• Clean Technology
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• v.19 no.3
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• pp.243-248
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• 2013

Thermally conductive materials are widely used in various applications where effective heat dissipation is required. Graphene shows high potential for various uses owing to high electrical conductivity, good mechanical strength, and high thermal conductivity. Generally previous works used organic solvents are generally used for the dispersion of graphene in fabrication procedure. In order to achieve clean fabrication it is required to use water media. In this study, we fabricated graphene attached poly(methyl methacrylate) (PMMA) microsphere via microfluidic method. With the aid of surfactant, graphene was well dispersed in water which was used as continuous flow. Thermal conductivity was improved with the small amount of graphene addition and this indicate potential use of this system for thermally conductive composite material.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.23-28
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• 2019

We report a supercapacitor cable, which consists of three-dimensional (3D) porous graphene coated onto the surface of carbon thread. The 3D porous framework of graphene was constructed by microwave-activated process using a graphene oxide-coated carbon thread. The use of microwave irradiation enabled to convert graphene oxide into reduced graphene oxide without any reducing agents and activate graphene sheets into exfoliated and porous graphene sheets. Combining two wire electrodes with a polymer gel electrolyte successfully completed supercapacitor device in a form of cable construction. The supercapacitor cables were highly flexible, and thus can be transformed into various shapes of devices and be integrated into textile items. A high area-capacitance of 38.1 mF/cm was obtained at a scan rate of 10 mV/s. This capacitance was retained 88% of its original value at 500 mV/s. The cycle life was also demonstrated by repeating a charge/discharge process during 10,000 cycles even under bent states, showing a high capacitance retention of 96.5%.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.12
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• pp.1875-1882
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• 2013

Micro-array technology contributes numerous achievements such as ordering of gene network and integration of genomic. This technology is well established as means for investigating patterns of gene expression. DNA micro-arrays utilize Affymetric chips where a large quantity of DNA sequences may be synthesized. There are two general type of conventional DNA array spotter: contact and piezoelectric. The contact technology used spotting pin technology to make contact with the glass slide surface. This may caused damage or scratches to the surface matrix where protein will be contaminated and may not bind specifically. Piezoelectric technology available at this present time on the other hand requires the analyzer to print the result that can only be done within the laboratory despite of mass production. Therefore, in this paper, high-throughput technology is developed for providing greater consistency in feature spot without touching the glass slide surface.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.105-109
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• 2018

We studied graphene synthesis to porous Cu to improve the characteristics of carbon dioxide reduction of cu. Cu powders were formed through Thermal Chemical Vapor Deposition(TCVD) to Porous Cu/Graphene structures synthesized with graphene. As a result of electrochemical experiments using a 0.1 M $KHCO_3$ electrolyte at an applied potential of -1.0 V to -1.4 V, the current density of Porous Cu/Graphene was 1.8 times higher than that of Porous Cu. As a result of evaluating the product, CO and $H_2$ were generated to Porous Cu electrode. On the other hand, the product of porous Cu/Graphene produced CO, $CH_4$ and $C_2H_4$. It is considered that the graphene causes longer carbon dioxide adsorption time, which means that the intermediates formed during the reaction remain on the electrode surface for a longer time. As a result, it can be concluded that the production reaction of the C2 compound could be continuously performed.

• Journal of Fisheries and Marine Sciences Education
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• v.20 no.3
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• pp.410-415
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• 2008

To evaluate the performance of nucleate boiling heat transfer between a plain and micro-fin surfaces, the experimental tests have been carried out under various conditions with fluorinert liquid FC-72, which is chemically and electrically stable. Two kinds of micro fins with the dimensions of $200{{\mu}m}{\times}20{{\mu}m}$ and $100{{\mu}m}{\times}10{{\mu}m}$ (width x height) were fabricated on the surface of a silicon chip. The experiments were performed on the liquid subcooling of 5, 10 and 20K under the atmospheric condition. The presented data showed a similar trend in the comparison with result of Rainey & You. Due to its expanded surface areas, the heat flux properties has been significantly enhanced on micro-fin surface comparing to the plain surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.124-130
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• 2015

