• Composites Research
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• v.37 no.5
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• pp.422-426
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• 2024

Due to the rapid miniaturization and increased power density of electronic devices, a significant amount of heat is generated during operation. This has led to a surge in demand for thermal management materials, such as thermal interface materials (TIMs) with high thermal conductivity. Among the various types, paste-type TIMs, mixtures of liquid silicone polymers and thermal fillers, can effectively fill the rough surfaces between heat sources and heat sinks, thereby ensuring efficient heat dissipation. However, thermal pastes generally exhibit poor long-term stability due to issues like filler/resin phase separation under extreme conditions of repeated heating, cooling, and prolonged compression. Consequently, research on high-performance thermal pastes with excellent long-term stability is actively underway. This paper aims to introduce various strategies for producing silicone oil based thermal pastes that achieve both high thermal conductivity and superior long-term stability.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.