• Title/Summary/Keyword: 마이크로 이동성

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Design of CFD Structured Microstrip Line Bandpass Filter (CFD 구조의 마이크로스트립 라인 가변 대역통과필터 설계)

  • Yoon, Giwan;Chai, Dongkyu;Linh, Mai;Yim, Munhyuk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.6 no.8
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    • pp.1292-1296
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    • 2002
  • In this paper, a 3-coupled microstrip line tunable bandpass filter has been designed on the basis of a tonductoriFerroelectricfDielectric (CFD) structure. This tunable filter basically exploits the fact that the increase in the bias voltage leads to the reduction of the effective dielectric constant (eon). This reduced $\varepsilon$eff shifts the center frequency (fc) to the higher value. The characteristics of designed filter are as follows; Return loss (RL) is larger than 10 dB; Insertion loss (IL) is les.i than 3.5 dB: 3-dB bandwidth (BW) is less than 1.18 GHz fc can be tuned from 25.4 GHz to 28.8 GHz over the variation of $\varepsilon$eff, from 10 to 13. Therefore, the tunability comes up to 3.4 GHz. The dimension of the filter designed is 7.0 mm ${\times}$ 5.0 nm ${\times}$ 0.5 mm.

Design and Fabrication of a Weathercock-Shaped Double Bandwidth Microstrip Patch Antenna that Combines U-slot and Short-pin for WLAN Systems Systems (WLAN System을 위한 U-slot 및 Short-pin 결합한 바람개비 모양의 이중대역(5.2/5.8GHz) 마이크로스트립 패치 안테나 설계 및 제작)

  • Kim, Soon-Seob;Choi, Young-June;Joo, Young-Dal;Jung, Yoong-Joo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.38B no.5
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    • pp.337-343
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    • 2013
  • In this paper, IEEE 802.11 based WLAN(5.2/5.8GHz) wideband Weathercock-shaped microstrip patch antenna was designed and manufactured. The antenna has a size of $17.4{\times}17.4mm^2$ and utilized FR-4 board. The size was minimized for mobility, and Weathercock-shaped U-slot and short-pin was inserted to satisfy adequate bandwidth and double bandwidth resonance characteristics. In addition, the antenna incorporated single both-sided patch, and simulation design optimized the Weathercock-shaped, position of the U-slot and the short-pin, and the length of the patch for the measurement. The manufactured antenna achieved a bandwidth of 695MHz from 5.2~5.8GHz zone(Return loss<-10dB). Achieved a beam width of $81.13^{\circ}$ and $85.43^{\circ}$ for 3-dB beam width of H plane and E p;ane radiation pattern, there was 3.17~4.85dBi gain.

WAP Abstract Kernel Layer Supporting Multi-platform (다중 플랫폼 지원을 위한 WAP 추상 커널 계층)

  • Gang, Yeong-Man;Han, Sun-Hui;Jo, Guk-Hyeon
    • The KIPS Transactions:PartD
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    • v.8D no.3
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    • pp.265-272
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    • 2001
  • In case of implementing a complicated application like WAP (Wireless Application Protocol) in a mobile terminal with the characteristics of bare machine and versatile kernel aspects of which are control, interrupt and IPC(Inter Process Communication), a special methodology should be needed. If not, it will cause more cost and human resources, even delayed product into launching for the time-to-market. This paper suggests AKL, (Abstract Kernel Layer) for the design and implementation of WAP on basis of multi-platform. AKL is running on the various kernel including REX, MS-DOS, MS-Window, UNIX and LINUX. For the purpose of it, AKL makes machine-dependant features be minimized and supports a consistent interface on API (Application Program Interface) point of view. Therefore, it makes poring times of a device be shorten and makes easy of maintenance. We validated our suggestion as a consequent of porting WAP into PlamV PDA and mobile phone with AKL.

