• Title/Summary/Keyword: 박리와변형

Search Result 20, Processing Time 0.01 seconds

A Study on Conservation Treatment for Excavated Carbonization Wooden Object : Comparative Experiment on the PEG Method and Sugar Alcohol Method (출토 탄화 목제유물의 보존처리 : PEG법과 당알코올법 실험비교)

  • Lee, Hyun-Hye
    • Journal of Conservation Science
    • /
    • v.24
    • /
    • pp.57-66
    • /
    • 2008
  • It is reported that excavated carbonized wooden objects tend to have more peeling and deformation stemming from the coexisting of different types of parts of objects. However, there is little research results on this. In this experiment, the sugar alcohol method was used and then compared with the results of the PEG4000 method which widely uses. This research targets: prediction of strength by weight increase, investigation of the dimensional stabilization effects by measuring the rate of shrinkage change, condition of drug penetration and change of wood texture by using a scanning electron microscope. As the results, the PEG4000 method needs a phased approach over 80% impregnation. On the other hand, the S A method remains steady from over 40% impregnation. The Deformation of carbonized wooden objects used in this experiment is considered as the phenomenon by shrinkage of non-carbonized parts. The PEG4000 method is verified the shrinkage in the samples treated with 20%, 40% and 60%; the S A method is verified the shrinkage in the samples treated with 20%.

  • PDF

Chemical Charge Doping in Graphene by Sulfuric Acid Optically Separated from Native Mechanical Strain

  • An, Gwang-Hyeon;Lee, Dae-Eung;Ryu, Sun-Min
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.623-623
    • /
    • 2013
  • 그래핀(graphene)의 라만 스펙트럼은 전하밀도(charge density)와 기계적 변형(strain)에 민감하여 수많은 연구에 활용되고 있다. 그러나 실제 시료에서 관찰되는 두 물질량의 복잡한 변이를 정량 분석하기 위해서는 기계적 변형뿐만 아니라 전하밀도의 영향에 대한 신뢰도 높은 검정곡선이 필요하다. 본 연구에서는 기계적 박리법으로 만들어진 그래핀에서 나타나는 기계적 변형과 황산 수용액이 미치는 p-형 화학도핑(chemical doping)의 영향을 라만 분광법을 이용하여 연구하였다. 농도 변화에 따른 G와 2D 피크의 진동수 변화는 정전기적 방법을 이용하여 보고된 결과보다 높은 재현성을 보여 검정곡선으로 활용되기에 적합함을 알 수 있었다. 본 연구에서는 514 nm 이외에도 널리 활용되는 몇 가지 파장에서 "전하밀도-변형" 검정곡선을 제시하고자한다.

  • PDF

Dispersion in the Unsteady Separated Flow Past Complex Geometries (복합지형상에서 비정상 박리흐름에 의한 확산)

  • Ryu, Chan-Su
    • Journal of the Korean earth science society
    • /
    • v.22 no.6
    • /
    • pp.512-527
    • /
    • 2001
  • Separated flows passed complex geometries are modeled by discrete vortex techniques. The flows are assumed to be rotational and inviscid, and a new techlnique is described to determine the stream functions for linear shear profiles. The geometries considered are the snow cornice and the backward-facing step, whose edges allow for the separation of the flow and reattachment downstream of the recirculation regions. A point vortex has been added to the flows in order to constrain the separation points to be located at the edges, while the conformal mappings have been modified in order to smooth the sharp edges and to let the separation points free to oscillate around the points of maximum curvature. Unsteadiness is imposed to the flow by perturbing the vortex location, either by displacing the vortex from the equilibrium, or by imposing a random perturbation with zero mean to the vortex in equilibrium. The trajectories of passive scalars continuously released upwind of the separation point and trapped by the recirculating bubble are numerically integrated, and concentration time series are calculated at fixed locations downwind of the reattachment points. This model proves to be capable of reproducing the trapping and intermittent release of scalars, in agreement with the simulation of the flow passed a snow cornice performed by a discrete multi-vortex model, as well as with direct numerical simulations of the flow passed a backward-facing step. The results of simulation indicate that for flows undergoing separation and reattachment the unsteadiness of the recirculating bubble is the main mechanism responsible for the intense large-scale concentration fluctuations downstream.

