• Title/Summary/Keyword: 석판술

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Fabrication of Fe Nanodot Using AAO Prepatterned by Laser Interference Lithography (레이저 간섭 석판술로 전처리된 AAO을 이용한 Fe 나노점 제작)

  • Hwang, H.M.;Kang, J.H.;Lee, S.G.;Lee, J.
    • Journal of the Korean Magnetics Society
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    • v.17 no.3
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    • pp.137-140
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    • 2007
  • The ordering of nanopores in AAO has been improved by using laser interference lithography. After growing Fe and Cu on this substrate in vacuum and removing AAO, Fe nanodots are fabricated. The nanopores in AAO and nanodots are ordered in one dimension following the prepatterning. It has been confirmed from the magnetic hysteresis loop that the Fe nanodots have vortex structure and the dipolar interaction is dominant among them.

Numerical Simulation of NIL Process Based on Continuum Hypothesis (연속체 가정을 통한 NIL 공정의 전산모사)

  • Kim, Seung-Mo;Lee, Woo-Il
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.532-537
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    • 2007
  • Nano imprint lithography(NIL) is a cost-efficient, high-throughput processing technique to transfer nano-scale patterns onto thin polymer films. Polymers used as the resist include UV cured resins as well as thermoplastics such as polymethyl-methacrylate(PMMA). In this study, an analytic investigation was performed for the NIL process of transferring nano scale patterns onto polymeric films. Process optimization calls for a thorough understanding of resist flow during the process. We carried out 2D and 3D numerical analyses of resist flow during NIL process. The simulation incorporated continuum-hypothesis and the effects of surface tension were taken into account. For a more effective prediction of free surface, fixed grid scheme with the volume of fluid (VOF) method were used. The simulation results were verified with experimental results qualitatively. And the parametric study was performed for various process conditions.

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Soft-lithography for Manufacturing Microfabricated-Circuit Structure on Plastic Substrate (플라스틱기판 미세회로구조 제조를 위한 소프트 석판 기술의 적용)

  • Park, Min-Jung;Ju, Heong-Kyu;Park, Jin-Won
    • Korean Chemical Engineering Research
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    • v.50 no.5
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    • pp.929-932
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    • 2012
  • Novel platform technology has been developed to replace the photolithography used currently for manufacturing semiconductors and display devices. As a substrate, plastics, especially polycarbonates, have been considered for future application such as flexible display. Other plastics, i.e. polyimide, polyetheretherketon, and polyethersulfone developed for the substrate at this moment, are available for photolithography due to their high glass transition temperature, instead of high price. After thin polystyrene film was coated on the polycarbonate substrate, microstructure of the film was formed with polydimethylsiloxane template over the glass transition temperature of the polystyrene. The surface of the structure was treated with potassium permanganate and octadecyltrimethoxysilane so that the surface became hydrophobic. After this surface treatment, the nanoparticles dispersed in aqueous solution were aligned in the structure followed by evaporation of the DI water. Without the treatment, the nanoparticles were placed on the undesired region of the structure. Therefore, the interfacial interaction was also utilized for the nanoparticle alignment. The surface was analyzed using X-ray photoelectron spectrometer. The evaporation of the solvent occurred after several drops of the solution where the hydrophilic nanoparticles were dispersed. During the evaporation, the alignment was precisely guided by the physical structure and the interfacial interaction. The alignment was applied to the electric device.