• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.45 no.8
• /
• pp.678-685
• /
• 2017

The radiator of the data storage and handling units onboard the earth observation satellite is a groove-type radiator covered with a shield because of the periodic high heat dissipation and design characteristics of arrangement and mountability of the unit. The effect of the groove-type radiator and that of the shield versus plane radiator were verified through the thermal vacuum test. Through the test result, the temperatures of the radiator and the heat exchange due to the view factor were analyzed by using the analytical method. Conclusively the thermal performance of the shield dissipation plate was verified.

• Proceedings of the KAIS Fall Conference
• /
• 2010.05b
• /
• pp.693-695
• /
• 2010

3~5W의 출력을 내는 MR16 LED 조명기구는 저 전력, 긴 수명으로 인해 에너지 문제를 해결하기 위한 중요한 요소로 작용한다. 반면에 정션 온도 상승으로 인해 수명이 급격히 단축하는 문제점이 발생하므로 방열 문제를 해결하는 것이 무엇보다 중요하다. 본 연구에서는 단일 고출력 LED 패키지를 이용한 MR16 조명등의 개발을 위해 1차원 열저항 해석 및 3차원 CFD 해석을 수행하였다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.1
• /
• pp.37-42
• /
• 2010

The objective of this study is to find heat emission characteristics on the natural convection radiator in a heating system when the aspect ratio of radiator is changed. In addition the computer simulation method is used in order to find the characteristics of heat transfer. When the width of the radiator is long and the height of radiator is short, the temperature difference from the floor level 0.5m to about 2.7m above the floor is small. It shows that thermal environment in heating space is good than the other case. For the future, I hope to compare the results between the computer simulation and experimental method for reliability.

• Journal of Ocean Engineering and Technology
• /
• v.11 no.4
• /
• pp.159-168
• /
• 1997

본 연구는 Moss형 LNG선박의 방열구조에서 LNG탱크에 침입하는 열량과 선체의 온도분포를 예측하고, 운항 중 LNG탱크를 Cooling down(예냉)하는 경우 발생하는 비정상상태에서 LNG탱크에 발생하는 국부적인 열응력을 검토할 수 있는 비정상 온도분포해석과 LNG증발량을 검토하였다. 특히 운항 중인 선박을 대상으로 일반적인 수치계산시에 필요한 각종 입력절차를 간소화 하고 경계조건 선정시에 비 전문가도 쉽게 이용할 수 있는 전산프로그램을 개발하였다. Moss형 LNG탱크의 예냉작업에 필요한 최적의 냉매량과 예냉조건을 비정상상태에서 해석한 것은 설계자 및 선박 운항자에게 유용하게 이용될 것이다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.9 no.6
• /
• pp.1565-1568
• /
• 2008

This thesis is about the design of heat sink which is the obstacle in commercializing LED light fixture. It suggests a way of solving the problem by the analysis on heat radiation of LED light fixture using CF-design. As a result of the analysis, the difference of simulation value and the measured temperature of proto-type was derived as less than 6[$^{\circ}C$]. Even the results approaching the target value of actual product could be obtained with the given factors well applied.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.10 no.7
• /
• pp.1484-1488
• /
• 2009

This thesis is about Heat-sink design which is considered as the biggest problems for commercialization of LED lighting and suggests how to solve the problems though analysis on heat-sink using COMSOL. The temperature difference after simulation value and modelling was $10^{\circ}C$by Transient analysis of Heat Transfer Module which is in the COMSOL Multiphysics. The result approximated the object which is close to actual lighting, when various elements are used according to temperature change of interior and exterior surroundings LED lighting is set up.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.7
• /
• pp.2317-2322
• /
• 2010

Market for LED lights as a newly-growing industry has been growing, and secureness of high efficiency and long life through optimal thermal design are crucial for further popularization. In this study, considerable improvement in thermal performance for a 10W LED light has been done compared to a previous model. For this, numerical model has been established through experiments and used to optimize design factors in heat release such as fin shape, PCB kind or LED number etc. Furthermore, prototype of a LED light has been made and the improved thermal performance was verified with heat release experiments.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.41 no.4
• /
• pp.285-291
• /
• 2017

In this study, a case analysis for thermal design of electronic equipment using a phase change material(PCM) was performed numerically using ANSYS Fluent. Experiments were conducted to find the temperature increase(${\Delta}T_m$), melting temperature($T_m$), and volume expansion of the PCM under the melting process. To verify the accuracy of the Fluent solver model, $T_m$, ${\Delta}T_m$, and the melting time were compared with experimental results. To simulate the temperature stagnation phenomenon under the melting process, the equivalent specific heat method was applied to calculate the thermal properties of the PCM in the solver model. To determine the thermal stability of electronic equipment, we paid special attention to finding a thermal design for the PCM using fins. Further, an additional numerical analysis is currently underway to find an optimum design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.503-503
• /
• 2007

본 논문에서는 지중배전(22.9kV) 선로에 사용되는 지상변압기를 대상으로 수행한 방열해석 및 개선과 변압기수명연장에 관한 검토 결과를 수록하였다. 변압기의 열화메커니즘에 대한 문헌 조사를 통해 변압기 온도와 수명간의 관계를 작도하였는바, 수명 평가를 위한 핵심 인자로 열에 의한 절연지의 열화에 초점을 맞추었다. 기존 외함에 설치된 방열구중 상부 위치를 상부판에도 변경하는 경우 약25%의 통풍량 증가 효과를 기대할 수 있을 것으로 평가 되었으며 상부판과 내함 사이에 형성되던 고온 영역에서의 온도를 약$15^{\circ}C$정도 낮출 수 있는 것으로 나타났다. 절연지의 인장강도 변화로 평가한 수명예측 곡선에 따르면 약$10^{\circ}C$의 은도 저감은 약10배의 수명 연장 효과를 가져오는 것으로 나타난바, 본 연구에서 확인한 방열구의 위치 변경에 따른 지상기기 내부의 온도 저하는 변압기 수명을 연장하는데 일조할 것으로 기대된다. 기존 지상변압기에서의 방열구조를 통해 변압기 온도와 수명간의 관계를 작도하였는바, 수명 평가를 위한 핵심인자로 효과적으로 방열할 수 있는 새로운 외함의 구조 및 디자인을 제시하고 시뮬레이션을 통해 개선효과를 예측하였다. 또한, 개선된 모델을 가지고 실제 변압기를 제작한 후 부하를 인가하여 개선전과 후에 대한 방열효과를 실증시험을 통해 확인하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.43-51
• /
• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.