• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.66-72
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• 2002

Electronic Speckle Pattern Interferometry (ESPI) has been recently developed and widely used because it has advantage to be able to measure surface deformations of engineering components and materials in industrial areas with non-contact. The speckle patterns to be formed with interference and scattering phenomena can measure not only out-of-plane but also in-plane deformations, together with the use of digital image equipment to process the informations included in the speckle patterns and to display consequent interferogram on a computer monitor. In this study, the experimental results of a canti-levered plate using ESPI were compared with those obtained from the simple beam theory. The ESPI results of the canti-levered plate analyzed by 4-step phase shifting method are close to the theoretical expectation. Also, out-of-plane displacements of a spot welded cacti-levered plate were measured by ESPI with 4-step phase shifting technique. The phase map of the spot welded cacti-levered plate is quite different from that of the canti-levered plate without spot welding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.129-129
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• 2003

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.423-428
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• 2010

In this paper, we analyzed the characteristics of thermal deformation of the TPS which is a core part of engine in vehicle by measuring out-of-plane deformation using ESP!. Inspection area of a test piece was minimized to 5 cm by 5 cm by using a high resolution CCD and a zoom lens. 4-step phase shifting method was used along with phase unwrapping algorithm to get a continuous phase map, configurations and deformations were displayed as 3D images. When heating the test pieces while maintaining the temperature at about $70^{\circ}C$, the out-of-plane deformations were measured. The results showed that a test piece with longer distance traveled tends to show larger thermal deformation, we could observes a convex shaped deformation on the surface. The inner defect sample, we could monitor discontinuous pattern phase map, and a concave shaped deformation on the surface.

• Journal of Korean Ophthalmic Optics Society
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• v.12 no.4
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• pp.77-81
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• 2007

The spherical lens is typically classified by the refractive power into two groups such as (+) diopter lens and (-) diopter lens. The deformation occurred by the external force that is applied to a lens is caused by the increase or the decrease in the diopter of a lens. In this paper, the deformation of the lens was quantitatively measured by using ESPI (Electronic Speckle Pattern Interferometry) which have been used in the optical measurement field for past few years. ESPI has an advantage that the deformation of an object can be measured precisely by using coherence of the light. The experiment was carried out to the totally 16 types of plastic lens. It was confirmed that the deformation was decreased by increasing the diopter of the lens when same displacement was applied to the lens in case of (+) diopter lens and was increased by decreasing the diopter of the lens in case of (-) diopter lens. Also, it was found that the deformation of (+) diopter lens is less than that of (-) diopter lens. Therefore, with these results, it is expected that the possibility of the quantitative measurement for variation of the optical defect caused by the deformation of a lens when the deformation is occurred to the various types of the lens can be presented and that the application in the lens industrial field can be performed.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2001.11a
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• pp.130-134
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• 2001

ESPI는 물체 표면의 광학적 거치기에 의해 집속성이 우수한 Laser 광원이 물체 표면에 조사되면 미세하고 랜덤한 반점들로 관측된다. 이들은 밝고 어두운 반점 형태로 관측 위치나 렌즈와 상관없이 관측된다. ESPI법은 스트레인게이지, 홀로그래피 및 모아래 기법과는 달리 비접촉, 실시간, Whole-field, 레이저 파장 단위까지 측정이 가능하여 기존의 방법들의 문제점을 극복할 수 있는 신기술이라 할 수 있다. ESPI는 반도체와 같은 소형의 제품뿐만 아니라 기존에 측정하지 못했던 초고온, 대형 구조물의 변형도 정확하게 측정을 할 수 있어 많은 분야에 응용이 가능하다 또한 기존의 방법들을 대신하여 더욱 정밀한 측정을 할 수 있으며, 기존의 방법으로는 측정하지 못했던 특수한 경우에도 측정이 가능하다.(중략)

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1807-1812
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• 2007

