• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.181-184
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• 2002

In these day, fabrication technologies for micro parts become more important with the increase of interest on microsystem and developed through the various approaches in the whole world. Among these technologies; micro mechanical machining is one of the most effective methods for the fabrication of micro parts. In this study, we fabricated micro shafts using micro endmill and micromachining system and measured the cutting force at the process. Also, Based on the data, we simulated the deformation of micro shafts due to the cutting force. Through the simulation results, it was verified that the cutting force at the process is enough to cause dimensional error at the micro shafts.

• 한국항공우주학회지
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• 제31권9호
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• pp.32-37
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• 2003

소형화의 추세는 마이크로 로켓의 연구에도 적용되어 MEMS 공정으로 제작된 마이크로 로켓들이 시도되었다. 본 논문에서는 마이크로 밀링을 사용한 3차원 마이크로 로켓의 제작과 연소 및 발사시험의 결과를 다루고자 한다. 로켓의 동체는 알루미늄 6061 합금을 사용하였다. 3차원 마이크로 노즐은 황동을 직경 127${\mu}m$의 마이크로 엔드밀로 절삭하여 가공되었다. 두 가지 크기의 노즐이 제작되었는데 하나는 노즐목의 직경이 1mm이고 다른 하나는 0.5mm이다. 로켓의 질량은 7.32g이고 추진제의 질량은 0.65g이었다. 추력 대 무게비는 1.58에서 1.74로 계산되며 지면에서 45도 각도로 발사된 비행시험결과 약 46m~53m의 수평거리를 비행하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.33-34
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• 2011

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.842-846
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• 1997

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.

• 한국정밀공학회지
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• 제6권4호
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• pp.11-20
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• 1989

마이크로 일렉트로닉스(Microelectronics)를 중심으로 하는 산업혁명이 진행되고 있는 시점에서 전자, 광학 또는 신소재 부품에 대한 형상과 치수 또는 표면거칠기에 대한 정확도와 정밀도가 엄격하게 요구되고 있다. 예를 들어 경취 재료인 반도체의 웨이화( w-afer), 수정진동자 자기헷트, 비구면렌즈 또는 연질 금속의 레이저빔(Laser Beam) 프린터 용 포리곤 밀러(Polygon Mirror), 자기디스크, 복사기용 드럼(drum), 레저기기용 반사밀러 등 가공정밀도를 향상시키기 위해서는 과거의 가공기술을 대치할 수 있는 새로운 초정밀가공 기술의 도입이 활발하게 진행되고 있다. 경취성 재료의 초정밀가공은 지금까지는 랩핑(lappi- ng), 폴리싱(polishing)의 가공기술이 주체였으나, 최근의 엄격한 부품정밀도에 대응하기 위하여 전가공을 초정밀 연삭가공으로 평면도,표면거칠기, 가공변질층을 향상시키고 다듬질 가공은 폴리싱으로 하여 표면거칠기를 향상시켜야 하는 가공기술이 보급되고 있다. 일반연질 금속의 다듬질가공은 유리지립을 이용하는 랩핑이나 폴리싱으로 다듬질 가공을 진행하고 있었 으나 형상정도와 표면정밀도를 동시에 얻는다는 것이 어렵고 또 가공시간이 너무 길어서 매우 고가인 것이 되고 말았다. 그러나 유리에서 연질금속으로 재료를 전환시키고 저가격화, 양산 화의 요구, 정밀도 향상과 부품의 안정화 등등 여러 이유로서 다아아몬드(Diamond) 공구로 mirror surface 를 만드는 초정밀 경면연삭 가공기술(precision turning with diamond)의 발달 로 이제는 완전히 새로운 가공기술로 대치되고 말았다. 다이아몬드에 의한 초정밀절삭은 공구 끝이 매우 예리하고 마모가 매우 적은 단결정 다이아몬드를 이용하고 절삭가공 기계는 운동정도 를 피가공물에 정확히 전사 시키는 방법이며 따라서 가공기계는 고도의 운동정밀도가 요구되며 그외에 강성, 진동, 열변이, 제어면에서 엄격한 검도가 있어야 한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.545-546
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• 2006

