption abilities were suggested. Furthermore, we prospected future smart EMW absorbers. The designed smart EMW absorber is fabricated following process. Firstly, we applied high temperature heat treated to a mixture of Iron-oxide($Fe_2O_3$) and ceramics. Secondly, we applied low temperature heat treated to the mixture of heat treated material and a carbon material. Lastly, we made apertures on the absorber. The designed smart EM wave absorber has the absorption ability of more than 20 dB from 2 GHz to 2.45 GHz band, respectively. Thus, it is respected that these results can be applied as various EMC devices in electronic, communication, and controlling systems.

• Korean Journal of Materials Research
• /
• v.4 no.6
• /
• pp.651-661
• /
• 1994

Utilizing Mechanical Alloy Process, that were obt,ained the results from investigated formation process of AC4A/$SiC_p$. composite material powders and mechanical properties of their extrusion materials. The obtained results are as follow conclusions. AC4A-lOwt.% $SiC_p$ powders which were mechanically alloyed at 150rpm for 420min have been obtained finely and uniformly rounded powder particals that were reached the steady state which was saturated micro hardness about tlv 230 in the range size of 1 0 ~ 2 0$\mu \textrm{m}$. EDAX analysis tests have been resulted in a little amount of I'e conrents increasing with MA times, the artifical aging of AC4A/S$SiC_p$ composite materials was obtained the hardness with solution treated at $525^{\circ}C$ for lOhrs the maximum value of Hv 230 with aging at. $170^{\circ}C$ for 1000min. The Intensity and width of X-ray diffraction pattern were decreasing and widening because of grain boundary refinement and heterogeneous strain during mechanical alloying. Tensile tests at room temperature were carried out the maximum value of 37 Kgf/$\mu \textrm{mm}^2$ with ext,rused materials, 27 Kgf/$\mu \textrm{mm}^2$ with heat treated them at $500^{\circ}C$.

• International Journal of Highway Engineering
• /
• v.13 no.4
• /
• pp.159-166
• /
• 2011

Green house gas emissions are increasing as development of the industrial economy of the international community. Many countries in the world are endeavoring to reduce green house gas emissions under severe climate change. In order to protect grobal warming, government is trying to reduce green gas emissions under "Low Carbon Green Growth Policy" and investing climiate-firendly industries such as renewable energy harvesting. Renewable energy has been rapidly developing as a result of investment for development technology of using natural energy such as solar, wind, tidal, etc. There are lots of waste energy in the road space. However, nobody is not interested in waste energy from the road space. This paper present a fundamentally experimental study of energy harvesting technique to use waste energy in the road. The waste energy in the road is covered a pressure and impact of vehicles on the road, the radiant heat from asphalt pavement, road noise and vibration etc. In this study, an energy harvesting device using piezoelectric element is proposed and various tests are conducted to investigate a characteristic of this device as function of impact loading based on piezoelectric effect behavior. This paper shows the energy harvesting results of the device using domestic piezoelectirc element as a function of impact load size and pavement types.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.43-48
• /
• 2007

This study is focused on the effect of the surface properties for the post electrode, which is used in pad formation consisted of SMT such as IC, passive component, combined with fired LTCC substrate, We carried out the surface microstructure of sintered electrode and the basic reliability evaluations with sample fired by microwave sintering to solve the problems occurred in post electrode by electric sintering. We evaluated surface densification status of post electrode according to various conditions of microwave sintering. In additions, it is obtained strong effect on blister improvement of post electrode because of over-sintering and the insufficient out gas in bum out process. As a result of adhesion strength, we confirmed $44.3N/mm^2$ in microwave sintering and $34.5N/mm^2$ in electric sintering, respectively. This result will be used for the basic reliability test. Finally, microwave sintering seems to be economic in process time with 30 min compared to electric sintering with 10 hr. In terms of Mass production and efficiency, microwave sintering are excepted to be higher than electric sintering.