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Reliability Assessment of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads (굽힘 하중하에서 유연 및 무연 솔더 조인트의 신뢰성 평가)

  • Kim Il-Ho;Lee Soon-Bok
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.63-72
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    • 2006
  • Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

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Preparation of Monodispersed Silica-Rubitherm®Microparticles Using Membrane Emulsification and Their Latent Heat Properties (막유화법을 이용한 단분산성 실리카-루비덤® 마이크로 입자의 제조 및 잠열 특성)

  • Kim, Soo-Yeon;Jung, Yeon-Seok;Lee, Sun-Ho;You, Jin-Oh;Youm, Kyung-Ho
    • Journal of the Korean Applied Science and Technology
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    • v.32 no.2
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    • pp.215-225
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    • 2015
  • Recently, the importance of energy saving and alternative energy is significantly increasing due to energy depletion and the phase change material (PCM) research for saving energy is also actively investigating. In this research, the membrane emulsification using SPG membrane was used to make various microencapsulated phase change material (MPCM) particles which were comprised of $Rubitherms^{(R)}$ (RT-21 and RT-24) core and silica coating. We investigated the pressure of the dispersion phase, the concentration of surfactant, and the ratio of $Rubitherm^{(R)}$ and silica to prepare various MPCM particles. The DSC and TGA were used to examine the heat stability and latent heat properties. Also, PSA, SEM, and optical microscopy were used to confirm the size of $Rubitherm^{(R)}$ particles and the thickness of silica shell. The average of particle size was $7-8{\mu}m$. And, FT-IR was also used to enforce the qualitative analysis. Finally, the MPCM particles obtained from membrane emulsification showed monodispersed size distribution and the heat stability and latent heat were kept up to 80% compared to pure $Rubitherm^{(R)}$. So, it can be effectively used for wallpaper, buildings and interior products for energy saving as PCMs.

Implementation of Device Driver in Embedded system using Linux (리눅스를 이용한 실시간 시스템에서의 디바이스 드라이버 구현)

  • 최용식;이동현;이상락;신승호
    • Proceedings of the Safety Management and Science Conference
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    • 2002.05a
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    • pp.151-159
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    • 2002
  • Real-Time Linux를 이용하여 실시간 운영체제가 요구하는 특성과 요구조건을 분석하고 이러한 요구조건에 부합하도록 리눅스를 하드웨어에 이식하고 하드웨어에 이식하기 위한 방법을 제시하였다. 다른 상용 실시간 운영체제 (RTOS)와는 달리 리눅스는 특정 하드웨어를 지원하기 위한 별도의 개발환경을 제공하지 않는다. 이에 개발환경을 구축하고 부트로더를 개발하기 위해 목표 시스템에 부합하도록 리눅스 커널을 이식하였다. 또한 응용 개발의 유연성을 제공하기 위하여 램디스크를 이용한 파일 시스템을 지원하도록 하였으며, GPIO(general purpose I/O)를 통한 디바이스 드라아버를 제작하는 등의 실험을 통해 시스템의 안정성을 검증하였다 실험에서는 StrongArm SAl110 마이크로프로세서를 이용하였으며 이 실험을 통해 실시간 운영체제로서의 리눅스의 활용 가능성을 확인하였다.

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Development of integrated microbubble and microfilter system for liquid fertilizer production by removing total coliform and improving reduction of suspended solid in livestock manure (가축분뇨 내 대장균 제거와 부유물질 저감 효율 향상을 통한 추비 생산용 미세기포 부상분리와 마이크로 필터 연계 시스템 개발)

