• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.11a
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• pp.65-67
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• 2002

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Fire Science and Engineering
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• v.25 no.4
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• pp.48-55
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• 2011

This paper presents the failure analysis of the rate of rise spot type heat detectors on artificially accelerated aging. The failures of heat detector turned out by two reasons. The first one is the separation of binder from plastic moulding, resulting in the leakage of air from heat chamber. The second reason is the crack of plastic. The large cracks were maybe created by these reasons, thermal expansion difference, mechanical stress, or growth of microcrack. In the sound detector, the separation and the crack were not occurred or not developed to the critical size. The glass fibers which increase the mechanical strength were added in the binder of detector 2010G. The densities of binder or plastic of each detector were similar. However, the TGA result shows that the thermal characteristics of 2005A and 2005B were not similar.

• Elastomers and Composites
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• v.49 no.1
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• pp.59-65
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• 2014

In this study, in order to complete curing reaction of the molding compound comprising an epoxy/anhydride at $71^{\circ}C$ for 40 hours, metal coordination complexes such as cobalt (II) acetylacetonate, potassium acetylacetonate, iron (III) acetylacetonate and chromium (III) octoate as a catalyst were applied to the epoxy/anhydride compounds respectively. The weight ratio of an epoxy part/an anhydride part was adjusted to improve the mechanical properties of the molding compound. According to the experimental results, an epoxy/anhydride compound containing chromium (III) octoate showed a high conversion at $71^{\circ}C$ for 40 hours as well as a proper processability at room temperature among the several metal coordination complexes. For the mechanical properties of the cured epoxy/anhydride compound, the compounds containing weight ratio from 0.9/1 to 0.5/1 of the epoxy part/anhydride part with chromium (III) octoate showed the high flexural strength, and higher compressive strength was shown with increasing of the hardener part.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.155-156
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.343-344
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• 2012

• The Optical Journal
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• s.135
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• pp.31-34
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• 2011

광학 속성을 가진 폴리머 소재는 새롭고 정교한 전자광학 장치를 가능하게 해주고, 커머셜 마켓과 의학 용품, 바코드 인식, 보안과 지문 추출기, 동작 인식 센서, CCD 카메라 및 레이저 collimation 장치들을 가능하게 한다. 현재의 발전된 폴리머 기술과 인젝션 몰딩 기술은 높은 생산성과 정밀도를 향상시켜 왔다. 본 고는 이러한 폴리머-하이브리드 옵틱 기술에 관한 최신 동향으로서 Optronics 340호에서 발췌, 정리한 것이다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.217-218
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.357-358
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• 2009

• The Optical Journal
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• s.87
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• pp.22-27
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• 2003

일본에서 먼저 100만화소급 이상의 모바일용 카메라모듈이 상품화되면서 우리나라도 그 뒤를 따르고 있는 가운데 렌즈에 있어서는 현재 Plastic lens와 연마 Glass lens로 국내에서는 대응하고 있지만 품질과 수량을 맞추기 위해 프레스 몰딩 Glass의 개발능력과 생산능력을 조속히 키우는 것이 시급하다. 또한 모바일용 카메라 모듈은 품질도 중요하지만 무엇보다 중요한 것은 생산능력, 제품의 균일성과 가격이다. 이를 위해 packaging공정은 현재