• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.7
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• pp.753-759
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• 1992

For the fabrication of the microscale memory or electrical devices, Langmuir-Blodgett(LB) method is the most possible candidate. N-Alkylquinolium-TCNQ compounds were synthesized. The structure of the compounds were identified by the NMR spectroscopy and the purity were checked to be good by the elemental analysis. The surface pressure($\pi$) was measured at the air-water interface. The isotherm showed two transitions at 30mN/m and 45mN/m. The LB films were deposited by the home-made Kuhn type apparatus. The transfer ratio($\tau$) of the deposition was more than 0.95 for the up-stroke and less than 0.4 for the down-stroke. The absorbance peaks of the LB films appear at around 420nm and 700-820nm.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.37-37
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• 2008

고온에서 안정적인 DLC막을 성막하기 위해 PECVD공정에서 실리콘을 첨가하여 제조하였다. 기존의 실리콘첨가 DLC막과는 다르게 고온에서 생성됨으로 마이크로 클러스터 형태의 DLC구조로서 disordered 영역이 넓게 존재하고 있어 I(D)/I(G)비에서의 변화가 있는 것이 관찰되었다. 실리콘 양이 증가할수록 값이 낮아지는 것이 관찰되는데 이는 실리콘량이 증가하면서 수소의 위치에 실리콘이 결합하면서 sp3 단일구조형태의 코팅 막을 만드는 것이 관찰된다. 고온 어닐링효과로 내부구조에서 다량의 sp2구조가 관찰되는 것으로서 DLC막이 어느 정도 흑연화되지만, 실리콘이 SiC에서 SiOx로 $SiO_2$와 SiOH막으로 바뀌는 면서 마찰계수가 낮은 DLC막을 유지할 것으로 기대되며, XPS와 FT-IR분석에 의해 이러한 상들의 존재를 관찰할 수 있었다. 특히 공정상 TMS이 증가하면 첨가된 Si에 의해 형성되는 막이 초기부터 OH기를 다량 포함하고 있는 것을 알 수 있었고, 온도 상승에 의해서 실리콘표층에 더욱 많은 SiOx계열의 물질이 생성되는 것이 명확하게 발견되었다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1876-1877
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• 2005

유기 전기 발광 소자(Organic Light-emitting Devices, OLEDs)의 발광 효율과 안정성을 향상시키고자 플라즈마 중합 장비를 이용해서 소자에 버퍼층(buffer layer)을 도입하였다. 플라즈마 중합 방법을 이용해서 성막된 PPMMA를 ITO와 정공 수송층 사이에 버퍼층으로 삽입하여 유기 전기 발광 소자를 제작하였고, 그 특성에 대하여 연구하였다. 기존에 사용되고 있는 버퍼층 공정에 비하여 공정의 단순화 및 비용절감의 효과를 기대할 수 있고, 전기-광학적 특성도 확인할 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.207-208
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• 2012

GZO( Ga-doped ZnO) 및 ZTO (zinc tin Oxide) 박막을 DC, RF magnetron sputtering 공정을 이용하여 증착한 후, 대기 및 진공상태에서 200, $300^{\circ}C$ 조건으로 30분 동안 열처리하였다. ZTO/GZO 박막의 전기적 특성은 ZTO 층과 GZO 층의 두께 비에 의존함을 확인 할 수 있었다. 본 연구에서는 GZO단일 박막과 ZTO/GZO double layer 박막의 열처리 온도에 따른 구조적, 전기적, 광학적 특성을 비교검토 하였다.

• Journal of the Semiconductor & Display Technology
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• v.9 no.3
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• pp.11-16
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• 2010

The performance of an OLED fabrication system strongly depends on the design of the evaporation cell-source. Therefore, necessity of the preceding study for cell source development of new concept is becoming increase. A development plan to substitute for experiment is applied as use simulation. In this study interpret behavior of a particle through DSMC techniques, and in this paper presenting a form to make so as to have better performance of the pointtype cell source which had a nozzle.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.117-121
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• 2010

The composite films were fabricated by air-spray method under the 2 kgf/$cm^2$ pressure using the multi-walled CNTs solution and the nitrocellulose on a 10 ${\mu}m$ polyimide film substrates. We obtained the composite films which were sprayed with the MWCNT dispersion by varying the spray time from 20, 40 and 60sec. The electrical and the optical properties of the sandwiched-structure-composite thin films were investigated by an UV/VIS spectrometer and a Hall Effect equipment. As a result, the optical transmittance of all thin films in the visible range, as well as the electrical conductance shows an available value for the transparent electrode. The carrier concentration and the light transmittance rate for the fabricated sample are between $3.733{\times}10^{10}$ and $6.551{\times}10^{14}cm^{-3}$, around 35 to 95%, respectively.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.80-83
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• 2000

