• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.11-16
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• 1999

In this study, Ultra-precision finishing system using micro abrasive film experimented using experimental variable film feed speed and grinding speed and structural steel(SM45C) with respect to 12~3{\mu}m$ micro abrasive film. the result are follows; (1) Experimental condition must setup dissimilar about each micro abrasive film. (2) To measurement deviation the smallest machined condition are 20mm/min in 12{\mu}m$, 5mm/min and 15mm/min in 9{\mu}m$ and 5{\mu}m$, 5mm/min in 3{\mu}m$ in film feed speed. (3) To measurement deviation the smallest machined condition are 180m/min in 12{\mu}m$, 84m/min in 9{\mu}m$, 56 and 84m/min in 5{\mu}m$, 104m/min in 3{\mu}m$ in grinding speed.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.63-67
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• 2001

Up to now, most studies about Pt-etching have been focused on physical sputtering mechanism with Cl-based plasma, while only a limited results are available for etching characteristics with fluorine-based plasma. In this study, etch characteristics of Pt thin film with $Cl_2$/Ar and $SF_{6}$/Ar Ar gas chemistries have been studied with ECR plasma etching system. It is confirmed that $SF_{6}$/Ar Ar plasma chemistry could make volatile etch-products through the reaction with Pt thin film. Also the improvement in etch rate, etch profile and surface roughness is obtained due to the formation of volatile platinum fluoride compounds.

• Proceedings of the Korea Water Resources Association Conference
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• 2011.05a
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• pp.95-95
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• 2011

토양수분은 전 지구 및 기후 모델 연구, 전 지구 환경 감시, 기후변화, 대기-지표의 물과 에너지 상호교환 등 중요한 역할을 한다. 최근에는 수동형 마이크로웨이브 센서를 이용하여 토양수분을 탐지하고 있으며, NASA는 공식적인 전구 토양수분을 제공하고 있다. 특히, AMSR-E(Advandced Microwave Scanning Radiometer on EOS)의 6 GHz 영역에서 산출된 토양수분은 지표 토양층(0～5 cm)의 높으 정확도의 토양 수분 정보를 제공하고 있다. 지금까지의 위성관측을 이용한 토양 수분 알고리즘은 복잡한 선행모델과 관측된 경험식을 바탕으로 한다. 이 연구의 제안한 알고리즘은 위성에서 관측된 휘도온도 정보를 이용하여 역변환 방법을 이용하여 토양수분을 산출할 수 있기에, 복잡한 선행모델 사용을 최소화하는 장점이 있다. 본 연구에서 제시한 토양수분 산출 알고리즘은 각 채널(6.9 및 37 GHz)의 특성을 이용하여 거친 표면의 반사도를 산출한 후, 편광비율 특성을 이용한다. 아울러 반사도는 Hong 근사식을 이용하여 지표면 거칠기, 물질의 특성을 나타내는 유전상수를 산출하고 두 변수 사이의 관측된 경험적 관계식를 이용하여 전 지구적인 토양수분이 산출한다. 이 결과는 NASA에서 산출한 토양 수분과 현장관측 (SMEX03)의 오클라호마, 조지아 지역 관측 결과와 비교하였을 때, 사용자들이 요구하는 수준 (<0.06g/$cm^3$)의 정확도를 만족시킨다. 본 연구에서 제시된 토양수분 알고리즘은 단순성, 정확성, 물리적 기반을 바탕으로 하기에 현업용으로 그 활용 가치가 높다. 본 연구 결과는 향후 국외 토양수분산출 전용 위성들인 SMOS(Soil Moisture and Ocean Salinity)와 SMAP(Soil Moisture Active/Passive) 자료들을 생산하는데 활용된다면, 전 지구적 토양수분 정보제공에 기여할 수 있을 것으로 예산된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.338-338
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• 2012

사파이어 ($Al_2O_3$)는 높은 밴드갭 에너지 (~19.5 eV)를 가진 물질로서 우수한 내마모성, 강도, 전기 절연성 및 안정한 화학적 특성을 갖고 발광다이오드 기판, 보석재료 등 각종 산업 및 기술적 분야에서 널리 사용되고 있다. 특히, 플립칩 발광다이오드 구조의 경우 광추출효율을 향상시키기 위해 높은 투과도를 갖는 사파이어 기판이 요구되어 왔으며, 지금까지 건식/습식식각방법을 이용한 사파이어 표면에 마이크로 크기의 심한 거칠기 또는 요철이 형성된 나노크기의 격자구조를 형성시키는 연구가 진행되어 오고 있다. 그 중, 나노 크기의 격자구조는 공기에서 반도체 기판까지 선형적인 유효굴절률 분포를 갖기 때문에 표면에서 생기는 Fresnel 반사 손실을 줄일 수 있다. 이러한 구조를 형성하기 위해서는 식각 마스크가 필요한데, 형성 방법으로 레이저 간섭 리소그래피, 전자빔 리소그래피, 나노임프린트 리소그래피 등이 있으나, 비싼 가격과 복잡한 공정 절차 등의 단점을 지니고 있다. 따라서 본 연구에서는 식각 마스크 패턴을 위해, 보다 저렴하고 간단한 실리카 나노구 및 열적응집 금 나노 입자를 이용하였다. 양면 폴리싱 c-plane 사파이어 기판을 사용하였고, 단일 층의 주기적인 실리카 나노구를 기판 표면에 스핀코팅에 의해 도포한 후 유도결합플라즈마 식각 장비를 이용하여 식각하여 주기적인 패턴을 갖는 렌즈모양의 격자구조를 형성하였다. 그리고 주기적으로 형성된 격자 위에 열 증착기를 이용하여 금 박막을 증착한 후 급속열적어닐닝(rapid thermal annealing)을 이용하여 열처리함으로써 비주기적인 금 나노입자를 형성시켰다. 형성된 금 나노패턴을 이용하여 동일한 조건으로 식각함으로써 광대역 및 전방향성 높은 투과도를 갖는 원뿔 모양의 사파이어 나노구조를 제작하였다. 제작된 샘플의 패턴 및 식각 형상은 전자현미경을 사용하여 관찰하였으며, UV-vis-NIR 분광광도계 (spectrophotometer)를 사용하여 투과율을 측정하였다. 렌즈 모양 표면 위에 원뿔모양의 나노구조를 갖는 사파이어 기판은 일반적인 사파이어 기판보다 향상된 투과율 특성을 보였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.35-41
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• 2010

