• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.2
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• pp.104-111
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• 2004

Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.119-126
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• 2014

Micro-holes of conductive ceramic are required in micro structures. Micro-electrical discharge machining (Micro-EDM) is an effective machining method since EDM is as process for shaping hard metals and complex-shaped holes by spark erosion in all kinds of electro-conductive materials. However, as the depth of micro hole increases, the machining condition becomes more unstable due to inefficient removal of debris between the electrode and the workpiece. In this paper, micro-EDM was performed to evaluate machining characteristic such as electrode wear, machining time, taper angle, radial clearance with varying voltage and ultrasonic vibration on 10 vol.% Carbon-nanotube reinforced conductive $Al_2O_3$ composite fabricated by spark plasma sintering in previous research.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.4
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• pp.52-59
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• 2005

When a micro hole is machined by EDM with a cylindrical electrode, the hole diameter is different at the inlet and the outlet of the micro hole. The taper shape of the micro hole is caused by not only wear of the electrode but the eroded particles. The eroded particles cause secondary discharge during machining the micro hole. As a result, the diameter of the inlet becomes larger than that of the outlet. In this paper, a new method is proposed to reduce the difference in diameter between the inlet and the outlet of the hole. Observed was that the feed depth and machining time affect the formation of taper shape On this experimental basis, ultrasonic vibration was applied to reduce machining time, and capacitance was changed during machining to use the difference in discharging energy of different capacitances. Using the proposed method, a straight micro-hole was fabricated.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.111-118
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• 2020

Recently, bioenergy research using microalgae, one of the most promising biofuel sources, has attracted much attention. Cell disruption, which can be classified as physical or chemical, is essential to extract functional ingredients from microalgae. In this study, we investigated the cell disruption efficiency of Chlorella sp. using low-frequency non-focused ultrasound (LFNFU). This is a continuously physical method that is superior to chemical methods with respect to environmental friendliness and low processing cost. A flat panel photobioreactor was employed to cultivate Chlorella sp. and its growth curve was fitted both with Logistic and Gompertz models. The temporal change in cell reduction by cell disruption using LFNFU was fitted with a Logistic model. The experimental conditions that were investigated were the initial concentration of microalgal cells, relative amplitude of output ultrasound waves, processing volume of microalgal cells, and initial pH value. The optimal conditions for the most efficient cell disruption were determined through the various tests.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.591-597
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• 2001

Ti alloy is used for essential parts of aircraft for high temperature environment. Although Ti alloy has excellent performance in regard to mechanical properties, it is difficult ot find fatigue cracks by nondestructive ultrasonic inspection due to its two-phase microstructure, which consists of hard alpha and beta phases. Sound energy reflected from microstructural features in the component produces a background inspection noise which is seen even when no defects are present. This noise can inhibit the detection of critical internal defects such as pores cracks or inclusions. To obtain fundamental data on ultrasonic inspection of Ti alloy, ultrasonic testing was performed using a specimen with small drill holes and ultrasonic wave propagation velocites were measured.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.190-197
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• 2005

For precise micro-grooving and surface machining, a mechanism for creating elliptical vibration cutting (EVC) motion is proposed which uses two parallel piezoelectric actuators. And based on its kinematical analysis, variations of EVC path are investigated as a function of dimensional changes in the mechanism, phase difference and amplitude of excitation sinusoidal voltages. Using the proposed PZT mechanism, various types of two dimensional EVC paths including one dimensional vibration cutting path along the cutting direction and thrust direction can be easily obtained by changing the phase lag, the amplitude of the piezoelectric actuators, and the dimension of the mechanism.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.625-628
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• 2005

For precise micro-grooving and surface machining, ultrasonic cyclic elliptical cutting is proposed using two parallel piezoelectric actuators. The piezoelectric actuators are energized by sinusoidal voltages of varying phase which is essenstial to generating elliptical cutting. Experimental setup is composed of ultrasonic motor, single crystal diamond cutting tool, and precise motorized xyz stage. It is confirmed experimentally that the cutting performance, in terms of the cutting force, the burr formation, and the discontinuous chip formation is improved remarkably by applying ultrasonic elliptical vibration cutting.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1917-1919
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• 2003

본 연구에서는 바이오 및 환경 분야에 적용 가능한 미세 유체소자 제작에 있어서 4" 유리 / 유리 웨이퍼접합을 시도하였으며, 접합결과 90%이상의 접합면적을 보였다. 접합된 샘플을 산 및 알카리 조건에 따른 인장시험결과 모든 조건에서 약 $2kgf/mm^2$ 이상의 접합강도를 보였으며 파괴는 접합면이 아닌 모재에서 발생되었다. 또한 미세유체소자 제작에 있어서 초음파를 이용하여 유리를 가공하였으며, 폭 $300{\mu}m$, 깊이 $200{\mu}m$의 미세채널을 제작하였다.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.6
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• pp.573-580
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• 2004

The main goal of this study was to develop a micro-fabrication process for the capacitive micromachined ultrasonic transducer (cMUT). In order to achieve this goal, the former research results of the micro-electro-mechanical system (MEMS) process for the cMUT were analyzed. The membrane deposition, sacrificial layer deposition and etching were found to be a main process of fabricating the cMUT. The optimal conditions for those microfabrication were determined by the experiment. The thickness, uniformity, and residual stress of the $Si_3N_3$ deposition which forms the membrane of the cMUT were characterized after growing the $Si_3N_3$ on Si-wafer under various process conditions. As a sacrificial layer, the growth rate of the $SiO_2$ deposition was analyzed under several process conditions. The optimal etching conditions of the sacrificial layer were analyzed. The microfabrication process developed in this study will be used to fabricate the cMUT.