• 제목/요약/키워드: 서모그라피

검색결과 9건 처리시간 0.019초

초음파 서모그라피를 이용한 실시간 결함 검출에 대한 연구 (A Study on Real-Time Defect Detection Using Ultrasound Excited Thermography)

  • 조재완;서용칠;정승호;정현규;김승호
    • 비파괴검사학회지
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    • 제26권4호
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    • pp.211-219
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    • 2006
  • 초음파 서모그라피는 초음파 진동 에너지 여기에 의한 물체의 표면 및 표면 아래에 존재하는 결함부위의 선택적 발열 특성을 적외선 열영상 카메라로 관측하는 것이다. 결함(균열, 박리, 공극 등) 이 존재하는 구조물에 초음파 진동 에너지를 입사시킬 경우 결함 부근에서의 국부적인 발열로 인해 건전 부위와의 급격한 온도차를 드러내는 핫 스폿이 관측된다. 초음파 진동 에너지 여기에 의한 핫 스폿 관측 및 분석을 통해 결함을 진단하는 것이 초음파 서모그라피를 이용한 비파괴 결함 진단 방법이다. 이를 이용한 결함 검출을 위해서는 초음파의 진동에너지를 검사 구조물에 효율적으로 전달하는 것이 중요하다 본 논문에서는 초음파 서모그라피를 이용한 실시간 결함검출에 대해 기술한다. 초음파 진동에너지의 입사 방향에 따른 결함 검출 특성을 평가하기 위해 진동에너지의 전달 방향을 시편과 수직 또는 수평방향으로 각각 입사시켰다. 각각의 입사 방향에 따른 초음파 트랜스듀서 양단에 인가되는 전압을 디지털 오실로스코우프로 계측 비교하였다. 결함 검출에 사용한 시편은 14 mm 두께의 SUS 균열(crack) 시편, PCB 기판(1.8 mm), 인코넬 600 판(1.0 mm) 및 CFRP 판(3.0 mm)의 4종류이다. 4종류의 시편에 대해 280ms 펄스폭의 초음파에너지를 수직 수평으로 각각 입사시켰다. 4종류 모두 수직방향으로 초음파 진동에너지를 입사시켰을 때 수평방향에 비해 전달 손실이 적었다. 복합재료인 PCB, CFRP 판은 수직방향으로 초음파 진동에너지를 입사시켰을 때 수평방향에 비해 결함 위치에서 열이 크게 발생하였으며 선택적 발열 현상도 3배 이상 지속되었다. 금속재료인 인코넬 600판과 SUS 시편은 수평방향이 수직방향보다 핫 스폿이 빨리 관측되었다.

초음파 서모그라피를 이용한 용접 결함 검사 (A Welding Defect Inspection using an Ultrasound Excited Thermography)

  • 조재완;정진만;최영수;정승호;정현규
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.148-150
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    • 2006
  • In this paper, the applicability of an UET(ultrasound excited thermography) for a defect detection of the welded receptacle is described. An UET(ultrasound excited thermography) is a defect-selective and fast imaging tool for damage detection. A high power ultrasound-excited vibration energy with pulse durations of 280ms is injected into the outer surface of the welded receptacle made of Al material. An ultrasound vibration energy sent into the welded receptacle propagate inside the sample until they are converted into the heat in the vicinity of the defect. The injection of the ultrasound excited vibration energy results in heat generation so that the defect is turned into a local thermal wave transmitter. Its local heat emission is monitored by the thermal infrared camera. And they are processed by the image recording system. Measurement was performed on aluminum receptacle welded by using Nd:YAG laser. The observed thermal image revealed two area of defects along the welded seam.

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초음파 서모그라피를 이용한 빠른 PCB 결함 검출 (Fast Defect Detection of PCB using Ultrasound Thermography)

  • 조재완;정현규;서용칠;정승호;김승호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 학술대회 논문집 정보 및 제어부문
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    • pp.273-275
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    • 2005
  • Active thermography is being used since several years for remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements were performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

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초음파 서모그라피를 이용한 개방 균열의 크기 측정 (A Measurement of Size of the Open Crack using Ultrasound Thermography)

  • 조재완;서용칠;정승호;정현규;김승호
    • 제어로봇시스템학회논문지
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    • 제13권3호
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    • pp.218-223
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    • 2007
  • The dissipation of high-power ultrasonic energy at the faces of the defect causes an increase in temperature. It is resulted from localized selective heating in the vicinity of cracks because of the friction effect. In this paper the measurement of size and direction of crack using UET(Ultrasound Excitation Thermography) is described. The ultrasonic pulse energy is injected into the sample in one side. The hot spot, which is a small area around the crack tip and heated up highly, is observed. The hot spot, which is estimated as the starting point of the crack, is seen in the nearest position from the ultrasonic excitation point. Another ultrasonic pulse energy is injected into the sample in the opposite side. The hot spot, the ending point of the crack, is seen in the closest distance from the injection point also. From the calculation of the coordinates of both the first hot spot and the second hot spot observed, the size and slope of the crack is estimated. In the experiment of STS fatigue crack specimen(thickness 14mm), the size and the direction of the crack was measured.

