• 반도체디스플레이기술학회지
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• 제10권3호
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• pp.61-65
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• 2011

The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

• Design & Manufacturing
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• 제15권3호
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• pp.56-61
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• 2021

The increase in automation facilities in the injection molding industry is a very important process control item. The most important item when constructing an unmanned machine using a take-out robot is the "mold opening stroke" of the mold. The injection molding machine control method is divided into hydraulic type and electric type, and there have been few studies on the mold opening distance according to the control method. In this study, the correlation was confirmed by increasing the injection speed to 20, 50, 80, and 100% for the three types of hydraulic control method, open loop and close loop, and electric control method. Through the experiment, the following results were obtained. (1) It can be seen that the reproducibility is excellent with the electric, close loop, and open loop control methods. (2) When the injection speed is set to 50%, the mold opening distance is 263.10~263.27 mm, which is the most reproducible. (3) As a result of ANOVA, both injection speed and mold opening distance showed a significant difference in the hydraulic control method (p<0.05), but it was verified through experiments that there was no significant difference in the electric control method. Based on these results, when electric control is selected rather than hydraulic control, the reproducibility of the mold opening distance is excellent, so it is thought that the taking-out robot can take the object out of the mold more safely.

• Design & Manufacturing
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• 제11권2호
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• pp.25-28
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• 2017

Semiconductor equipment manufacturers desire to enhance efficiency of Sub Fab to increase semiconductor productivity. For this reason, Sub Fab equipment manufacturers are developing Integrated System that combined modules with multiple facilities. Integrated System is required to apply Mount Leveler of Wedge Type in compliance with weight increase compared with existing single equipment and product shape change. This thesis analyzes main design variables of components of Wedge Mount Leveler and carries out structure analysis using ANSYS, finite element analysis program Analysis shows that main design variables of components of Wedge Mount Leveler has self-locking condition by friction force of Wedge and adjusting bolt. Each friction force hinges upon Wedge angle and Friction Coefficient of contact surface and upon the thread angle and Friction Coefficient of contact surface. Also, as a result of carrying out structure analysis of Wedge Mount Leveler, deflection and stress appears in different depending on the height of the level.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2010년도 추계학술발표논문집 2부
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• pp.947-949
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• 2010

임의 형상의 미세구조 패턴의 형성기술은 광전자 공학부터 생물학적 적용까지 넓은 분야에서 폭발적인 잠재력을 가지고 있다. 그러나 많은 패턴 형성에 관한 연구는 제작 프로세서 비용이 높아 일부의 기능성 반도체 디바이스 혹은 유기물 광학 미디어등에 한정 되고 있으며 고온 구조용 세라믹스에 적용은 거의 예가 없는 실정이다. 최근 들어 MEMS, 고온내열 부재, 광학부재에 관한 연구의 진전과 함께 고온 구조부재의 표면에 미세구조를 부여하는 연구의 니즈가 높아지고 있다. 이에 본 연구에서는 폴리 비닐 알콜(PVA)과 금형(석영 몰드)의 이형성이 높은 것에 착안하여 특단의 장치를 이용하지 않고 간단한 전사 방법으로 알루미나 소결체에 미세구조 부여를 시험하였다.

• 소성∙가공
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• 제23권4호
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• pp.206-210
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• 2014

The metal lead frame, a semiconductor component, has product tolerances in micro units as compared to products made with a larger size mold. Therefore, small deflections of the mold and of the press as well as the press molding process itself have a strong influence on accuracy of the product. Hence, it is necessary for the process design to consider the structural response of the mold and the press during deformation. In the current study, the mold deflection and pressure on the punch is examined using the finite element modeling (FEM) program ABAQUS. The results from the simulation were verified with the dynamic deformation measurement equipment using digital image correlation (DIC).

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2008년도 추계학술대회 초록집
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• pp.94-97
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• 2008

현재 전주 국내에서는 전주에 대한 관심이 조금씩 증가하는 추세지만 그 활용 영역은 많지 않다. 최근들어 휴대폰 관련 부품과 LCD디스플레이의 핵심부품인 도광판 사출금형에 집중되어 있다. 본 연구에서는 반도체 웨이퍼 절단용 블레이드 제작을 목표로 Ni 전주도금층에 조밀하게 $Al_2O_3$를 분산시키는데 목표를 삼았다. 전주(electroforming)를 이용한 Ni-$Al_2O_3$를 첨가한 설파민산 니켈욕에 Surfactant의 양을 조절하며 Sodium Lauryl Sulfate의 첨가량이 많아질수록 Nickel 전주도금층 표면에 $Al_2O_3$는 접착되어지지 않고, 도금층의 두께는 두꺼워졌다. Surfactant의 첨가로인하여 Ni 전주도금층의 표면 장력이 감소하여 $Al_2O_3$를 감싸고 Ni 전주도금층이 성장하여야하는데 교반하는 과정에서 $Al_2O_3$ 입자들이 용액의 흐름에 따라 떨어져 나갔다.

• Design & Manufacturing
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• 제16권1호
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• pp.15-20
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• 2022

This paper is about elimination the situation in which gas sensor data becomes inaccurate due to temperature control when a semiconductor gas sensor is driven. Recently, interest in semiconductor gas sensors is high because semiconductor sensors can be driven with small and low power. Although semiconductor-type gas sensors have various advantages, there is a problem that they must operate at high temperatures. First temperature control was configured to adjust the temperature value of the heater mounted on the gas sensor. At that time, in controlling the heater temperature, gas sensor data are fluctuated despite supplying same gas concentration according to the temperature controlled. To resolve this problem, gas and temperature are extracted as a data. And then, a relation function is constructed between gas and temperature data. At this time, it is included low pass filter to get the stable data. In this paper, we can find optimal gain and parameters between gas and temperature data by using genetic algorithm.

• 한국정밀공학회지
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• 제12권12호
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• pp.91-99
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• 1995

An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

• 한국정밀공학회지
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• 제16권6호
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• pp.123-132
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

• 열처리공학회지
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• 제35권6호
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• pp.319-326
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• 2022

Direct extrusions of an aluminum 7075 alloy were carried out using 1500 ton machine with and without die cooling system. Cooling of extrusion die has been performed by the flow of liquid nitrogen and controlled by laser thermometer. Billet was 180 mm in diameter and 500 mm in length. The preheating temperatures of billet, container and die were 390℃, 400℃ and 450℃, respectively. Ram speed was kept with 1.25 mm/sec first. The change of ram speed was carried out during extrusion according to the observation of surface defects such as crack or tearing. Extrudates of 8.3 m in length, 100 mm in width and 15 mm in thickness were obtained to observe and analyze surface defects by optical microscopy and EBSD (Electron BackScattered Diffraction). In case of extrusion without die cooling cracks on the surface and tearing in the corner of extrudate occurred in the middle stage and developed in size and frequency during the late stage of extrusion. At the extrusion with die cooling the occurrence of defects could be suppressed on the most part of extrudate. EBSD micrographs showed that cracks and tearings have been resulted from the same origin. Surface defects were generated at the boundaries of grains formed by secondary recrystallization due to surface overheating during extrusion.