• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.1-8
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• 2008

We propose how to program the off-line buffing robot path along shoes' outsole shape in the footwear buffing process by a 5-axis microscribe system like robot mechanism. The microscribe system we developed consists of a 5-axis robot link with a turn table, a signal processing unit, PC and an application software program. Itmakes a robot path on the shoes' upper in accordance with the movement of a microscribe with many joints. The developed system calculates the encoder pulse values for the microscribe arm's rotation and transmits the angle pulse values to the PC through a processing unit. Denavit-Hartenberg's(D-H) direct kinematics is used to make the global coordinate from microscribe joint one. Problems with the microscribe's kinematics can be solved efficiently and systematically by D-H representation. With the coordinate values calculated by D-H equation, our system can draw a buffing gauge-line on the upper sole. We obtain shoes' outline points, which are 2 outlines coupled with the points and the normal vector based on the points. By applying the system to the buffing robot in a flexible manufacturing system, it can be used effectively to program the path of a real buffing robot.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.743-748
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• 2004

In this paper, an analysis on a new robot manipulator developed for the side buffing of the shoes is presented. The robot is composed of five D.O.F. An Analysis on the forward and inverse kinematics was performed. The hardware system including electric wirings, control system, and related system was developed. Also, The teleoperating communication system was developed to shake with other related system Computer programs to track the bonding line of shoes were developed. An user-friendly graphic program was developed using C $^{++}$ language for the users.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.197-202
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• 2004

As a part of environmental pollution prevention and resources recycling, the regeneration of waste tire has been largely contributed to national industry. But, the worker has been evaded this regeneration process by reason of the best mischievous process condition among 3D industries. So, the first, the process condition of regenerating waste tire was analyzed. The second, the equipment or system was developed for the improvement of working strength and environment. The last, researchers intend to solve these problems

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.175-180
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• 2004

As a part of environmental pollution prevention and resources recycling, the regeneration of waste tire has been largely contributed to national industry. But, the worker has been evaded this regeneration process by reason of the best mischievous process condition among 3D industries. So, the first, the process condition of regenerating waste tire was analyzed. The second, the equipment or system was developed for the improvement of working strength and environment. The last, researchers intend to solve these problems

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.76-83
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• 2006

In this paper, an analysis on a new robot manipulator developed for the side buffing of the shoes is presented. The robot manipulator is composed of five degrees of freedom. An analysis on the forward and inverse kinematics was performed. Through the analysis, an analytic solution was derived for the joint angles corresponding to the position and orientation of the tool in the Cartesian coordinates. The hardware system of the robot composed of the control system, input/output interface system, and related electronic system was developed. The communication system was also developed to interact the robot with the related surrounding systems. A graphic user interface(GUI) program including the forward/inverse kinematics, control algorithm, and communication program was developed using visual C++ language.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.609-613
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• 2004

On this study, electrochemical polishing is adapted to ultra-fine surface for semiconductor large radius gas-tube. The system which buffing and electrochemical polishing can be performed simultaneously was constructed in connection with developing exclusive system. Based on existing papers and the research of background, electrode gap and electrolyte flow were fixed. Current density and electrochemical precision time were chosen as variables. On this study, it is objected to find optimal precision condition and precision variables on the in-process electrochemical polishing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• Journal of Adhesion and Interface
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• v.14 no.3
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• pp.111-116
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• 2013

In this study, we studied surface and adhesion properties with plasma treatment for substitution of buffing and solvent-cleaning in footwear adhesion process. The distance between nozzle and rubber parts was decreased with decreasing the contact angle. And when a speed of plasma treatment increased, the contact angle increased. The result of surface roughness, Ra and Rz increased in 20% and 16% after the plasma treatment. The distance of between nozzle and rubber parts was decreased with decreasing the peel strength. And the speed of plasma treatment was increased with decreasing the peel strength.

• Journal of Adhesion and Interface
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• v.18 no.2
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• pp.53-58
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• 2017

In this study, to overcome a complicated shoe adhesion process such as buffing, pre-treatment by primer in the rubber component of the shoe, we studied adhesion and mechanical properties with rubber compound added $MgCl_2$. We determined adhesion properties of $MgCl_2$ content. Especially, the rubber containing $MgCl_2$ exhibited good adhesion properties to water-based adhesion. Since $MgCl_2$ is a water-soluble salt, it was judged that this phenomenon occurred. The results are confirmed by contact angle and surface morphology measurement. In addition, in the case of rubber compound added $MgCl_2$, the crosslinking efficiency was increased and the NBS resistance was increased.

• Journal of Adhesion and Interface
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• v.19 no.2
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• pp.55-59
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• 2018

In this study, to overcome a complicated shoe adhesion process such as buffing, pre-treatment by primer in the rubber component of the shoe, we studied adhesion mechanical properties with rubber compound added water-soluble salt for the purpose of improving the adhesion between midsole and outsole. Acid salts, basic salt and neutral salts were evaluated, rubber containing basic salts showed excellent adhesion to water-based adhesion. Since the basic salt is present as the hydroxy salt, the surface of rubber is hydrophilized. The results are confirmed by contact angle and IR spectroscopy measurement. In addition, in the case of rubber compound added basic salts, NBS abrasion resistance and hardness were increased by increasing crosslink density, but crosslink time was delayed.