• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.867-868
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• 2006

리니어 모터는 일반적으로 회전하는 모터와 같이 여러 형상의 극간에서 발생되는 힘의 균형에 의해서 구동되는 것이 일반적이다. 특히 하나의 극간에서 미소 구동하는 리니어 모터는 구동력과 실제 이동하는 위치 사이에서 댐핑이나 무게와 함 사이에서 발생하는 가속력의 차이에 의해서 주어진 힘의 파형과 움직이는 위치의 괴적이 만들어가는 이동자의 위치 사이에는 다소 시간 처짐이 발생하게 된다. 본 논문에서는 구동력과 실제 이동하는 위치 사이의 시간 처짐의 원인으로 알려져 있는 딤핑의 조건을 변화시키고 이에 다른 구동력의 변화를 알아보았다. 댐핑이 전형 없는 조건과 댐핑이 조금씩 증가함으로 인해서 주어진 시스템의 기계적 공진 영역에서 발생하는 여러 가지 구동특성을 정량적으로 평가해 보았다. 60[Hz]가 공진인 이동자와 탄성체로 이루어진 시스템에서 58-62[Hz]에서 구동될 경우 힘의 주파수와 가해진 힘에 다라 이동자의 초기 거동을 알아보았으며 초기 0.3초 구간에서 구동되는 특성을 알아보았다. 전체적으로 이동자의 구동 괴적과 주어진 힘의 파형 사이에서 발생하는 시간 처짐은 댐핑계수에 가장 지배적인 영향을 받았으며 구동 힘의 주파수가 공진주파수보다 작으면 점점 증가하고 크면 점점 감소하는 경향을 가지며 공진주파수의 구동력이 가해진다면 시간 처짐은 거의 변화가 없음을 알 수 있었다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.10
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• pp.73-78
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• 2003

MEMS technology in the field of aerospace engineering is more important with light weight and high resolution. Therefore the investigation of thin films properties is issued and the residual stress of thin filrns is one of the important problems to solve. Ion implantation without thermal annealing is applied for the stress gradient relaxation of LPCVD polysilicon films used as the structural part in MEMS. He+ and Ar+ ion implantations reduce the stress gradient of polysilicon films. The property modification of polysilicon films by ion implantation is also investigated. The elastic modulus and hardness of polysilicon films with ion implantation is studied by CSM method which is an advanced nano-indentation method. Ion implantation decreases the elastic modulus and hardness of polysilicon films. However, they are improved with increasing ion dose.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.26 no.4
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• pp.271-274
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• 2013

Inclinometer sensors are widely applied in many fields. Especially in the field of construction of high-rise buildings also measure the horizontal and vertical help has been applied to monitor. Recent micro electro-mechanical system(MEMS) technology with the development of the many sensors have been developed. In this paper, a MEMS inclinometer is based on a MEMS accelerometer. The sensor can measure the angle of inclination using the relationship between static acceleration and gravity acceleration from an accelerometer. From this principle, inclinometer has been developed that has more accurate. The accuracy is proved by the experiment with laser displacement. Results in the experiment express high-accuracy, stability and economics of MEMS inclinometer. In conclusion, wireless MEMS inclinometer sensor is expected to be applicable in the areas of construction and many other industries with accurate and convenient monitoring system.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.4
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• pp.524-530
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• 2002

Micro electric spark discharge device was fabricated on a FOTURAN glass wafer using MEMS processing technique and its performance of electron discharge and subsequent formation of ignition kernel were tested. Micro electric spark device is an essential subsystem of a power MEMS that has been under development in this laboratories. In a combustion chamber of sub millimeter scale depth, spark electrodes are formed by electroplating Ni on a base plate of FOTURAN glass wafer. Optimization of spark voltage and spark gap is crucial for stable ignition and endurance of the electrodes. Namely, wider spark gaps insures stable ignition but requires higher ignition voltage to overcome the spark barrier. Also, electron discharge across larger voltage tends to erode the electrodes limiting the endurance of the overall system. In the present study, the discharge characteristics of the proptotype ignition device was measured in terms of electric quantities such as voltage and currant with spark gap and end shape as parameters. Discharge voltage shows a little decrease in width of less than 50㎛ and increases with electrode gap size. Reliability test shows no severe damage over 10$\^$6/ times of discharge test resulting in satisfactory performance for application to proposed power MEMS devices.