• Proceedings of the Korean Society of Computer Information Conference
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• 2017.07a
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• pp.342-343
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• 2017

본 논문에서는 만성 발목 불안정성이 있는 환자의 발목 재손상을 예방하고자 한다. 이를 위하여 발목의 안쪽 굽힙(Dorsiflexion)과 바깥쪽 굽힘(Plantarflexion)의 각도를 측정한다. 각도가 일정 범위 내에 있고 고통을 호소하지 않으면 정상으로 간주한다. 하지만 각도가 일정 범위에 못 미치고 고통을 호소하면 이상이 있는 것으로 간주하여 그에 대한 치료법(therapy)을 찾아낸다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.10a
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• pp.125-126
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• 2017

This paper aims to prevent re-damaging of the ankles of patients with chronic instability in ankles. For this purpose, the angles of dorsiflexion and plantarflexion of ankle will be measured. If the angle is within prescribed range and the patient does not complain of pain, it will be deemed normal.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.10a
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• pp.123-124
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• 2017

This paper deals with the movement of the human neck bone. The neck bone is also called a cervical spine. Measure the angle of lateral flexion and rotation of the neck bone. If the measured value deviates from the normal value or is accompanied by pain, it is considered that there is an abnormality and the treatment method is suggested.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.36-36
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• 1999

한국중공업(주)에서 수행한 KSTAR 진공용기 시작품 제작이 완성됨에 따라 제작과 관련된 종합기술을 분석하여 보았다. KSTAR 진공용기 시작품(그림1)은 전체의 1/4섹터인 90도 부분으로서 NBI(Neutral Beam Injection) 포트를 포함하는 45도 섹터와 축소포트(Reduced Port)를 포함하는 45도 섹터를 각각 먼저 제작한 후 두 부분을 용접하여 최종 시작품을 완성하였다. 용접은 SMAW법과 GTAW법 등 두가지 방법을 사용하였으며, 초기 용접시는 용접 면적이 작기 때문에 GTAW법을 이용하였고, 마무리 용접과 같이 용접 면적이 넓고 거친 부분에는 SMAW법을 이용하여 용접하였다. 모든 용접이 완전통과 용접이기 때문에 구조적 안전 면에서 좋으나, 진공측면에서는 다소 미흡한 점이 있다. 시작품은 상하 대칭구조로서 원통부분, 원형부분, 원추부분, 너클부분 (그림2) 등으로 나뉘어 지며 이중 원형품은 금형을 이용하여 성형하였고, 나머지 부분은 굽힘가공 후 절단적업을 하였다. 진공용기 조립은 안쪽과 바깥쪽 내벽부터 용접한 후 폴로이달 리브를 용접하고 외벽을 용접한다. 수평포트와 수직포트를 위해 스터브를 용접한 후 미리 용접해둔 NBI 포트 및 축소포트를 부착시켰다. 용접부위의 누설시험을 위한 방법으로, 용접주위 표면에서 개구하고 있는 홈에 적색 침투액을 침투시켜 침투 후 이 액을 홈의 개구로부터 빨아 내어 용접부위 표면상태에서 실제의 홈의 폭보다 확대한 홈의 지시모양으로 나타내게 하여 누설여부를 알기 쉽게 하는 액체 침투 탐상법을 적용하였다. 지시모양의 크기가 5mm 이상인 부분에 대해서는 재용접을 하였다. 누설 시험으로 초음파 탐상시험이 본제품 제작시 수행되어야 한다. 완성된 시작품에 대해 3군데의 위치에서 각각의 부분들이 용접되기 전과 후에 치수를 각각 측정하여 비교하였다. 또한 포트들에 대해서도 용접 전후 치수를 각각 측정하였다. 이러한 측정은 줄자를 사용하여 측정하였으므로 차 후 3차원 정밀 측정이 수반되어야 한다. 이상과 같이 시작품 제작을 통하여 문제점을 파악하고 개선책을 마련함으로서 향 후 KSTASR 진공용기 본 제품 제작할 때 반영코자 한다.

• Journal of Aerospace System Engineering
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• v.15 no.1
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• pp.72-79
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• 2021

In this study, as part of the development of an autonomous flying personal aircraft, an equivalent model of the main wing assembly of an Optionally Piloted Personal Air Vehicle (OPPAV) was developed. Reliability of the developed equivalent model was verified by eigenvalue analysis. The main wing assembly consisted of a main wing, an inboard pod, and an outboard pod. First, for developing an equivalent model of each component, components to produce the equivalent model were divided into several sections. Nodes were then created on the axis of the equivalent model at both ends of each section. In addition, static analysis with unit force and unit moment was performed to calculate the deformation or the amount of rotation at the node to be used in the equivalent model. Equivalent axial, bending, and torsional stiffness of each section were calculated by applying the beam theory. Once the equivalent stiffness of each section was calculated, information of a mass and moment of inertia for each section was entered by creating a lumped mass in the center of each section. An equivalent model was developed using beam element. Finally, the reliability of the developed equivalent model was verified by comparison with results of mode analysis of the fine model.