• Journal of the Computational Structural Engineering Institute of Korea
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• v.29 no.1
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• pp.53-60
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• 2016

This study discusses the thermal insulation capacity of variant of NO96 LNG (liquefied natural gas) cargo containment insulation system. Changing the insulation materials and the insulation layers of conventional GTT NO96 containment system, The thermal resistance and BOR(boil off rate) caused by the heat transfer between cryogenic and environmental temperature is discussed. Therefore, thermal analysis of LNG CCS(cargo containment system) is carried out to determine the insulation capabilities. Also, BOR is evaluated in terms of the total amount of heat invaded into CCS(cargo containment system). Variant of NO96 CCS such as NO96, NO96GW and NO96L3 membrane type during laden voyage is selected for the comparative study. Finite element model for heat transfer analysis is conducted by employing the equivalent thermal resistance model to simplify the complex insulation layers. Finally the results for each variant model are relatively compared and discussed to minimize the BOR.

• Journal of Advanced Navigation Technology
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• v.23 no.5
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• pp.460-465
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• 2019

In this study, we aim to derive a solution from the structural analysis for electrical failure of single board computers for computing navigation information. By analyzing the characteristic factor, we identify that crack occur on the central processing unit board due to a certain structural problem, and that the physical effect by the crack make communication function be impossible to perform, which it causes booting error. In order to find the location of excessive stress causing the crack, structural analysis for the single board computer is done. From the structural analysis, the areas where stress concentration occurs are identified, and improvement methods changing the structures are developed. As a result, we shows that stresses are reduced entirely on the stress distribution for the improved structure. In addition, heat analysis shows that changing the structure to reduce stresses is not affect to the heat radiation, and the thermal resistance of the actual equipment is verified by measuring the temperature of the heat sink applied with the improved structure.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.311-314
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• 2014

In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.2
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• pp.157-164
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• 2012

The design strategy of the multi-functional structure is that the electrical components and the circuits are directly put on their supporting structural panel in which the radiation shields and the thermal control functions are integrated. Applying the multi-functional structure reduces the total mass and size of the space system and makes it possible to lower launch cost. In present study the performance of thermal radiation for six types of multi-functional structure are investigated by the numerical method. The effect of the rib configuration on heat transfer for the multi-functional-structure is not important alone but is meaningful considering with the structural stiffness, difficulty of manufacturing and mass increase. In heat spreading point of view, the thickness of the outer conductive layer is important rather than the rib configuration and the trade-off study with the mass and thickness is required for optimum design.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.81-85
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• 2002

전기 전자 제품에 사용되는 반도체 칩이나 부품들은 작동시 발열을 하게 되며 이러한 열은 적절히 제거되지 않은 경우 전기 전자 제품의 오작동을 유발시키는 요인이 된다. 발열부품이 작동할 때 발생되는 열을 제거하기 위해서 히트싱크나 냉각팬과 같은 구조를 발열 부품 장착시 같이 설치하는 방법이 일반적으로 사용되는 냉각구조 형태지만 이와 같은 냉각 구조는 최근의 전기 전가 제품의 소형화 추세에 부응하는데는 한계가 있다. 따라서 이러한 냉각 구조의 한계를 보완하기 위한 방안으로써 소형화한 히트싱크, 즉 두께와 방열의 중요 요인이 되는 히트싱크의 방열핀의 크기를 나노미터 단위에서 밀리미터 단위로 제조한 마이크로 히트 싱크를 제조하여 그 효용성에 대해 연구하고자 하였다. 마이크로 히트싱크의 제조는 균일한 포어를 포함한 폴리머 멤브레인에 열전도성이 뛰어난 금속을 무전해 도금하는 방법으로 제조하였으며 주사현미경으로써 관찰하였다.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.189-194
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• 2015

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.31 no.4
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• pp.165-171
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• 2018

In this study, the shape of the flow control structure within a DVR was designed for heat dissipation of the CPU. The proposed design consists of three thin metal plates, which directly controls the air flow inside the DVR box and forces the air to pass through the CPU, thereby efficiently dissipating heat from the CPU. The shape of the structure was determined using parametric studies. To verify the design result, we carried out a three-dimensional time dependent numerical analysis using a commercial fluid dynamics analysis package FlowVision. As a result of experiments with a real DVR equipment, it is confirmed that the temperature of the CPU is significantly reduced compared to the initial model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4398-4404
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• 2012

This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.

• Journal of Advanced Navigation Technology
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• v.24 no.4
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• pp.261-266
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• 2020

When a KW-class power control unit is installed in an aircraft installation, a heat dissipation design for a large amount of heat generated during power conversion should be considered. Failure to provide adequate heat dissipation can lead to equipment malfunction and fire, which can be a fatal factor in aviation operations. This paper describes the heat dissipation design of a KW-class power control unit installed in aircraft installation. The design and manufacturing test were conducted through computerized analysis, and the analysis model was corrected by confirming the rapid heat generation phenomenon of the heating element due to high power control. After the model revision, the design was improved, and the high-temperature operation test of the US military standard MIL-STD-810G was performed to confirm the feasibility of the improved design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.182-182
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• 2009

일반적으로 스크린 프린팅 공정은 실비가 간단하고 공정이 쉬우며 가격이 저렴한 특성을 가지고 있다. 본 연구에서는 스크린 프린팅 방법들 이용하여 절연층을 코팅하고 도체 패턴을 형성하여 MCPCB(Metal-Core Printed Circuit Board) 기판을 제작하였다. 또한, 이 방법으로 제작된 MCPCB 기판의 방열 특성을 기존 상용 MCPCB와 비교 평가하였다.