• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.455-455
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• 2010

차세대 디스플레이로 널리 알려져 있는 플렉서블 디스플레이는 휴대하기 쉽고, 깨지지 않으며, 변형이 자유로워 현재 우리 사회에 크게 주목받고 있다. 플렉서블 디스플레이의 구현을 위해서는 기존의 유리 기반 디스플레이 소자 기술에 더하여 플렉서블 기판소재에 적용 가능한 투명전도막 기술의 확립이 필요하다. 디스플레이 산업에서 주로 사용되는 투명전도막은 ITO (indium tin oxide) 및 IZO (indium zinc oxide)와 같은 투명전도성 산화물 박막 (TCO, transparent conducting oxide)이다. 그런데 플라스틱 기판이 굽힘 환경에 놓이게 되면 그 위에 증착된 산화물 박막이 쉽게 파손될 수 있다. 따라서 플렉서블 디스플레이 기술에 있어서 변형에 따른 TCO 박막의 파괴 거동에 대한 연구가 필수적이다. 본 연구에서는 PET (polyethylene terephthalate) 기판 상에 증착된 IZO 박막의 반복 굽힘 시 계면구조 변화에 따른 파괴거동을 조사하였다. 플라스틱 기판의 사용을 위해서는 산소 및 수분의 투과 방지막이 필요하며 본 연구에서는 투과 방지막 (또는 보호막)으로서 $SiO_x$ 박막을 적용하였다. IZO 박막은 $In_2O_3$ - 10 wt% ZnO 타겟을 사용하여 RF magnetron sputtering법으로 $100^{\circ}C$ 미만에서 저온 증착하였다. 보호막으로 사용되는 $SiO_x$ 박막은 HMDSO (hexamethyldisiloxane)와 Ar 및 $O_2$ 혼합기체를 이용하는 PECVD 방법으로 합성하였다. 변형에 따른 TCO 박막의 파괴 거동을 조사하기 위하여 반복 굽힘 시험 (cyclic- bending test)을 실시하였다. 반복 굽힘 시험 중 실시간으로 IZO 박막의 전기저항 변화를 측정하여 박막의 파괴 거동을 모니터링 하였다. 시편 A (135 nm-thick IZO/PET), B (135 nm-thick IZO/ 90 nm-thick $SiO_x$/PET), C (135nm-thick IZO/ 300 nm-thick $SiO_x$/PET)에 대하여 곡지름 35mm, 1000회 반복 굽힘을 실시하여 변형 중의 전기저항 변화를 조사하였다. 그리고 굽힘 시험 완료 후, FE-SEM을 이용한 시편 표면형상 관찰을 통하여 균열생성 정도를 관찰하였다. 반복 굽힘 시험 결과, A 와 C 시편의 경우, 각각 반복 굽힘 20회, 550회에서 급격한 전기저항의 증가가 관찰되었다. 그러나 B 시편의 경우, 1000회 반복 굽힘 후에도 전기저항의 변화는 나타나지 않았다. 이와 같이 반복 굽힘에 의한 IZO 박막의 파괴 거동 변화는 IZO 박막과 기판의 계면구조변화에 기인한 것으로 해석된다. IZO 박막과 기판의 계면에 $SiO_x$ 층을 삽입함으로써 계면 접합강도가 향상되었을 것으로 추측된다. 따라서 변형에 대한 파괴 저항 특성이 우수한 투명전도성 산화물 박막의 형성을 위해서는 적절한 계면구조 제어를 통한 계면 접합 특성의 향상이 필요하다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.10
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• pp.1227-1234
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• 2012

In this study, fatigue tests were carried out using real-scale pipe bend specimens with wall-thinning defects under a cyclic bending load together with a constant internal pressure of 10 MPa. The wall-thinning defect was located at the extrados and the intrados of the pipe bend specimens. A fully reversed cyclic in-plane bending displacement was applied to the specimens. For the pipe bends with wall thinning at the extrados, an axial crack occurred at the crown of the pipe bend rather than at the extrados where the defect was located. In addition, the fatigue life was longer than that of a sound pipe bend predicted from the design fatigue curve in ASME Sec.III, and it was less dependent on the axial length of the wall-thinning defect. For the pipe bends with wall thinning at the intrados, a circumferential crack occurred at the intrados. In this case, the fatigue life was much shorter than that of a sound pipe bend predicted from the design fatigue curve, and it clearly decreased with decreasing axial length of the wall-thinning defect.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.362-368
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• 2009