  • Jang, Jae Kyung;Lee, Donggwan;Paek, Yee;Lee, Taeseok;Lim, Ryu Gap;Kim, Taeyoung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.2
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    • pp.139-147
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    • 2021
  • Livestock manure is used as an organic fertilizer to replace chemical fertilizers after sufficient fermentation in an aerobic bioreactor. On the other hand, liquid manure disposal problems occur repeatedly because soil spraying is restricted during the summer when the crops are growing. To use liquid fertilizer (LF) as an additional nutrient source for crops, it is necessary to reduce the amount of suspended solids (SS) in the liquid fertilizer and secure stability problems against pathogenic microorganisms. This study examined the effects of the simultaneous SS removal and E.coli sterilization in the LF using the microbubble (MB) generator (FeMgO catalyst insertion). The remaining SS were further removed using the integrated microbubble and microfilter system. During the floating process in the MB device, the SS were removed by 57.9%, and the coliform group was not detected (16,200→0 MPN/100 mL). By optimizing the HRT of the integrated system, the removal efficiency of the SS was improved by 92.9% under the 0.1h of HRT condition. After checking the properties of the treated LF, 64.5%, 70.1%, 54.9%, and 51.5% of the TCOD, SCOD, PO4-P, and TN, respectively, were removed. The treated effluent from such an integrated system has a lower SS content than that of the existing LF and does not contain coliforms; therefore, it can be used directly as an additional fertilizer.

A Study on Transmission Quality and Frequency Movement for Digital Microwave Link Design (디지탈 마이크로웨이브 링크 설계를 위한 전송품질 및 주파수 이전에 대한 연구)

  • 서경환
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.5
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    • pp.489-498
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    • 2003
  • Recently to introduce new services of ultra-high speed wireless access and systems beyond the 3rd generation mobile communication, 5 GHz band has been highly interested. As a way of getting the required frequency, it is considered that microwave relay bands below 6 GHz, which shows a slow decrease in demand and less cost-effectiveness, should be moved to other bands above 6 GHz. In this paper, as a tool for analyzing microwave link design and its service quality, the outage prediction based upon Vigants & Barnett's model is reviewed. To show outage and availability calculation, simulations are performed for the operating 4 GHz radio sites, and some results and features regarding frequency movement to 6.7 as well as 8 GHz are also discussed in terms of diversity techniques, bit error rate, and availability As the results, it is confirmed that only the diversity techniques of space or space and frequency can satisfy the annual objective of availability irrespective of frequency movement.

Identification of High Pressure-High Temperature Treated Gem Diamonds using a Micro-Raman Spectroscopy (고압고온 처리된 보석용 다이아몬드의 마이크로라만 분석에 의한 감별 연구)

  • Song, Oh-Sung;Kim, Jong-Ryul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.5
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    • pp.817-822
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    • 2006
  • Diamonds have been widely employed as polishing media for precise machining and noble substrates for microelectronics. The recent development of the split sphere press has led to the enhancement of low quality natural diamonds. Synthesized and treated diamonds are sometimes traded deceptively as high quality natural diamonds because it is hard to distinguish among these diamonds with conventional gemological characterization method. Therefore, we need to develop a new identification method that is cheap, fast, and non-destructive. We proposed using a new method of micro-Raman spectroscopy for checking the local HPHT residual stress to distinguish these diamonds from natural ones. We observe unique ~10f compressive and tensile strains at Type I and Type II diamonds after HPHT treatment. Our result implies that our proposed methods may be appropriate fur identification of the treated diamonds with appropriate reference samples.

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The Effect of Abnormal Intermetallic Compounds Growth at Component on Board Level Mechanical Reliability (컴포넌트에서의 비정상적인 금속간화합물 성장이 보드 레벨 기계적 신뢰성에 미치는 영향)

  • Choi, Jae-Hoon;Ham, Hyon-Jeong;Hwang, Jae-Seon;Kim, Yong-Hyun;Lee, Dong-Chun;Moon, Jeom-Ju
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.47-54
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    • 2008
  • In this paper, we studied how and why did abnormal IMC growth at component affect on board level mechanical reliability. First, interfacial reactions between Sn2.5Ag0.5Cu solder and electrolytic Ni/Au UBM of component side were investigated with reflow times and thermal aging time. Also, to compare mechanical reliability of component level, shear energy was evaluated using the ball shear test conducted with variation of shear tip speed. Finally, to evaluate mechanical reliability of board level, we surface-mounted component fabricated with each condition on PCB side. After conducting of 3 point bending test and impact test, we confirmed solder joint crack mode using cross-sectioning and dye & pry penetration method.

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