  • PDF

Deformation Behavior Investigation of Materials by Debonding Failure in Adhesion and Repairing-strengthening Methods of RC Construction (RC구조물 접착 보수·보강 공법의 박리와 연관한 재료의 변형 거동 분석)

  • Han, Cheon-Goo;Byun, Hang-Yong;Park, Yong-Kyu
    • Journal of the Korea institute for structural maintenance and inspection
    • /
    • v.11 no.5
    • /
    • pp.89-98
    • /
    • 2007
  • This study investigates the deformation behavior, related to debonding failure, of adhesion and repairing-strengthening materials of RC construction. A strain-stress curve shows that when the stress of specimens reached the highest and then fails, the strain value of cement mortar is $2.0{\times}10^{-3}$, while concrete was indicated at around $1.3{\times}10^{-3}$, epoxy resins are $0.8{\times}10^{-3}$, polymer mortar is $2.5{\times}10^{-3}$, steel plate is $2.5{\times}10^{-3}$, and carbon bar was $9.1{\times}10^{-3}$, respectively. For a thermal expansion coefficient with temperature variation, those basis materials, cement mortar and concrete, exhibited around $10{\mu}{\varepsilon}/{^{\circ}C}$, but adhesive materials, such as epoxy resins and polymer mortar, were $41{\sim}54{\mu}{\varepsilon}/{^{\circ}C}$ and $-0.5{\sim}0.7{\mu}{\varepsilon}/{^{\circ}C}$, respectively. In the case of steel plate is similar to basic materials but carbon fiber is indicates at $-1.7{\mu}{\varepsilon}/{^{\circ}C}$, which is the lowest value. Especially, between basic and adhesive materials, the thermal expansion coefficient was highly different. Although the coefficient depends on the type of epoxy resins, it is clear that the epoxy resins are susceptible to be debonded in nature, when the difference of environmental temperature varies more than $20{\sim}35{^{\circ}C}$.

Evaluation of the Effect of Aggregate Structure on Rutting Performance of Asphalt Pavement (아스팔트 포장의 소성변형에 대한 골재 구조의 영향 평가)

  • Kim, Boo-Il
    • International Journal of Highway Engineering
    • /
    • v.9 no.4
    • /
    • pp.135-147
    • /
    • 2007
  • Segregation in asphalt pavements occurs as a result of the non-uniform distribution of coarse and fine aggregates and causes premature distresses, such as cracking, raveling, and stripping. The effect of segregation on rutting, however, has not been clearly identified. Experimental and analytical work performed in this study indicates that rutting performance is affected by segregation of mixtures. However, the aggregate structure of mixtures appears to be a more critical factor that determines the rutting performance, rather than the level of segregation. Based on the field mixtures evaluated, an increase of coarse aggregate volume in an asphalt mixture is an important factor that results in good rutting performance. This effect holds true for mixtures with lower levels of air voids, but for mixtures with higher levels of air voids, the air voids effect becomes dominant, resulting in a reduction in rutting performance. An air void content of 10% appears to be a threshold that determines the rutting performance of Superpave mixtures. Once the air void content exceeds 10%, the rutting performance of Superpave mixtures decreases significantly, despite the coarse aggregate volume.

  • PDF

Charge Doping Revealing Molecular Diffusion of Sulfuric Acid and Water through a Graphene-Silica Interface

