• Korean Journal of Optics and Photonics
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• v.28 no.2
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• pp.59-67
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• 2017

This paper proposes an asymmetric split-loop resonator with an outer square loop (ASLR-OSL), which can actively control terahertz wave transmission properties while maintaining a high-Q-factor of the asymmetric split-loop resonator (ASLR). An added outer square loop is designed to play the roles of both a metamaterial and a micro-heater, which can control the temperature through a directly applied bias voltage. A vanadium dioxide ($VO_2$) thin film, which exhibits an insulator-metal phase transition with temperature change, is used to control the transmission properties. The proposed ASLR-OSL shows transmission properties similar to those of the ASLR, and they can be successfully controlled by directly applying bias voltage to the outer square loop. Based on these results, an electrically controllable terahertz high-Q metamaterial could be achieved simply by adding a square loop to the outside of a well-known high-Q metamaterial.

• Journal of the Korean Society for Nondestructive Testing
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• v.33 no.1
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• pp.54-62
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• 2013

In this study, a wireless and non-power SAW (surface acoustic wave) temperature sensor was developed. The single inter-digital transducer (IDT) of SAW temperature sensor of which resonance frequency is 434 MHz was fabricated on $128^{\circ}$ rot-X $LiNbO_3$ piezoelectric substrate by semiconductor processing technology. To find optimal acoustic reflector for SAW temperature sensor, various kinds of acoustic reflectors were fabricated and their reflection characteristics were analyzed. The IDT type acoustic reflector showed better reflection characteristic than other reflectors. The wireless temperature sensing system consisting of SAW temperature sensor with dipole antenna and a microprocessor based control circuit with dipole antenna for transmitting signal to activate the SAW temperature sensor and receiving the signal from SAW temperature sensor was developed. The result with wireless SAW temperature sensing system showed that the frequency of SAW temperature sensor was linearly decreased with the increase of temperature in the range of 40 to $80^{\circ}C$ and the developed wireless SAW temperature sensing system showed the excellent performance with the coefficient of determination of 0.99.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.5
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• pp.796-805
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• 2000

A 30GHz band low noise amplifier module, which has linear gain of 30dB and noise figure of 2.6dB, for 30GHz satellite communication transponder was developed by use of MMIC and thin film MIC technologies. Two kinds of MMIC circuits were used for the low noise amplifier module, the first one is ultra low noise MMIC circuit and the other is wideband and high gain MMIC circuit. The pHEMT technology with 0.15$mu extrm{m}$ of gate length was applied for MMIC fabrication. Thin film microstrip lines on alumina substrate were used to interconnect two MMIC chips, and the thick film bias circuit board were developed to provide the stabilized DC bias. The input interface of the low noise amplifier module was designed with waveguide type to receive the signal from antenna directly, and the output port was adopted with K-type coaxial connector for interface with the frequency converter module behind the low noise amplifier module. Space qualified manufacturing processes were applied to manufacture and assemble the low noise amplifier module, and space qualification level of environment tests including thermal and vibration test were performed for it. The developed low noise amplifier was measured to show 30dB of minimum gain, $\pm$0.3dB of gain flatness, and 2.6dB of maximum noise figure over the desired operating frequency range from 30 to 31 GHz.

• The KIPS Transactions:PartA
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• v.8A no.4
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• pp.479-488
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• 2001

As the SoC designs complexity constantly increases, the simulation that uses their software models simply takes too much time. To solve this problem, FPGA-based logic emulators have been developed and commonly used in the industry. However, FPGA-based logic emulators are facing with the problems of which not only very low FPGA resource usage rate due to the very limited number of pins in FPGAs, but also the emulation speed getting slow drastically as the complexity of designs increases. In this paper, we proposed a new innovative emulation architecture and its software that has high FPGA resource usage rate and makes the emulation extremely fast. The proposed emulation system has merits to overcome the FPGA pin limitation by pipelined ring which transfers multiple logic signal through a single physical pin, and it also makes possible to use a high speed system clock through the intelligent ring topology. In this topology, not only all signal transfer channels among EPGAs are totally separated from user logic so that a high speed system clock can be used, but also the depth of combinational paths is kept swallow as much as possible. Both of these are contributed to achieve high speed emulation. For pipelined singnals transfer among FPGAs we adopt a few heuristic scheduling having low computation complexity. Experimental result with a 12 bit microcontroller has shown that high speed emulation possible even with these simple heuristic scheduling algorithms.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.75-82
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• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.48-57
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• 2006

This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.249-254
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• 2022

With the rapid advance of the semiconductor and Information and communication technologies, remote environment monitoring technology, which can detect and analyze surrounding environmental conditions with various types of sensors and wireless communication technologies, is also drawing attention. However, since the conventional remote environmental monitoring systems require external power supplies, it causes time and space limitations on comfortable usage. In this study, we proposed the concept of the self-powered remote environmental monitoring system by supplying the power with the levitation-electromagnetic generator (L-EMG), which is rationally designed to effectively harvest biomechanical energy in consideration of the mechanical characteristics of biomechanical energy. In this regard, the proposed L-EMG is designed to effectively respond to the external vibration with the movable center magnet considering the mechanical characteristics of the biomechanical energy, such as relatively low-frequency and high amplitude of vibration. Hence the L-EMG based on the fragile force equilibrium can generate high-quality electrical energy to supply power. Additionally, the environmental detective sensor and wireless transmission module are composed of the micro control unit (MCU) to minimize the required power for electronic device operation by applying the sleep mode, resulting in the extension of operation time. Finally, in order to maximize user convenience, a mobile phone application was built to enable easy monitoring of the surrounding environment. Thus, the proposed concept not only verifies the possibility of establishing the self-powered remote environmental monitoring system using biomechanical energy but further suggests a design guideline.