• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.69-71
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• 2001

본 논문에서는 FACS(fluorescence activated cell sorting)의 초소형화를 위한 미세 유체소자들을 플라스틱 기판에 집적하여 제작하고 전기삼투를 이용해서 세포가 일렬로 이송되는 특성을 시험한다. 제작된 미세 유체 소자는 유리 하부 기판과 플라스틱 상부 기판 및 전원장치로 구성된다. 상부기판은 세포를 주입하기 위한 샘플 측 레저버와 세포를 운반 및 일렬 이송이 가능하게 하는 버퍼를 저장할 두 개의 레저버가 있고 이들이 배출되는 레저버로 구성된다. 마이크로머시닝 기술을 이용하여 실리콘 기판 위에 미세 채널 몰드를 제작한 후 PDMS(polydimethylsiloxane)로 주물을 제작한다. $O_2$ 플라즈마를 이용하여 유리 기판과 PDMS 주물을 접합하며 제작된 채널에 적색 잉크와 bead를 샘플 측에 충전하고 버퍼 측에 sodium borate를 충전한 후 전기삼투로 구동시킨다. bead가 일렬로 이송되도록 전장을 조절하고 이때의 유속과 유량을 측정한다. 다양한 전장에 따른 실험을 통하여 채널의 구조를 최적화한다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.35-39
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• 2018

In order to improve the coupling efficiency, a collimator lens that collects the light emitted from the laser diode at a wide angle to the core of the optical fiber is essential. Glass mold method using a mold is widely used as a collimator lens currently used. Although this method is inexpensive to produce, it is difficult to form precisely and quality problems such as spherical aberration. In this study, the precision of surface processing was improved by replacing the existing glass mold method with the semiconductor process, and the material of the lens was changed to silicon suitable for the semiconductor process. The semiconductor process consists of a photolithography process using PR and a dry etching process using plasma. The optical coupling efficiency was measured using an ultra-precision alignment system for the evaluation of the optical characteristics of the silicon lens. As a result, the optical coupling efficiency was 50% when the lens diameter was $220{\mu}m$, and the optical coupling property was 5% or less with respect to the maximum optical coupling efficiency in the lens diameter range of $210-240{\mu}m$.

• Clean Technology
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• v.24 no.2
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• pp.105-111
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• 2018

This study presents a novel and eco-friendly process that can precisely control the location of the patches on the patch particles. The method of manufacturing these anisotropic hexagram patch particles consists of sequential combinations of two separate methods such as a sequential micromolding technique for fabricating patch particles and a selective localization method for controlling the location of patches on the patch particles. The micromolding technique was carried out using physicochemically stable material as a micromold. In order to fabricate the highly stable patch anisotropic hexagram particles, the perfluoropolyether (PFPE) micromold was used to the process of the micromolding technique because they could prevent the problem of diffusion of hydrophobic monomers while conventional poly(dimethylsiloxane) (PDMS) micromold is limited to prevent the problem of diffusion of hydrophobic monomers. Based on combination methods of the micromolding technique and the selective localization method, the reproducibility and stability have been improved to fabricate 12 different types of anisotropic hexagram patch particles. This fabrication method shows the unique advantages in eco-friend condition, easy and fast fabrication due to less number of process, the feasibility of a mass production. We believe that these anisotropic hexagram patch particles can be widely utilized to the field of the directional self-assembly.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.354-359
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• 2006

Recently, the interest in lithography without photo exposure has been increased compare to the conventional photolithography in nano meter and micrometer size patterning area. We studied a self aligned dipping of Ag solution through micro contact printing (${\mu}-CP$) with octadecyltrichlorosilane (OTS) treated polydimethylsiloxane (PDMS) soft mold. The OTS monolayer on the patterned PDMS was formed by dipping it into OTS solution. We transferred the OTS monolayer from PDMS mold to the glass. The OTS monolayer changed the surface energy from hydrophilic surface to hydrophobic surface, And then we made self aligned Ag solution patterns just after dipping the substrate, using adhesion difference of Ag solution between OTS treated hydrophobic area and non-OTS treated hydrophilic area. We finally get the Ag patterns through only dip-coating after the ${\mu}-CP$ process. And we observed surface energies on the glass substrate through the contact angle measurements as time goes on.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.5
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• pp.368-372
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• 2016

In this study, we develop a novel high-throughput micronanopatterning system that can implement continuous mechanical pattern inscribing on flexible substrates using a rigid grating mold edge. We perform a conceptual design of the process principle, specific modeling, and buildup of a real system prototype. This research also carefully addresses several important issues related to processing and controlling, including precision motion, alignment, heating, and sensing to enable a successful micronanopatterning in a continuous and high-speed fashion. Various micronanopatterns with the desired profiles can be created by tuning the mold shape, temperature, force, and substrate material toward many potential applications involving electronics, photonics, displays, light sources, and sensors, which typically require a large-area and flexible configurations.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.11
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• pp.1099-1103
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• 2015

