• Journal of the KSME
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• v.57 no.8
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• pp.38-43
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• 2017

전자산업 중에 첨단 현장인 반도체칩 제조공장을 예전 기억으로부터 소환하여 '스마트 팩토리'에 대해 한 번 생각해보았다.

• Proceedings of the KIEE Conference
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• 1997.07f
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• pp.1957-1960
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• 1997

일반적으로, Thyristor와 같은 반도체 소자는 수명이 반영구적이라고 알려져 왔으나, 실제로는 사용 시간이 지남에 따라 열화 과정을 가지는 것으로 보고되고 있다. 이는 소자 제조 공정상의 결함이나 가공 불량, 소자 접합면에 존재하는 물리적 불균질성 등이 원인이 되는데 이들 원인으로 인해 반도체 소자내에 취약부위가 존재하게 된다. Thyristor 소자 응용 시스템에 있어서, 운용 중 발생되는 전기적 물리적 스트레스는 Thyristor 소자내의 취약부위에 집중되는데, 시간이 지남에 따라 취약부위가 확산되고 열화가 가속되어 갑작스런 소자 파손으로 이어지게 된다. 본 논문에서는 Thyristor 소자의 열화 과정을 이론적인 측면에서 해석하고, 실제 산업현장에서의 Thyristor 열화 발생 사례를 중심으로 대용량 Thyristor의 열화 평가방법에 대하여 고찰한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.263-263
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• 2010

실제 옷처럼 입는 컴퓨터를 구현하거나 복잡하고 움직임이 많은 사람의 장기 등 생체에 이식 가능한 정보 전자 소자를 개발하려는 시도가 많이 이루어지고 있다. 현재는 기존의 반도체 공정과 실리콘 소재를 기반으로 연구 결과가 보고되고 있는데, 이는 소자 제작에 있어서 높은 공정 온도 등으로 인해 응용성이 제한되는 상황이다. 우리는 metal oxide 나노선과 단일벽 탄소나노튜브 (SWCNT)를 성장하여 각각 슬라이딩 전이법과 thermal tape 전이법을 이용하여 원하는 기판에 전이하고 소자를 제작하였다. metal oxide 나노선은 슬라이딩 전이를 통해 정렬된 상태로 패턴을 제작하였으며, SWCNT는 density 제어와 채널 크기 조정을 통해 반도체성 채널을 유도하여 소자 특성을 확보하였다. 또한 각 나노선의 전계효과소자와 SWCNT로 구성된 PMOS inverter를 유연한 고분자 필름기판위에 구현하고, 이를 스트레칭이 가능한 스테이지를 이용해 strain 대비 전기특성 변화를 분석하였다. 유연성이 좋은 나노선/나노튜브로 제작된 해당 소자는 전체 소자가 스트레칭이 가능할 수 있게 연결구조를 디자인하여 수십% 의 stain에도 각각의 전기특성이 유지되었다. 이처럼 스트레칭이 가능한 1차원 나노소재 소자는 그 유연성을 바탕으로 입는 옷처럼 구겨지거나 늘여지게 되는 다양한 스트레칭 상황에도 특성이 보장되어 미래 정보전자소자로 많은 응용이 가능할 것으로 예상된다.

• 전기의세계
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• v.48 no.10
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• pp.19-25
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• 1999

• 전기의세계
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• v.28 no.1
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• pp.15-19
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• 1979

• The Magazine of the IEIE
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• v.10 no.5
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• pp.6-8
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• 1983

• Journal of the Korean Institute of Navigation
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• v.21 no.3
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• pp.75-81
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• 1997

The switching components to control the speed of dc motor, which perform vital fuction in a modern motor vehicle or a ship, are susceptibile to suffer damage or upset by switching transient. An equivalent circuit was derived, in this paper, to select an ideal component having immunity against the switching transient among varisotor, zenner diode, etc. Furthermore, we have carried out the optimal improved transient protection circuit design in the view of cost effectiveness, proper wave form of transient defined by the international regulations. The process and cause of the damages in the switching components were examined. Then, the immunity improvement of semiconductor switching components to control a dc motor has been achieved considering impedance condition accoring to the variation of the diverting transient current.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.6
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• pp.709-714
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• 2018

This study researched the reasons for changing polarity in accordance with junction properties in an interface of semiconductors. The contact properties of semiconductors are related to the effect of the semiconductor's device. Therefore, it is an important factor for understanding the junction characteristics in the semiconductor to increase the efficiency of devices. For generation of various junction properties, carbon-doped silicon oxide (SiOC) was deposited with various argon (Ar) gas flow rates, and the characteristics of the SiOC was varied based on the polarity in accordance with the Ar gas flows. Tin-doped zinc oxide (ZTO) as the conductor was deposited on the SiOC as an insulator to research the conductivity. The properties of the SiOC were determined from the formation of a depletion layer by the ionization reaction with various Ar gas flow rates due to the plasma energy. Schottky contact was good in the condition of the depletion layer, with a high potential barrier between the silicon (Si) wafer and the SiOC. The rate of ionization reactions increased when increasing the Ar gas flow rate, and then the potential barrier of the depletion layer was also increased owing to deficient ions from electron-hole recombination at the junction. The dielectric properties of the depletion layer changed to the properties of an insulator, which is favorable for Schottky contact. When the ZTO was deposited on the SiOC with Schottky contact, the stability of the ZTO was improved by the ionic recombination at the interface between the SiOC and the ZTO. The conductivity of ZTO/SiOC was also increased on SiOC film with ideal Schottky contact, in spite of the decreasing charge carriers. It increases the demand on the Schottky contact to improve the thin semiconductor device, and this study confirmed a high-performance device owing to Schottky contact in a low current system. Finally, the amount of current increased in the device owing to ideal Schottky contact.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.43-51
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• 2023

In this paper, we introduce the development trends of power devices which is the key component for power conversion system in electric vehicles, and discuss the characteristics of the next-generation wide-bandgap (WBG) power devices. We provide an overview of the characteristics of the present mainstream Si insulated gate bipolar transistor (IGBT) devices and technology roadmap of Si IGBT by different manufacturers. Next, recent progress and advantages of SiC metal-oxide-semiconductor field-effect transistor (MOSFET) which are the most important unipolar devices, is described compared with conventional Si IGBT. Furthermore, due to the limitations of the current GaN power device technology, the issues encountered in applying the power conversion module for electric vehicles were described.

• Korean Journal of Optics and Photonics
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• v.18 no.1
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• pp.50-55
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• 2007

Using the Selective Area Growth (SAG) technology of Metal Organic Chemical Vapor Deposition (MOCVD), we successfully integrated an active device and passive devices on the same substrate. In other words, we integrated a Semiconductor Optical Amplifier (SOA) as an active device and an S-bend waveguide and a Multi Mode Interference (MMI) waveguide as passive devices. The SOA is successfully integrated with passive devices on the same substrate. The Cross-Gain Modulation (XGM) characteristic of the integrated SOA and the loss of an MMI and an S-bend waveguide were measured. Measured XGM characteristics of the SOA showed an extinction ratio of 8.82 dB. The total loss of the MMI and S-bend waveguide was 18 dB.