• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.1052-1055
• /
• 2001

In micro-drilling of brittle materials including glass, cracks occur at the exit surface. In drilling glass, the main type of crack is cone crack. Cone crack is generated by thrust force acting at the bottom surface of the workpiece. Cone crack size could be reduced by changing cutting conditions, but cone crack still existed. Two methods were proposed to prevent crack formation and perfect hole shapes were obtained. One method is attaching two glass plates with water and the other method is constraining two glass plates. The proposed methods eliminated tensile stress acting on the exit surface of glass and prevented crack propagation.

• Journal of Industrial Technology
• /
• v.19
• /
• pp.1-7
• /
• 1999

This is the pre-study to pile up the basic technique for the electro-discharge machining in the field of micro-drilling. The machined chips are flowed out from the machining area by the flow arisen from the high speed rotation of the electrode. The cylindrical shape electrode, whose diameter is 0.5mm, is clamped by the three point clamping type clamper and the clamper is attached at the front shaft of the high speed rotating DC motor. The current for machining is controlled by pulse width modulation technique and the machining conditions such as frequency and duty ratio are changed to find out the effect of the variables for machined results.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.4 no.1
• /
• pp.18-23
• /
• 2005

This paper reports experimental results on microdrilling process for silicon parts used in semiconductor equipments. An experimental system was developed consisting of a high speed precision machine, microscope system, and project profile instrument. The experimental results indicate that the amount of chipping at the entrance and exit of micro hole decreases as the spindle speed increases up to 18,000 rpm. At higher spindle speed, however, the amount of chipping increases rapidly. The amount of chipping and infeed rate show proportional relationship up to 20 m/min of infeed rate. Beyond that infeed rate, however, sudden increase in the amount of chipping has occurred.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.231-234
• /
• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric and hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $\textrm{Al}_2\textrm{O}_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• Proceedings of the Korean Printing Society Conference
• /
• 2002.05a
• /
• pp.32-32
• /
• 2002

디지탈 윤전 등사기 또는 디지털복사 인쇄기(digital duplicator)라고 불리우는 사무용 소형 단색 윤전 인쇄기는 컴퓨터 스캐닝 기술과 스텐실 열천공 기술의 발달로 손쉽게 인쇄기상에서 자동복사 제판이 가능해 짐에 따라 우리나라에 1990년대부터 학교, 관공서, 군 및 교회등의 시험지와 홍보전단지 인쇄용으로 널리 보급되었다. 여기에 사용되는 잉크는 카트리지에 장착식으로 공급되는데, 에멀젼 잉크로서 천공으로 이루어진 스텐실 화상 뒷면으로부터 가압 통과되어 인쇄용지에 윤전식으로 인쇄된다. W/O형 에멀젼 잉크가 그 기본 전형이 된 것은 스텐실의 미세구멍을 통과하도록 큰 로라압력을 받아야 하는 잉크는 우선적으로 높은 점도이어야 하나 수십 마이크론의 미세구멍을 쉽게 빠져 나가도록 침투성이 빨라야 하는 이중적 레올로지 특성이 요구되기 때문이다. 그러나 에멀젼의 원천적인 불안정성과 물과 기름의 상호 대립적인 물리 \ulcorner화학적 특성을 주목하고 번짐, 얼룩, 배면침투, 광택문제, 건조성 지연 등의 인쇄품질을 향상시키고져 그동안 많은 연구개발이 노력이 있어 왔다. 이에 대하여 세계 시장을 크게 장악하고 있는 일본의 특허를 주로 검토하여 디지털 인쇄기용 W/O 에멀젼 잉크 기술 및 현황에 대해서 연구 조사하였다.

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 1999.05a
• /
• pp.43-46
• /
• 1999

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2002.02a
• /
• pp.292-307
• /
• 2002

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2005.06a
• /
• pp.97-101
• /
• 2005

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2001.05a
• /
• pp.100-104
• /
• 2001

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.267-268
• /
• 2011