• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• Membrane Journal
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• v.26 no.1
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• pp.26-31
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• 2016

Polycaprolactone (PCL) has been fabricated into the membrane type scaffolds of 3 dimensional pore network for the tissue engineering applications by the blade method of salt (NaCl) leaching and solution casting. In this study, the experimental designs have each conditions of drying temperature, salt particle size, salt content. The modified dispensing pump connected up to homogenizing mixer system is used for mixing the $PCL/CHCl_3$ solution and NaCl particles. The membrane fabricated use by the film applicator to poured mixed solution on the glass plate. The great pore by NaCl particles and the small pore by the evaporated $CHCl_3$ in the frame wall of great pores are multiply formed in membrane scaffolds.