In this paper, surface roughness has been experimentally identified using laser scattering images. The parameters and optical deflected rays of laser scattering are investigated on laser scattering system, and then their optimum parameters on grinding surfaces are selected using design of experiment. The application of the optimum parameters results in featured laser scattering images, in which the mean of vertical scattering distributions is regarded as a feature. It is shown that the feature of laser scattering distributions is linearly increased according to grinding surface roughness and so the information can be used as important factor for the measurement and evaluation of various surface roughness. In the future, the performance of the proposed laser scattering method will be evaluated using AFM.

• Journal of the Korean Chemical Society
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• v.45 no.4
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• pp.351-356
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• 2001

Planarization of the free-standing diamond film surface as smooth as possible could be obtained by using the hydrogen plasma etching with the diffusion of the carbon species into the metal alloy (Fe, Cr, Ni). For this process, we placed the free-standing diamond film between the metal alloy and the Mo substrate like a metal-diamond-molybdenum (MDM) sandwich. We set the sandwich-type MDM in a microwave-plasma-enhanced chemical vapor deposition (MPECVD) system. The sandwich-type MDM was heated over ca. 1000 $^{\circ}C$ by using the hydrogen plasma. We call this process as the hydrogen plasma etching with carbon diffusion process. After etching the free-standing diamond film surface, we investigated surface roughness, morphologies, and the incorporated impurities on the etched diamond film surface. Finally, we suggest that the hydrogen plasma etching with carbon diffusion process is an adequate etching technique for the fabrication of the diamond film surface applicable to electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.359-363
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• 2005

The organic insulation devices with MIM (metal-insulator-metal) structures as PVP gate insulation films were prepared for the application of organic thin film transistors (OTFT). The co-polymer organic insulation films were synthesized by using PVP(poly-4-vinylphenol) as solute and PGMEA (propylene glycol monomethyl ether acetate) as solvent. The cross-linked PVP insulation films were also prepared by addition of poly (melamine-co-formaldehyde) as thermal hardener. The leakage current of the cross-linked PVP films was found to be about 300 pA with low current noise. and showed better property in electrical properties as compared with the co-polymer PVP insulation films. In addition, cross-linked PVP insulation films showed better surface morphology (roughness), showing about 0.11${\~}$0.18 nF in capacitance for all PVP film samples.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Design & Manufacturing
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• v.17 no.2
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• pp.22-26
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• 2023

As Light-Emitting Diodes(LEDs) continue to advance in performance, their application in automotive lamps is increasing. Automotive LEDs utilize light guides not only for aesthetics but also to control light quantity and direction. Light guides employ patterns of a few hundred micrometers(㎛) to regulate the light, and the surface roughness(Ra) of these patterns can reach tens of nanometers(nm). Given that these light guides are produced through injection molding, mold processing technology with high surface quality micro-patterns is required. This study serves as a preliminary investigation into the development of high surface quality micro-pattern processing technology. It examines the surface roughness of the workpiece based on the cutting direction of the pattern and the cutting fluid type when cutting micro-patterns on STAVAX steel using cubic Boron Nitride(cBN) tools. The experiments involved machining a step-shaped micro-pattern with a height of 60 ㎛ and a pitch of 400 ㎛ in a 22×22 mm area under identical cutting conditions, with only the cutting direction and cutting fluid type being varied. The machining results of four cases were compared, encompassing two cases of cutting direction(parallel to the pattern, orthogonal to the pattern) and two cases of cutting fluid type (flood, mist). Consequently, the Ra value was found to be the highest(Ra 128.33 nm) when machining with the flood type in parallel to the pattern, while it was the lowest(Ra 95.22 nm) when machining with the mist type orthogonal to the pattern. These findings confirm that there is a difference of up to 25.8 % in the Ra value depending on the cutting direction and cutting fluid type.