초음파 서모그라피를 이용한 빠른 PCB 결함 검출 (Fast Defect Detection of PCB using Ultrasound Thermography)

  • 조재완;서용칠;정승호;김승호;정현규
    • 대한전기학회논문지:시스템및제어부문D
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    • 제55권2호
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    • pp.68-71
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    • 2006
  • Active thermography has been used for several years in the field of remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements are performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

초음파 펄스 서모그라피를 이용한 세라믹 전열 판의 결함 검출 (Defect Detection of Ceramic Heating Plate Using Ultrasound Pulse Thermography)

  • 조재완;서용칠;정승호;김승호;정현규
    • 한국세라믹학회지
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    • 제43권4호
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    • pp.259-263
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    • 2006
  • The applicability of UPT (Ultrasound Pulse Thermography) for real-time defect detection of the ceramic heating plate is described. The ceramic heating plate with superior insulation and high radiation is used to control the water temperature in underwater environment. The underwater temperature control system can be damaged owing to the short circuit, which resulted from the defect of the ceramic heating plate. A high power ultrasonic energy with pulse duration of 280 ms was injected into the ceramic heating plate in the vertical direction. The ultrasound excited vibration energy sent into the component propagate inside the sample until they were converted to the heat in the vicinity of the defect. Therefore, an injection of the ultrasound pulse wave which results in heat generation, turns the defect into a local thermal wave transmitter. Its local emission is monitored and recorded via the thermal infrared camera at the surface which is processed by image recording system. Measurements were Performed on 4 kinds of samples, composed of 3 intact plates and the defect plate. The observed thermal image revealed two area of crack in the defective ceramic heating plate.

헤데라 헬릭스 식물의 적외선 열영상에 의한 저온 및 한풍피해에 관한 연구 (An Analysis Method on Injury Symptoms Utilizing Infrared Thermal Imaging under the Freezing Stress of Hedera helix L.)

  • 성부근
    • 한국조경학회지
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    • 제40권6호
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    • pp.173-179
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    • 2012
  • Hedera helix의 저온에서의 피해 및 생육진단을 위하여 적외선서모그라피에 의해 측정한 적외선 열영상으로 부위별 체표면온도를 해석하였다. 노지재배품 첨단부와 기부의 엽신에 대한 실험설정온도 $-6^{\circ}C$구와 $-12^{\circ}C$구의 온도분포를 각각 비교해보았다. 결과 노지재배품 첨단부의 $-6^{\circ}C$실험구에서의 엽면온도는 $-2^{\circ}C{\sim}-7^{\circ}C$의 분포를, $-12^{\circ}C$실험구에서는 $-2^{\circ}C{\sim}-15^{\circ}C$까지의 범위에 분포하고 있었다. 한편 노지재배품 기부의 엽면온도는 $-6^{\circ}C$실험구에서의 엽면온도는 $-2^{\circ}C{\sim}-11^{\circ}C$의 분포를, $-12^{\circ}C$실험구에서는 $-1^{\circ}C{\sim}-12^{\circ}C$까지의 범위에 분포하고 있었다. 이를 보면 $-6^{\circ}C$실험구에서는 첨단부쪽이, $-12^{\circ}C$실험구에서는 기부쪽이 보다 광범위한 온도분포를 보여 주었다. 이는 대체적으로 기부 쪽보다는 첨단부 쪽의 엽신이 저온감수성이 높은 것을 의미한다. 한풍피해를 규명하기 위하여 노지재배품의 평균엽면온도를 측정한 결과 $0^{\circ}C$실험구에서 $-6.2^{\circ}C$, $-2^{\circ}C$실험구에서 $-6.8^{\circ}C$, $-4^{\circ}C$실험구에서 $-7.5^{\circ}C$를 나타내어 각각의 설정온도(공기온도) 보다도 $3.5{\sim}6.2^{\circ}C$ 저온이었으며 부위별로 온도가 다른 점으로 보아 저온감수성이 상이한 것으로 추론하였다.