In this work we deposited Pentacene thin film by OMBD at the various substrate temperatures, deposition rate and the various annealing temperatures for the fabrication of organic TFT and investigated the electrical and film surface characteristics such as sheet resistance, contact resistance and conductance Film thickness were measured by $\alpha$-step and the sheet resistance, contact resistance and conductance were extracted from the relation between the distance of the contacts and the resistance. During the film deposition the substrate temperature was held at 3$0^{\circ}C$, 4$0^{\circ}C$, 5$0^{\circ}C$, 6$0^{\circ}C$, 8$0^{\circ}C$ and 10$0^{\circ}C$, respectively. After the film deposition, Au contact was deposited by thermal evaporation. For the effect of annealing, the thin film was annealed in the nitrogen environment at 10$0^{\circ}C$ and 14$0^{\circ}C$ for 10 seconds, respectively. Film surface characteristics at the vatious substrate temperatures were measured by AFM. The crystallization of thin film was improved as the substrate temperatures were increased and the maximum gram size was 4${\mu}{\textrm}{m}$. The conductivity of thin film was found to be 7.40 $\times$10$^{-7}$ ~ 7.78$\times$10$^{-6}$ S/cm and the minimum contact resistance was 2.5324 ㏁.

• Journal of the Korean Applied Science and Technology
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• v.25 no.3
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• pp.388-394
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• 2008

본 논문에서는 용액 공정을 이용한 고분자 절연층을 갖는 top-gate 구조의 펜타센 박막 트랜지스터(Thin Film Transistor, TFT)의 특성을 연구하였다. Top-gate 구조의 펜타센 TFT 제작에 앞서 유기 반도체인 펜타센의 결정성 성장을 돕기 위해서 가교된 PVP (cross-linked poly(4-vinylphenol))를 유리 기판 상에 스핀 코팅을 이용하여 형성한 후, 노광 공정을 통해 니켈/은 구조를 갖는 채널 길이 $10{\mu}m$의 소오스, 드레인 전극을 형성하였다. 그리고 열 증착을 이용하여 60 nm 두께의 펜타센 층을 성막하였고, 고분자 절연체로서 PVA(polyvinyl alchol) 또는 가교된 PVA를 용액공정인 스핀 코팅을 이용하여 형성한 후 열 증착으로 알루미늄 게이트 전극을 성막하였다. 이로써 제작된 소자들의 전기적 특성을 확인한 결과 가교된 PVA를 사용한 펜타센 TFT 보다 PVA를 게이트 절연체로 사용한 소자가 전기적 특성이 우수한 것으로 관찰되었다. 이는 PVA의 가교 공정에 의한 펜타센 박막의 성능 퇴화에 기인한 것으로 사료된다. 실험 결과 $0.9{\mu}m$ 두께의 PVA 게이트 절연막을 사용한 top-gate 구조의 펜타센 TFT의 전계 효과 이동도와 문턱전압, 그리고 전류 점멸비는 각각, 약 $3.9{\times}10^{-3}\;cm^2/Vs$, -11.5 V, $3{\times}10^5$으로써 본 연구에서 제안된 소자가 용액 공정형 top-gate 유기 TFT 소자로서 우수한 성능을 나타냄을 알 수 있었다.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.411-418
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• 2000

$Al_2O_3$ thin films of 300 nm thickness were deposited at room temperature using DC reactive sputtering with variation of the $O_2$ content in the sputtering gas from 30% to 70%. Regardless of the $O_2$ content in the sputtering gas, the sputtered $Al_2O_3$ films were amorphous and exhibited the refractive index of 1.58. When the $O_2$ content in the sputtering gas was higher than 50%, the $Al_2O_3$ films exhibited excellent transmittance of about 98% at 550 nm wavelength. However, the transmittance decreased to about 94% for the $Al_2O_3$ films deposited with the sputtering gas of the 30% and 40% $O_2$contents. The optimum dielectric properties (dielectric constant of 10.9 and loss tangent of 0.01) was obtained for the $Al_2O_3$ film deposited with the sputtering gas of the 50% $O_2$ content. When the $O_2$ content in the sputtering gas was within 40% to 60%, the $Al_2O_3$ films exhibited no shift of flatband voltage $V_{FB}$ in C-V curves and exhibited leakage current density lower than $10^{-5}\textrm{A/cm}^2$ at 150 kV/cm.

• Korean Journal of Materials Research
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• v.1 no.4
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• pp.229-235
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• 1991

A new electrode material for $Ta_2O_5$ capacitor was developed to obtain both high dielectric constant and improved electrical properties for use in DRAM. High leakage current and low breakdown field of as-deposited $Ta_2O_5$ film on Si is due to the reduction of $Ta_2O_5$ by silicon at $Ta_2O_5$/electrode interface. $Dry-O_2$ anneal improves the electrical properties of $Ta_2O_5$ capacitor with Si electrode, but it thickens the interfacial oxide and lowers the dielectric constant, subsequently. $Ta_2O_5$ capacitor with TiN exectrode shows better electrical properties and higher dielectric constant than post heat treated $Ta_2O_5$ film on Si. No interfacial oxide layer at $Ta_2O_5$/TiN interface suggests that there\`s no Interaction between $Ta_2O_5$ and electrode. TiN is a adequate electrode material for $Ta_2O_5$ capacitor.