Boiling Heat Transfer from a locally Heated Surface -A Simulated Electronic Device under Liquid Immersion Cooling- (국부적인 발열부분을 가진 표면에서의 잠김 비등열전달 -전자부품 액침 냉각에서의 응용-)
-
- Transactions of the Korean Society of Mechanical Engineers
- /
- v.15 no.2
- /
- pp.685-692
- /
- 1991