• Journal of Advanced Navigation Technology
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• v.12 no.2
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• pp.122-131
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• 2008

In this paper, an S-band oscillator of the low phase noise property using miniaturized microstrip hairpin shaped ring resonator has been designed and implemented. The TACONIC's RF-35 substrate has a dielectric constant ${\varepsilon}_r$=3.5 a thickness h=20mil a copper thickness t=17 um and loss tangent $tan{\delta}$=0.0025. The designed and implemented 2.45 GHz oscillator shows low phase performance of -100.5 dBc/Hz a 100kHz offset. Output power 20.9 dBm at center frequency 2.45 GHz and harmonic suppression -32 dBc. The circuit was implemented with hybrid technique. But can be fully compatible with the RFIC's, MIC and MMIC due to its entirely planar structure.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.18 no.1
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• pp.43-46
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• 2018

This paper has designed a wideband bandpass filter (WBSF : Wide Band Stop Filter) using a stepped impedance resonator (SIR : Stepped Impedance Resonator) with improved performance and improved hairpin coupling structure. The SIR WBSF is small in size and has the advantage of having excellent bandstop characteristics. The designed BSF has a structure in which a quadrangular shaped hairpin of a / 4 length is arranged symmetrically on the upper and lower sides of the input and output transmission lines. The input and output terminals were terminated at 50 ohms for system applications. The center frequency of the SIR WBSF is 6.3 GHz, which is the second harmonic of 3.15 GHz. The designed filter has a 3dB bandwidth of 2.9 GHz and a transmission coefficient ($S_{21}$) of 33.2 dB. The reflection coefficient ($S_{11}$) at the center frequency is 0.106 dB. The application field is used for fixed microwave relay stations, fixed satellite and earth stations, and fixed satellite communications. The overall size is $20mm{\times}10mm$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1509-1514
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• 2011

The core of IT products, electronic components, especially the MLCC, chip inductors, chip Varistors and so on. In order to test the electrical characteristics of the chip using the Reno-pin contact test method has been used. In current chips, mass production of semiconductor manufacturing processes, high-speed production test for the chip speed up, precision is required. But Vibration displacement is a very short, so in order to overcome these shortcomings, the displacement amplification to design the structure has been actively studied. In this paper, a building structure with a flexible hinge was designed amplification instrument, semiconductor chip industry in the performance test and inspection equipment to measure the electrical characteristics of high speed linear actuators Reno-Pin using system was developed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.64-72
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• 2023

In this study, after transferring graphene on a Cu substrate and printing a Sn-3.0Ag-0.5Cu Pb-free solder paste on the Cu substrate, effects of the transferred graphene on formations and growths of intermetallic compound (IMC) at the interface between the Cu substrate and the solder were reported during processes of reflow soldering and isothermal aging for 1000 h with various temperatures (125, 150, and 175 ℃). Thicknesses of Cu₆Sn₅ and Cu₃Sn IMCs at the interfaces with graphene were decreased during the reflow soldering and isothermal aging processes compared to those without graphene. The transferred graphene layers also showed that the growth rate constant and square of growth rate constant which related to the growth mechanisms of Cu₆Sn₅ and Cu₃Sn IMCs with t he t emperature a nd t ime of t he i sothermal aging c ould dramatically decreased.

• The KIPS Transactions:PartA
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• v.8A no.4
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• pp.479-488
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• 2001

As the SoC designs complexity constantly increases, the simulation that uses their software models simply takes too much time. To solve this problem, FPGA-based logic emulators have been developed and commonly used in the industry. However, FPGA-based logic emulators are facing with the problems of which not only very low FPGA resource usage rate due to the very limited number of pins in FPGAs, but also the emulation speed getting slow drastically as the complexity of designs increases. In this paper, we proposed a new innovative emulation architecture and its software that has high FPGA resource usage rate and makes the emulation extremely fast. The proposed emulation system has merits to overcome the FPGA pin limitation by pipelined ring which transfers multiple logic signal through a single physical pin, and it also makes possible to use a high speed system clock through the intelligent ring topology. In this topology, not only all signal transfer channels among EPGAs are totally separated from user logic so that a high speed system clock can be used, but also the depth of combinational paths is kept swallow as much as possible. Both of these are contributed to achieve high speed emulation. For pipelined singnals transfer among FPGAs we adopt a few heuristic scheduling having low computation complexity. Experimental result with a 12 bit microcontroller has shown that high speed emulation possible even with these simple heuristic scheduling algorithms.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.1-10
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• 2016

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.9
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• pp.1633-1640
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• 2016

In this paper, we propose a open-ended rectangular microstirp patch antenna with fork-shaped feeding structure. This antenna extends the effective bandwidth by transforming single or multi resonant frequency and is designed planar monopole structure with microstrip line to satisfy the WLAN bands (2.4 - 2.484, 5.15 - 5.35, 5.25-5.825 GHz). The substrate is printed in 0.8 mm thickness on an FR-4 board. A commercial 3D simulation tool was used to analyze surface current and electromagnetic field distribution in order to analyze the operation mode and reconfiguration principle of antenna. According to the lengths of individual patches, simulated reflection loss was compared to obtain optimized values. When it was designed with the optimized values, it satisfied WLAN bands (2.380 - 2.710, 4.900 - 5.950 GHz), if the switch is off, and 2.4 WLAN band (2.380 - 2.710 GHz). From the fabricated and measured results, measured results of return loss, gain and radiation patterns characteristics displayed for operating bands.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.10
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• pp.1044-1051
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• 2003

In this paper, a compact planar microwave duplexer on the high dielectric substrate is presented. As the Ba(Mg$\sub$1/3/Ta$\sub$2/3/)O$_3$(BMT) has good dielectric performances with a high dielectric constant of $\varepsilon$$\sub$r/=23, it is suitable to apply to a printed circuit board fur reducing its circuit size. The BMT substrate is fabricated by using a tape casting fabrication process, and circuit patterns are screen-printed on it by suing silver paste. The open-loop ring type duplexer is designed and implemented on the BMT substrate, and it achieves the smaller size by 80% than one on a commercial substrate($\varepsilon$$\sub$r/=6.15) without degenerating its performance. Therefore the proposed BMT substrate has provided the miniaturization of the duplexer, moreover it can make a contribution towards reducing the size of microwave passive circuits.

• Journal of Hydrogen and New Energy
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• v.24 no.2
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• pp.142-149
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• 2013

Carbon materials are mainly used as catalyst supports for polymer exchange membrane fuel cell (PEMFC). Catalyst supports are required specific characteristics of the carbon materials, such as large surface area and high electrical conductivity. Attempted were to improve electrical conductivity and to maintain high surface area of carbon materials using a microwave treatment. Microwave treatment, as a relatively new technique, takes short reaction time and reduce the consumption of the gases used for carbon treatment compared to a traditional heat treatment. Hybrid carbon (ACF/Graphene) as catalyst supports by microwave-irradiation method for PEMFC increase the cell performance because of increased electrical conductivity resulting in triple-phase contact and reduced the interfacial resistance. Scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-Ray Diffraction (XRD) were employed to analyze carbon materials. The performance of microwave-treated carbon materials was evaluated by measuring current-voltage (I-V) characteristics and electrode impedance.