Recently, there have been several studies on the inspiration and application of optimized natural structures. One study introduced a new adhesion method that was inspired by the feet of geckos because of their superior features such as high adhesion strength, ease-of-removal, and they are environmentally friendly. Various micro- or nano-structures were fabricated and tested for gecko-like dry adhesives, but gecko-like dry adhesives that were developed became easily worn from frequent use. In this study, we propose a metal-coating method to improve the durability of gecko-like dry adhesives. We evaluate the initial adhesion strength and durability by performing repeated adhesion tests on a glass plate. The initial adhesive strength of gold-coated micro-structures was 60% of that for non-coated ones. However, the adhesive strength of gold-coated micro-structures was kept as 58% of their initial adhesion strength, while that of non-coated ones was only 40%.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.45-49
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• 2019

Herein we developed the hot extrusion technology to prepare n-type Bi-Te-Se-based thermoelectric materials with high reliability. Starting ingot was fabricated via melt-solidification process, then pulverized it into powders (${\sim}30{\mu}m$) by using high energy ball milling. By optimization of mold design and temperature-pressure conditions for hot extrusion, dense extrudate of 1.8 mm in diameter with high 00l orientation could be obtained from disc-shape compacted powders (20 mm in diameter). High power factor ${\sim}4.1mW/mK^2$ and enhanced mechanical strength ~50 MPa were simultaneously observed at 300 K.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.55-59
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• 2022

In this paper, we compared the electric field and absorptance of nano particles in nanostructures by amplifying the electric field around the nanoparticles through plasmon resonance and comparing the structure that can increase the absorptance with the nanostructure by using the Finite Different Time Domain (FDTD) simulation. In addition, the width of the nanostructure was adjusted to 240 nm ~ 300 nm, and the light absorptance rate was higher as the gap between the particles was short. In addition, a study was conducted on the formation of nanoparticles and nanostructures on the surface through UV imprint. In order to form particles in the structure, the nano particles were first arranged in the mold used for the fabrication of the structure using spray coating, and then fabricated through UV imprinting. The nanostructure and particles were formed together by scanning electron microscopy.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2377-2379
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• 2005

본 논문은 유연한 영상표시 장치에 응용될 수 있는 중공음극방전 소사(hollow cathode discharge device)를 마이크로머시닝기술로 제작하고 시험한 결과를 보여준다. 중공음극방전은 평판음극방전에 비해서 전류밀도가 큰 장점이 있다. 방전 소자는 유연한 구조의 양극과 음극, 그리고 그 사이의 절연층으로 구성되어 있으면 소자의 크기는 $20mm{\times}10mm$이다. 방전이 일어나는 영역은 관통 구멍으로서 $7{\times}11$개가 배열되어 있고, 구멍의 직경은 $70{\mu}m$이다. 실리콘 기판 위에 SU-8 몰드를 형성한 후 니켈 전기도금으로 음극을 제작한다. 그 위에 폴리이미드를 스핀코팅하여 절연층을 이루고, 열증착으로 알루미늄 양극을 제작한 후, 실리콘과 SU-8을 제거하여 방전 소자를 완성한다. 진공챔버내 아르곤 가스 분위기에서 소자의 두 전극 간 전압을 변화시켜 가면서 전류-전압 특성을 측정하였고, 방전상태를 관찰하였다. 챔버 내의 절대압력이 260mmHg이고 인가전압이 230V 정도일 때 안정 방전이 관찰되었다

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.154-154
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• 2009

본 연구는 고전압 전력기기인 몰드형변압기와 계기용 변성기인 CT, PT 절연특성에 유용한 Epoxy/Nano-Micro Mixture Composites(이하,ENMMC)를 개발하기위해 무엇보다 중요한 것은 Nano입자인 $SiO_2$_10nm입자의 표면을 제어하여 즉, 표면의 소수성을 크게 하여 나노입자의 균질한 분산을 얻은것이 무엇보다 중요하다. 개발된 Epoxy/$SiO_2$_10nm Nanocomposites와 Microcomposites을 기계적 전단응력을 이용하여 균질 혼합을 실시하였다. 이런 조건을 이용한 전기적특성을 측정하기위해 구대구 전극이 완전함침된 평등전계하에서 절연파괴전압을 측정하기 시편을 제조하였다. 마이크로입자의 충진함량을 일정하게 유지하여 나노입자 충진함량비율을 4가지로 변화시켜 절연파괴특성을 연구하였다. 충진함량이 나노입자의 경우 1wt%이하의 값이 상대적으로 우수한 절연파괴특성으로 와이블 플롯을 통하여 알수있었다. 상대적으로 멀티나노콤포지트의 형상파라미터가 큰 결과값을 얻을수 있었다. 그리고 스케일파리미터는 누적확률 밀도함수로서 63.2%에서 대단히 큰 초절연성의 절연소재를 개발할수 있었다.