A bulge testing system was developed to measure mechanical properties of thin film materials. A bulge pressure test system for pressurizing the bulge window of the film and a micro out-of-plane ESPI(Electronic Speckle Pattern Interferometric) system for measuring deflection of the film were included in the testing system developed. For the out-of-plane ESPI system, whole field speckle fringe pattern, corresponding to the out-of-plane deflection of the bulged film, was 3-dimensionally visualized using 4-bucket phase shifting algorithm and least square phase unwrapping algorithm. The bulge pressure for loading and unloading was controlled at a constant rate. From the pressure-deflection curve measured by this testing system, ain-plane stress-strain curve could be determined. In this study, elastic modulus of an electrolytic copper film 18 ${\mu}m$ was determined. The modulus was calculated from determining the plain-strain biaxial elastic modulus at the respective unloading slopes of the stress-strain curve and for the Poisson's ratio of 0.34.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.65-72
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• 2009

Laser interferometry is widely used as a measuring system in many fields because of its high resolution and its ability to measure a broad area in real-time all at once. In conventional laser interferometry, for example out-of-plane ESPI (Electronic Speckle Pattern Interferometry), in plane ESPI, shearography and holography, it uses PZT or other components as a phase shift instrumentation to extract 3-D deformation data, vibration mode and others. However, in most cases PZT has some disadvantages, which include nonlinear errors and limited time of use. In the present study, a new type of laser interferometry using a laser diode is proposed. Using Laser Diode Sinusoidal Phase Modulating (LD-SPM) interferometry, the phase modulation can be directly modulated by controlling the laser diode injection current thereby eliminating the need for PZT and its components. This makes the interferometry more compact. This paper reports on a new approach to the LD (Laser Diode) Modulating interferometry that involves four-frame phase shift method. This study proposes a four-frame phase mapping algorithm, which was developed to have a guaranteed application, to stabilize the system in the field and to be a user-friendly GUI. In this paper, the theory for LD wavelength modulation and sinusoidal phase modulation of LD modulating interferometry is shown. Using modulating laser and research of measurement algorithm does comparison with existent ESPI measurement algorithm. Algorithm measures using GPIB communication through most LabVIEW 8.2. GPIB communication does alteration through PC. Transformation of measurement object measures through modulating laser algorithm that develops. Comparison of algorithm of modulating laser developed newly with existent PZT algorithm compares transformation price through 3-D. Comparison of 4-frame phase mapping, unwrapping, 3-D is then introduced.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.772-776
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• 2004

The paper describes the quantitative determination of out-of-plane displacement from result of Shearogrpahy, which can measure the first-order partial derivative of out-of-plane displacement directly. However, the differential sensitivity of Shearography is related to the amount of shearing, which is manually adjustable in optical interferometer and affects the quantitative determination. The relationship between those is inspected by comparing ESPI with Shearography. From the result, the amount of shearing plays a modulation factor of out-of-plane displacement and small amount of shearing gives good agreement with out-of-plane displacement.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2001.11a
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• pp.124-129
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• 2001

점 용접부는 응력상태가 복잡하고, 피로균열은 판 두께, 너겟 직경, 용접 타점수, 부하 방식 등의 역학적인 인자와 재질, 화학성분, 표면 상태 등의 재료적인 인자, 그리고 용접전류, 가압력, 통전 시간등의 용접적인 인자의 영향을 동시에 받으며 3차원적으로 성장하므로 균열 성장 모드는 항상 혼합보드이고 균열이 박판 내면에서 발생. 성장하므로 검출이 곤란하여 균열 성장의 해석 및 예측이 어렵다/sup 1)/. 따라서 비접촉, 실시간, Whole-field, 레이저 파장 단위까지 측정이 가능하여 기존의 방법들의 문제점을 극복할 수 있고, 반도체와 같은 소형의 제품뿐만 아니라 기존에 측정하지 못했던 초고온, 대형 구조물의 변형도 정확하게 측정을 할 수 있는 ESPI법을 이용하여 일반가전 제품, 자동차 건축용에 많이 사용되고 있는 아연도금강판(SGCC)을 선택하여 단일 용접조건으로 점용접의 피치를 변화시켜 시험편을 제작하고 면외변위를 다각도로 측정하여 그 가능성을 검증하고자 한다.(중략)