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• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.993-998
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• 2002

Ultra precision processing technology is the field which is seriously protected its technology by advanced nations. Because of this reason, this technology is very difficult to supply for domestic companies, also domestic companies are revealed the limit of technology development by itself. And then, those are depend on the technology development of advanced nation, domestic companies are not conquer application step with already developed parts. Of course, some cases of its research are succeed. those are included element technology, system technology and so on, for development of ultra precision processing system. To conquer technology holding ultra precision processing accuracy of no level, active research are needed. In this paper, stability of ultra precision cutting unit is analyzed, this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for un it control.

• 한국정밀공학회지
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• 제31권3호
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• pp.207-213
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• 2014

A study was carried out to fabricate the cutting tool geometry with micro/nanoscale on the single crystal diamond tool by using the FIB. The FIB technique is an ideal tool for TEM sample preparation that allows for the fabrication of electron-transparent foils. The FIB is appropriate techniques to sample and subsequently define the chemical composition and the structural state of mineral inclusion on the micro/nanoscale. The combination of FIB with a SEM allows for 3D information to be obtained from samples including 3D imaging. Cutting strategies were demonstrated to improve the performance of cutting tool geometry and to generate high aspect ratio micro cutting tool. A finely focused beam of 30keV Ga+ ions was used to mill cutting tool shapes for various micro patterns. Therefore FIB sputtering is used to shape a variety of cutting tools with dimensions in the $1-5{\mu}m$ range and cutting edge radii of curvature of under 50nm.

• 한국정밀공학회지
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• 제20권7호
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• pp.233-240
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• 2003

Recently, the world are preparing for new revolution, called as If (Information Technology), NT (Nano-Technology), and BT (Bio-Technology). NT can be applied to various fields such as semiconductor-micro technology. Ultra precision processing is required for NT in the field of mechanical engineering. Recently, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts. Therefore, in this paper, stability of ultra precision cutting unit is investigated, this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed. In this paper, hinge shapes of micro stage in UPCU(Ultra Precision Cutting Unit) are designed as two types, where, hinge shapes are composed of round and rectangularity. Elasticity and strength are analyzed about micro stage, according to hinge shapes, by FE analysis. Micro stage in ultra precision processing machine has to keep hinge shape under cutting condition with 3-component force (cutting component, axial component, radial component) and to reduce modification against cutting force. Then we investigated its elasticity and its strength against these conditions. Material of micro stage is generally used to duralumin with small thermal deformation. But, stability of micro stage is investigated, according to elasticity and strength due to various materials, by FE analysis. Where, Used materials are composed of aluminum of low strength and cooper of medium strength and spring steel of high strength. Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for unit control.

• 한국세라믹학회지
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• 제40권9호
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• pp.867-873
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• 2003

$Si_{3}N_{4}$-BN계 기계 가공서 세라믹스를 $1800^{\circ}C$에서 2시간동안 25MPa의 압력하에서 열간 가압소결하여 제조하였다. $Si_{3}N_{4}$ 매트릭스에 판상의 h-BN 첨가량을 5-30 vol%까지 증가함에 따라 굽힘강도는 $Si_{3}N_{4}$ 단미의 1000 MPa에서 720~400 MPa로 감소하였고, 파괴인성도 $Si_{3}N_{4}$ 단미의 7.6MPaㆍ$m^{1/2}$에서 6.5~4.1 MPaㆍ$m^{1/2}$로 감소하였다. $\beta$-$Si_{3}N_{4}$의 결정립 크기와 형상비는 h-BN 첨가에 의해 약간 감소하였다. $Si_{3}N_{4}$ 단미는 절삭시 취성 파괴를 나타내어 절삭이 불가능하였으나, $Si_{3}N_{4}$-BN계 기계 가공서 세라믹스는 파괴가 발생하지 않으면서 절삭이 가능하여, 우수한 기계 가공성을 나타내었다. h-BN 함량이 증가할수록 절삭과 마이크로 드릴링시의 절삭력은 감소하였다.