• The KIPS Transactions:PartA
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• v.18A no.2
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• pp.61-68
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• 2011

Memory error debugging is one of the most critical processes in improving software quality. However, due to the extensive time consumed to debug, the enhancement often leads to a huge bottle neck in the development process of mobile devices. Most of the existing memory error detection tools are based on static error detection; however, the tools cannot be used in mobile devices due to their use of large working memory. Therefore, it is challenging for mobile device vendors to deliver high quality mobile devices to the market in time. In this paper, we introduce "PinMemcheck", a pin-based memory error detection tool, which detects all potential memory errors within $1.5{\times}$ execution time overhead compared with that of a baseline configuration by applying the Pin's binary instrumentation process and a simple data structure.

• Journal of the Korean Institute of Gas
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• v.27 no.2
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• pp.79-85
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• 2023

Recently, in the semiconductor process, large companies are seeking process changes from memory semiconductors to the foundry due to the increase in demand due to the 4th industry. industry is expanding. The characteristics of special gases and precursors, which are raw materials used to produce these semiconductor chips, are toxic, pyrophoric, inflammable, and corrosive. These semiconductor raw materials are operated in a closed system and do not leak to the outside during normal times, but when leaked, they spread to the inside of the gas box, and when proper ventilation is not provided inside the gas box, they spread to the outside, causing fires, explosions, or toxic substances. It can lead to major accidents such as leakage. Recently, there have been cases of accidents in which hazardous materials leaked from the closed system of the semi conductor process and spread to the inside and outside of the gas box. . In this study, we propose preventive measures based on the case of an accident in which raw material leaked from the VCR fitting, which is the connection part of the semiconductor raw material transfer pipe, and spread to the outside of the gas box.