The purpose of this study is to investigate friction characteristics according to micro-dimple patterns. The surface texturing of micro-dimple patterns was tested to examine the friction of pin-on-disk using flat-on-flat contact geometry. The patterns of both dimple circle and groove pattern were adopted to carry out the effect of those ones. In the low loads, such as 13.8N and 27.7N, the friction coefficients of groove pattern were lower than those of dimple circle pattern. In many other comparisons of normal loads, the groove pattern had lower friction forces, which showed the effect of surface texturing. The relationship between sliding time and friction forces showed that the increase of friction forces of groove pattern were relatively lower than those of dimple pattern. In conclusion, the dimple patterns of dimple-circle pattern and groove pattern strongly contributed to reducing the friction between contacting materials.

• Composites Research
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• v.35 no.2
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• pp.98-105
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• 2022

In this study, polyvinyl alcohol (PVA)/graphene oxide (GO)/iron oxide (Fe₃O₄) magnetic microgels were prepared using a microfluidic approach and the dye adsorption capacity of the microgels was confirmed. The adsorption capacity (q_e) of the gels was evaluated by varying the dye concentration, pH, and contact time with the microgels. The dyes used in this work were methylene blue (MB), crystal violet (CV), and malachite green (MG), and microgels showed the highest adsorption capacity (191.1 mg/g) in methylene blue. The microgels exhibited the highest adsorption capacity in the dye aqueous solution at pH 10 due to the presence of atomic nitrogen ions (N⁺) on the dye molecules. The adsorption isotherm studies revealed that the Langmuir isotherm is the best fit isotherm model for the dye adsorption on the microgels, indicative of monolayer adsorption. The kinetic analysis exhibited that the pseudo-second order model fits better than the pseudo-first order model, confirming that the adsorption process is chemisorption. In addition, the magnetic microgels showed good reusability and recovery efficiency. It was confirmed that the adsorption capacity of the gels maintains more than 70% of the initial capacity after 5 times of cycle experiments.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.158-158
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• 2016

최근 유연정보전자소자의 개발이 대두되고 있다. 이러한 개발 동향에 맞춰 정보전자소자의 각 소재를 유연화하는 연구가 진행되고 있다. 이 중 ITO 기반의 기존 투명전극은 투명전극으로써는 매우 높은 성능을 보이지만, 유연성이 매우 낮기 때문에 대체 투명전극에 대한 연구가 필수적이다. 그래핀, 전도성 고분자, Oxide/metal/oxide, 금속나노와이어 등 다양한 유연 투명전극에 대한 연구가 진행되고 있으나 ITO 급의 면저항/투과도를 얻지 못하고 있다. 은나노와이어는 ITO 대체로 주목받는 투명전극 중에 면저항/투과도가 가장 ITO에 유사하면서, 유연성까지 지니고 있는 장점을 가지고 있다. 반면 약 100 nm 직경의 1차원 나노와이어가 랜덤하게 분포되어 있기 때문에, 위치별로 균일성에 대한 이슈가 존재하고, 표면 조도가 매우 높기 때문에 (ITO ~ 1 nm, AgNW > 20 nm) OLED에 적용하기 어려운 문제가 존재한다. 또한 대면적 OLED에 적용하기에는 여전히 저항이 높은 문제가 존재한다. 본 연구에서는 이러한 은나노와이어의 높은 저항 문제를 해결하기 위해, 마이크로 급의 미세금속배선을 보조배선으로 도입하였다. 이러한 보조배선을 통해 대면적 소자에도 전류가 잘 흐를 수 있고, 이러한 전류가 은 나노와이어를 통해 소자 전면적에 균일하게 도달하여, 대면적에서 균일한 발광을 하게 된다. 본 은나노와이어/금속보조배선 구조는 면저항 4 ohm/sqr., 투과도 90%를 달성하였고 이는 기존 ITO보다 우수한 수치이다. 더욱이, 유연성까지 함께 확보하고 있어 유연 전극으로써의 활용도 충분히 가능하다. 이를 활용해 OLED를 제작한 결과 밝기와 발광균일도가 기존의 ITO를 활용한 것보다 훨씬 높아짐을 확인할 수 있었다.