• Bulletin of the Korea Photovoltaic Society
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• v.2 no.1
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• pp.6-17
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• 2016

최근 태양광 시장은 생산량 증가와 제조단가 하락이 동시에 이루어지고 있으며 결정질 실리콘 태양전지가 시장을 주도하고 있다. 그 중에서도 결정질 실리콘 태양전지는 제조단가의 40% 이상을 차지하는 실리콘 원자재 비용을 줄이기 위해 두께를 줄이고자하는 노력에 관심이 집중되고 있다. 본 논문에서는 상용 결정질 실리콘 태양전지에서 사용되는 기술이 박형 결정질 실리콘 태양전지에 적용될 때 생기는 문제점과 이를 극복하기 위한 기술에 대해 박형 실리콘 웨이퍼, 박형 결정질 실리콘 태양전지, 박형 결정질 실리콘 태양전지 모듈 전반에 걸쳐 논하려고 한다.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.