In general, circuit board assemblies experience various mechanical loadings during assembly and in actual use. The repeated cyclic bending can cause electrical failures due to circuit board cracks, solder interconnects cracks, and the component cracks. In this paper, we report on the failure characteristics of semiconductor chips under the repeated cyclic bending. We first describe a new 4-point bending tester, which is developed according to JEDEC standard No. 22B113. The performance of the tester is then estimated through actual experiments. Test results reveal that the cracks first occur on the outer balls around 20,000 cycles and gradually propagate to the inner balls where cracks are found around 70,000 cycles.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Korean Institute of Gas
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• v.3 no.3 s.8
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• pp.1-8
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• 1999

Three-point bending fatigue properties of austenitic 304 stainless steel sheets were investigated at room temperature and LNG temperature($-162^{\circ}C$) in the strain range from 0.43 to $1.7\%$. The fatigue properties at $-162^{\circ}C$ were superior to those at room temperature due to the higher volume fractions of deformation-induced martensite. The cyclic hardening behavior owing to the deformation- induced martensite transformation was detected in both specimens. In room temperature testing, the mean load amplitude increased steadily with cycles, meaning that cumulative plastic incubation strain was required for martensite transformation. On the contrary, in $-162^{\circ}C$ tested specimen, the mean load amplitude increased rapidly within a few cycles due to the rapid transformation of martensite, and slightly decreased after the maximum is reached probably due to dynamic recovery.

• 대한치과보철학회:학술대회논문집
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• 2000.11a
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• pp.51-51
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• 2000

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.18 no.2
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• pp.77-86
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• 2022

This study investigates the effect of the diameter and thickness on crack initiation location and orientation of 90° elbows under in-plane mode displacement-controlled cyclic bending loads. Finite element (FE) analysis of cyclic failure test is conducted for elbow specimens under in-plane mode displacement-controlled cyclic bending to identify the parameters affecting crack location and orientation. Furthermore, parametric FE analysis of the pipe elbows with various pipe nominal sizes and Schedules is performed, and the crack location and orientation from the results of FE analysis are determined. It is found that the crack location and orientation in the pipe elbows are determined mianly by the radius to thickness ratio of pipe elbows (R_m/t). It is also found that the presence of internal pressure slightly increases the value of R_m/t at which the failure mode changes.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.47-52
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• 2017

Recently, a great attention has been paid to the mechanical behavior of ITO (Indium Tin Oxide) film, which is widely used in current smart devices due to its excellent electrical properties and transparency. In this study, the reliability of ITO thin films on flexible substrates was investigated using bending test and bending fatigue test. According to the relative position of ITO and substrate, the experiment was conducted on both outer and inner bending conditions. Inner bending condition exhibited superior electrical stability compared to outer bending test. The electrical resistance during outer bending fatigue test significantly increased compared to that in the inner bending fatigue. The crack nucleation and propagation differs according to the stress state and they have a great influence on the electrical resistance. The crack morphologies were observed by scanning electron microscopy.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.119-126
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• 2019

A flexible thermoelectric module, which consisted of 18 pairs of Bi₂Te₃-based hot-pressed p-n thermoelectric legs, were processed by filling the module inside with polydimethylsiloxane (PDMS) and removing the top and bottom substrates. Its power generation properties and bending characteristics were measured. With putting the flexible module on the wrist, an open circuit voltage of 2.23 mV and a maximum output power of 1.69 ㎼ were generated during staying still. On the other hand, an open circuit voltage of 3.32 mV and a maximum output power of 3.41 ㎼ were obtained with walking motion. The resistance variation of the module was kept below 1% even after applying 30,000 bending cycles with a bending curvature radius of 25 mm.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.93-99
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• 2016

In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.