• The KIPS Transactions:PartD
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• v.13D no.7 s.110
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• pp.947-958
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• 2006

In order to increase extensibility and reusability of business components, the variable things need to be analyzed from the analysis phase and identified as components. In this paper, we propose a rule-based analysis pattern, which can effectively extract object-based main concepts from a variable business process in the analysis phase and identify a variable business component by applying the pattern to the UML Components development process. It can make analysis artifacts consistent and readable for analysts with different level of knowledge and experience to apply the pattern to analysis of rule-based variable business processes. And also, variable business components can be easily identified by applying the pattern to the UML Components development process. In order to prove the feasibility of the pattern, we have applied the pattern the deposit and import/export subsystem of the banking domain. According to our experience, we can make the same business conceptual models between the deposit and import/export subsystem due to the main concepts suggested by the pattern and effectively identify a variable business components in the UML Components development process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.1-10
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• 2000

A rigorous modeling of ultra-low energy implantation is becoming increasingly more important as devices shrink to deep submicron dimensions. In this paper, we have developed an efficient three-dimensional Monte Carlo ion implantation model based on a modified Binary Collision Approximation(BCA). To this purpose, the modified electronic stopping model and the multi-body collision model have been taken into account in this simulator. The dopant and damage profiles show very good agreement with SIMS(Secondary Ion Mass Spectroscopy) data and RBS(Rutherford Backscattering Spectroscopy) data, respectively. Moreover, the ion distribution replica method has been implemented into the model to get a computational efficiency in a 3D simulation, and we have calculated the 3D Monte Carlo simulation into the topographically complex structure.

• The KIPS Transactions:PartD
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• v.11D no.3
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• pp.649-658
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• 2004

An object-oriented system is organized by a set of interacting objects and the system behavior is represented by the cooperating interaction bet ween objects. The characteristics of object-oriented software. such as inheritance and polymorphism, increase the difficulty of the object-oriented software testing. At running time of a program, one call from a member function can bind to other member functions because of the dynamic characteristics such as concurrence, dynamic binding and interaction. Therefore, there need the research about considering the characteristics of object-oriented software and concurrently testing the interaction between objects. In this paper, we propose the techniques as follows. First, we construct a flattened state chart diagram by considering the inheritance and polymorphism. Next, we model the system with CPN(Colored Petri Net) that usually is applying the system modeling and simulation. Last, we propose a test case generation techniques for testing the interaction between objects in object-oriented software by applying a Design/CPN tool.

• Journal of Korean Society of Steel Construction
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• v.12 no.1 s.44
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• pp.93-102
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• 2000

Substructuring-based hierarchical approach for design analysis and optimization of structural frames is presented in this study. The conceptual framework of this method is in the hierarchical modeling for design processes as well as structural systems and the methodology combining substructuring analysis and multilevel optimization. Mathematical models for analysis and synthesis are established on the common basis of substructuring systems. Modularized behavioral analysis, design sensitivity analysis and optimization are linked and integrated on the mathematical and structural basis of substructuring. Substructures are coordinated with the active constraints for system level and the weight ratio criteria. Numerical examples for test frames show the validity and effectiveness of the present approach.

• Journal of the Korean Society of Propulsion Engineers
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• v.23 no.6
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• pp.59-71
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• 2019

The numerical analysis of ablative thermal protection systems (TPS) for solid rockets has been carried out with various in-house codes since the 1960s. However, the application scope of commercial codes has been expanded by adding subroutines and user-defined functions (UDF) to codes such as Fluent, Marc, and ABAQUS. In the past, the flow, thermal response and structural analysis of TPS have been performed using separate approaches. Recently, research has been conducted to interrelate them. In this paper, the thermal response characteristics of thermal protection materials, the in-house codes for thermal response analysis, and the research trends of flow-thermal-structure analysis of TPS using commercial codes were reviewed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38B no.4
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• pp.240-246
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• 2013

In heterogeneous networks, the almost blank subframes (ABS) for inter-cell interference coordination (ICIC), which can be protected from the CCI due to unutilized subframes (i.e., ABS) is proposed. However, the analytical model for ABS-based systems has not been fully studied yet. In this paper, we derive a new analytical model to evaluate the performance of ABS-based systems. In an analytic model, we assume that each carrier in multicarrier systems, such as in OFDMA, is subject to large-scale fading, which is independent of other carriers. As a performance measure, we present the cumulative distribution function (CDF) for the effective SINR. We show the accuracy of the analytical model via simulation results.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.17 no.8
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• pp.779-788
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• 1992

The Input /output (I /0) subsystem is often the bottleneck in high performance computer system. Generally, system performance evaluation models were enhanced to include the effect of the I/0 system. In this paper, we modeled the terminal servers which are Indispensable devices In distribution of computer resources. We use M /M /1 Queueing model for find out the point of the system performance FIFO buffer sizes In the terminal server arc the Important fanctions of the system design and could be effected to the overall system functions. We have proposed the of optimal buffer sizes in the model of terminal server for increasing the system performance. We analizing the vatting time for terruanl server using Queueing model. and We find out the reference model result from simulation.

• Journal of the Korea Society of Computer and Information
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• v.14 no.12
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• pp.33-40
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• 2009

We study Interpreted Systems, ATL, and ATEL to capture the notion of time, knowledge, and strategy which are important in the analysis of multi-agent systems and propose strategic constraints based on subgame perfect Nash equilibrium of game theory as one of the solutions for the issues of ATEL which an agent can access the current state of the whole system when making up his strategy even when he should be uncertain about the state, and no explicit representation of actions in ATEL models makes some natural situations harder to model. Also, we present strategic constraints-based Interpreted Systems for model checking of multi-agent systems.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.39-48
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• 2016

In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.228-238
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• 1992

An investigation on the step-coverage of PECVD and $O_3$ ThCVD oxides was undertaken to implement into the void-free inter metal dielectric planarization using multi-chamber system for the submicron double level metallization. At various initial aspect ratios the instantaneous aspect ratios were measured through modelling and experiment by depositing the oxides up to $0.9{\mu}m$ in thickness in order to monitor the onset of void formation. The modelling was found to be in a good agreement with the observed instantaneous aspect ratio of TEOS-based PECVD oxide whose re-entrant angle was less than $5^{\circ}$. It is demonstrated that either keeping the instantaneous aspect ratio of PECVD oxide as a first layer less than a factor of 0.8 or employing Ar sputter etch to create sloped oxide edge ensures the void-free planarization after$O_3$ ThCVD oxide deposition whose step-coverage is superior to PECVD oxide. It has been observed that $O_3$ ThCVD oxide etchback scheme has shown higher yield of via contact chain than non etchback process, with resistance per via contact of $0.1~0.3{\Omega}/{\mu}m^2$.