  • An, Gwang-Hyeon;Lee, Dae-Eung;Ryu, Sun-Min
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2014.02a
    • /
    • pp.197.2-197.2
    • /
    • 2014
  • 그래핀(graphene)의 라만 스펙트럼은 전하밀도(charge density)와 기계적 변형(strain)에 민감하여 연구에 널리 활용되고 있다. 본 연구에서는 기계적 박리법으로 만든 그래핀에 황산 수용액으로 p-형 화학도핑(chemical doping)을 유발시키고 전하밀도의 변이에 따른 라만 스펙트럼의 변화를 조사하였다. 이러한 변화를 통해 황산과 물 분자의 계면 확산을 이해하고, $SiO_2/Si$ 기판의 화학적 특성이 미치는 영향을 파악하고자 하였다. 분자의 효율적인 계면 확산을 위해 고온 산화반응을 이용하여 그래핀의 기저면에 나노공(nanopore)을 만든 후, 액상에서 라만 스펙트럼을 측정하였다. 증류수 속에 담궜을 때 물 분자가 그래핀-기판 계면 사이로 확산되면서 열처리에 의해 유발된 정공이 사라짐을 확인하고, D-봉우리의 가역적인 변화로부터 그래핀의 구조적 변화를 유추하였다. 황산 농도를 증가시켰을 때 G와 2D-봉우리의 진동수가 상호간에 일정한 비율로 증가하여 정공의 밀도가 증가함 알 수 있었다. 동일한 시료에 대해 황산의 농도를 감소시킴으로써 p-형 도핑을 제거하고 동일한 반응을 가역적으로 반복할 수 있었다. 상기한 분자의 2차원 확산 현상은 나노공의 유무와 기판의 전처리 조건에 따라 크게 달라진다는 사실을 확인 할 수 있었다. 또한 여러 파장에서 측정된 전하밀도와 기계적 변형에 의한 G와 2D-봉우리의 진동수 변화로부터 다른 연구자들이 활용할 수 있는 검정곡선을 제시하였다.

  • PDF

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity (유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측)

  • Um, Hui-Jin;Hwang, Yeon-Taek;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.29 no.3
    • /
    • pp.37-42
    • /
    • 2022
  • Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

Comparision of Inclusion TechnicRue with Open Technique in Patients with Bentall Procedures (Bentall수술에서 inclusion technique 과 open technique의 비교)

  • 김정택;문준호
    • Journal of Chest Surgery
    • /
    • v.30 no.5
    • /
    • pp.506-511
    • /
    • 1997
  • To understand the clinical results of aortic root replacement with either inclusion or open technique, we analysed 53 patients who underwent replacement of the aortic root with composite graft between October,1980, and May, 1995. Annuloaortic ectasia was the most common indication for operation(29 patients), follwed by aortic dissection(22 patients). Among 53 patients, 19(35%) had Marfan syndrome. Three patients died during hospitalization (Mortality: 5.5%). The follow up was possible in 48 patients(Follow-up rate; 94%,mean duration;37 months). The actuarial survival rate at 24 months was 95% in open technique group, and 87% in inclusion technique group. Late complications developed in 10 patients. Dissecting aneurysm in the remaining aorta was noted in 3 patients with inclu ion 1,schnique, and a pseudoaneurysm from coronary artery anastomosis site developed in a patient with inclusion technique. In conclusion, there was no statistical differences in survival for 24 months between inclusion technique and open technique group. But late problems in the remaining aorta or death from unknown cause occurred with moderate frequency : careful follow-up after aortic root replacement thought to be important for long term survival.

  • PDF

Reliability of Cu Interconnect under Compressive Fatigue Deformation Varying Interfacial Adhesion Treatment (유연소자용 기판과의 접착 특성에 따른 구리 배선의 압축 피로 거동 및 신뢰성)

  • Min Ju Kim;Jeong A Heo;Jun Hyeok Hyun;So-Yeon Lee
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.30 no.4
    • /
    • pp.105-111
    • /
    • 2023
  • Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.

Large-strain Soft Sensors Using Elastomers Blended with Exfoliated/Fragmented Graphite Particles (탄성중합체와 박리 후 파쇄된 흑연입자 복합재를 이용한 대변형률 연성 센서)

  • Park, Sungmin;Nam, Gyungmok;Kim, Jonghun;Yoon, Sang-Hee
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.40 no.9
    • /
    • pp.815-820
    • /
    • 2016
  • An elastic polymer (e.g., PDMS) blended with EFG particles is a promising conductive composite for fabricating soft sensors that can detect an object's deformation up to or more than 50%. Here, we develop large-strain, sprayable soft sensors using a mixture of PDMS and EFG particles, which are used as a host elastomer and electrically conductive particles, respectively. A solution for a conductive composite mixture is prepared by the microwave-assisted graphite exfoliation, followed by ultrasonication-induced fragmentation of the exfoliated graphite and ultrasonic blending of PDMS and EFG. Using the prepared solutions for composite and pure PDMS, 1-, 2-, and 3-axis soft sensors are fabricated by airbrush stencil technique where composite mixture and pure PDMS are materials for sensing and insulating layers, respectively. We characterize the soft strain sensors after investigating the effect of PDMS/EFG wt% on mechanical compliance and electrical conductance of the conductive composite.