• 한국세라믹학회지
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• 제51권4호
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• pp.312-316
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• 2014

The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.

• 한국세라믹학회지
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• 제20권1호
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.1-7
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• 2011

Active brazing of ceramic to metal is reviewed in this paper. As one of the key aspect in joint techniques, active brazing has been developed to simplify the manufacturing procedure of brazed joints between ceramic and metal. The active filler metal includes Ag-Cu-Ti series, Cu-Ti series, Co-Ti series and so on. The active filler metal which supplies the chemical bonds between ceramic and metal, enhances the wetting of filler metal on ceramic surface and eliminates the need for metallization treatments. The residual stress caused by difference of coefficient of thermal expansion between ceramic and metal, holds a direct influence on the bonding strength and even results in a fracture. Good joints of ceramic to metal promote the miniaturization and simplicity of electronic components with multifunction.

• 한국세라믹학회지
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• 제39권10호
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• pp.955-962
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• 2002

활성 금속 브레이징법의 공정변수인 브레이징 온도 및 시간의 변화가 Cu buffer layer를 사용한 $Si_3N_4$Stainless steel 316 접합체의 기계적 특성 및 신뢰도에 미치는 영향을 규명하기 위하여 브레이징 조건 변화에 따른 접합계면 미세구조 변화를 조사하였다. 900${\circ}C$ 이상의 온도에서 브레이징 된 접합체에서는 Cu buffer layer가 브레이징 합금에 용해되어 연속 Cu층을 유지하지 못하였으며, $Si_3N_4$/brazing alloy 계면에서 계면 반응물 층의 두계도 급격히 증가하였다. 950${\circ}C$에서 브레이징된 Cu buffer layer를 사용한 $Si_3N_4$/Stainless steel 316 접합체의 파괴강도는 접합체 내 잔류응력의 증가로 급격히 감소하였다. 950${\circ}C$ 이하의 온도에서 브레이징 시간의 변화는 Cu buffer layer를 사용한 $Si_3N_4$/Stainless steel 316 접합체의 파괴강도 및 파괴경로에 큰 영향을 미치지 못하였다.

• 대한기계학회논문집B
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• 제34권3호
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• pp.317-324
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• 2010

고체산화물연료전지의 상용화를 위해서 금속지지체형 고체산화물연료전지가 개발되었다. 이 연료전지는 기계적강도를 향상시킨 새로운 개념의 연료전지지만 접합층으로 인해 물질전달률이 감소한다. 본 논문에서는 전산해석을 이용하여 연료극지지체형 고체산화물연료전지와 금속지지체형 고체산화물연료전지의 물질전달율을 비교하고자 한다. 지배방정식, 전기화학반응, 세라믹 물성치 모델이 동시에 해석된다. 그리고 다공성 매질 내부의 물질전달 해석을 위해서 분자확산과 누센확산이 함께 고려된다. 전산해석의 검증을 위해서 실험결과와 해석결과를 비교한다. 금속 지지체형 고체산화물 연료전지의 평균 전류밀도가 연료극지지체형 고체산화물연료전지에 비해 약 23% 감소한다. 그러나 접합층으로 인해 금속지지체형 고체산화물연료전지가 더 균일한 전류밀도 분포를 가진다.

• 한국세라믹학회지
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• 제33권12호
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• 한국세라믹학회지
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• 제18권2호
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• pp.99-104
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• 1981

Glass-ceramics possessed a number of characteristics which suggested their suggested their use for sealing to metals. The choice of particular glass-ceramics compositions for this application is governed by various factors, including workability of the glasses, thermal expansion characteristics and the matching of these to appropriate metals. Other properties, such as mechanical strength, determined the performance of glass-ceramics to metal seals. The purpose of the present study was to investigate direct sealing behaviour of copper to $Li_2O-ZnO-SiO_2$ system glass-ceramics. The design of the seal was a concentric seal which might contribute to the strong bond formation by providing compressive stress during thermal excursions. Tensile strengths of sealing layers were measured by Instron test machine. The layers were examined by electron probe microanalyzer. Crsystallization rate was increased with the amount of ZnO or $Li_2O$, and ZnO increased the sealing strength, but $Li_2O$ lowered it. Sealing mechanism was due to the formation of metal oxides, which acted as binder between copper and glass-ceramics. The nickle-plated copper seal with 10% $Li_2O$ and 30% ZnO was the most strong seal, and its sealing strength was more than 56kg/$\textrm{cm}^2$.

• Journal of Welding and Joining
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• 제13권3호
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of Welding and Joining
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• 제15권6호
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• pp.96-104
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• 1997

The present study was aimed to correlate the microstructure and the hardness as well as the wear resistance of the metal-ceramic particulated composite layer on the pure Al plate. The composite layers were constructed by the addition of TiC particles on the surface of Al-Cu alloyed layers by PTA overlaying process. Initially, the Al-Cu alloyed layers were achieved by the deposition of Al-(25 ~ 48%) Cu alloys on the pure Al plate by TIG process. It was revealed that TiC particles were uniformly dispersed without any reaction with matrix in the composite layer. The volume fraction of TiC particles (TiC V F) increased from 12% to 55% with increasing the number of pass of composite layer. Hardnesses of (Al-48%Cu + TiC (3&4layers)) composite layer were Hv450 and Hv560, respectively, due to the increase of TiC V/F. Hardnesses of (Al-Cu + TiC) composite layers decreased gradually with insreasing temperature from 100$^{\circ}$C to 400$^{\circ}$C, and hardnesses at 400$^{\circ}$C were then reached to 1/5 - 1/10 of room temperature hardness depending on the construction of composite layers. The Specific wear of (Al + Tic) layer and Al-48%Cu alloyed layer decreased to 1/10 of the of pure Al, while the specific wear of (Al-48%Cu + TiC (4 layers)) composite layer exhibited 1/15 of that of steel such as SS400 and STS304.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.709-713
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• 1996

The ceramic has such high qualities as light weight, abrasion resistance, heat resistance compared with metal, but since it is breakable, it can't be used as structural material and it is desirable to joining metal which is full of toughness, but, according as the ceramic/metal joint is executed at high temperature, the joint residual stress develops near the joint sides in the process of cooling the high temperature down to the suitable temperature due to difference of the thermal expansion coefficient between ceramic and metal, and the joint residualstress lowers the fracture strength. In this study, to ensure security and improvement of bending strength, 1 studies on see distribution shape of residual stress according to high thermal cycle, and the influnence of theraml cycle and distribution shape of residual stess on joint-strength.