• Title/Summary/Keyword: 불연속 발열체

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Natural convection cooling of discrete heaters with same heat generation in a vertical open top cavity (상부가 개방된 수직 캐비티내에 장착된 불연속 균일 발열체의 자연대류 냉각)

  • Yu, Gap-Jong;Chu, Hong-Rok;Kim, Byeong-Ha;Choe, Byeong-Cheol
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.1
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    • pp.1-14
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    • 1997
  • Natural convection cooling of discrete heaters located in a two-dimensional vertical open top cavity is investigated experimentally. The five discrete heaters with same heat generation are located on the wall of the cavity. The heaters are arranged in two configurations; flush-mounted on a vertical wall and protruding from the wall about 4.5 mm. The materials used for the vertical walls are copper and epoxy-resin, and air is used as the cooling fluid. The temperature and flow fields in the cavity were visualized by means of Mach-Zehnder interferometer and smoke-method. Also, local temperature measurements are made along the vertical wall. Results are obtained for cavity aspect ratios of 4.6, 7.5 and 9.5 and modified Rayleigh numbers ranging from 10$^{3}$ to 10$^{6}$ . Results indicate that the cooling efficiency for the copper wall is superior to that of the epoxy-resin. For the epoxy-resin wall, the protrusion of the heaters plays a role in decreasing the heat transfer performance. The location of maximum temperature is significantly influenced by the wall materials and heater configurations. Correlations relating the Nusselt number to the modified Rayleigh number are proposed.

Study on the cooling performance of discrete heat sources using coolants (냉각제들에 따른 불연속 발열체의 냉각성능 연구)

  • 최민구;조금남
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.11 no.2
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    • pp.224-235
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    • 1999
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

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