• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.129-135
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• 2018

In the stretchable electronic devices, the stretchable substrate is a very essential material which determines the stretchability, performances and durability of the stretchable electronic devices. In particular, the current stretchable materials have hysteresis making difficult to used as sensors and other electronic devices. In this study, we developed a PDMS-Ecoflex hybrid stretchable substrate mixed with PDMS and Ecoflex material in order to increase stretchability and improve hysteresis characteristics. Mechanical behavior of the hybrid substrate was evaluated using a tensile test, and optical transmittance of the hybrid substrate was also measured. As the content of Ecoflex increases, the PDMS-Ecoflex hybrid substrate becomes more flexible, and the elastic modulus decreases. In addition, the PDMS substrate failed a tensile strain of 270%, while the PDMS-Ecoflex hybrid substrate did not fail even at 500% strain indicating excellent stretchability. In the repeated tensile test, the hybrid substrate with 2:1 mixing ratio of PDMS and Ecoflex showed hysteresis. On the other hand, in the case of the hybrid substrate with the mixing ratio of 1:1, hysteresis did not occur at a strain of 50% and 100%. Hence, we developed a stretchable substrate with over 150% stretchability and no hysteresis characteristics. The optical transmittance of the Ecoflex substrate was 68.6%, whereas the transmittances of the hybrid substrate with mixing ratio of 2:1 and 1:1 were 78.6% and 75.4%, respectively. These results indicate that the PDMS-Ecoflex hybrid substrate is a potential candidate for a transparent stretchable substrate.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.119-125
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• 2020

Transition metal dichalcogenides (TMDCs), two-dimensional atomic layered materials with direct bandgap in the range of 1.1-2.1 eV, have attracted a lot of research interest due to their high response to light and capability to build new types of artificial heterostructures. However, the large-area synthesis of high-quality and uniform TMDC films with vertical-stacked heterostructure still remains challenge. In this study, we have developed a metal-organic chemical vapor deposition (MOCVD) system for TMDCs and conducted a systematic study on the growth of single-layer TMDCs and their heterostructures. In particular, using a bubbler-type organometallic compound sources, the concentration and flow rate of each source can be precisely controlled to obtain uniformly single-layered MoS2 and WS2 films over the centimeter scale. In addition, the MoS2/WS2 vertical heterostructure was achieved by growing WS2 film directly on the MoS2 film, as confirmed by electron microscopy, UV-visible spectrophotometer, Raman spectroscopy, and photoluminescence spectroscopy.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.20-34
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• 2023

Single or multi-layered two-dimensional (2D) materials, with thicknesses in the order of a few nanometers, have garnered substantial attention across diverse research domains owing to their distinct properties, including electrical conductivity, flexibility, and optical transparency. These materials are frequently subjected to repetitive mechanical actions in applications like electronic skin (E-Skin) and smart textiles. Moreover, they are often exposed to external factors like temperature, humidity, and pressure, which can lead to a deterioration in component durability and lifespan. Consequently, significant research efforts are directed towards developing self-healing properties in these components. Notably, recent investigations have revealed promising outcomes in the field of self-healing composite materials, with Ti₃Ci₂Ti_x MXene being a prominent component among the myriad of available 2D materials. In this paper, we aim to introduce various synthesis methods and characteristics of Ti₃Ci₂Ti_x MXene, followed by an exploration of self-healing application technologies based on Ti₃Ci₂Ti_x MXene.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.43-48
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• 2024

The discovery of a two-dimensional electron gas (2DEG) at the interface of LaAlO₃ (LAO) and SrTiO₃ (STO) substrates has sparked significant interest, providing a foundation for cutting-edge research in electronic devices based on complex oxide heterostructures. However, conventional methods for producing LAO thin films, typically employing techniques like pulsed laser deposition (PLD) within physical vapor deposition (PVD), are associated with high costs and challenges in precisely controlling the La and Al composition within LAO. In this study, we adopted a cost-effective alternative approach-solution-based processing-to fabricate LAO thin films and investigated their electrical properties. By adjusting the concentration of the precursor solution, we varied the thickness of LAO films from 2 to 65 nm and determined the sheet resistance and carrier density for each thickness. After vacuum annealing, the sheet resistance of the conductive channel ranged from 0.015 to 0.020 Ω·s^-1, indicating that electron conduction occurs not only at the LAO/STO interface but also into the STO bulk region, consistent with previous studies. These findings demonstrate the successful formation and control of 2DEG through solution-based processing, offering the potential to reduce process costs and broaden the scope of applications in electronic device manufacturing.

• Korean Journal of Optics and Photonics
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• v.14 no.4
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• pp.466-472
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• 2003

In this paper, we proposed an optical true time-delay (TTD) feeder system for phased array antennas (PAAs). The system possesses high-speed beam scan capability since, in this scheme, different lengths of fiber delay-lines are selected by optical 2${\times}$2 MEMS switches at high speed. An optical TTD capable of beam scanning in one of eight different directions has been built for 10 GHz linear PAA systems. Experimental results on time delay measurements show that the maximum time delay error is less than 0.2 ps corresponding to a scan angle error of less than 0.84o. We have also designed a 10 GHz linear PAA composed of eight micro-strip patch antenna elements driven by the proposed TTD, and the radiation patterns of this PAA have been analyzed by simulation.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.4
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• pp.498-505
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• 1999

The ferrite device that has nonreciprocal characteristics has been used as various microwave components. In this paper, the spectral-domain method was used to analyze the characteristics of structure(strip line on multilayer structure with ferrite material) for which no paper has been published yet. It is assumed that an external dc magnetic field is applied perpendicular to the ground conductor. The propagation constant is calculated for each parameter and frequency. Also we considered convergence by increasing the number of basis functions and verified the numerical analysis results. From the results, we could confirm that as the thicknesses of YIG is increased, the cutoff region is widened and the propagation constant is decreased at the frequency of upper cutoff region. For a larger applied dc magnetic field, the frequency of cutoff region is found to be increased. Also the simulation results for strip line show that the cutoff region is widened and the propagation constant is larger than that of microstrip line.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.3
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• pp.376-379
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• 2014

In this paper, we designed more improving a dual-band power amplifier than the transceiver of RFID reader that operates at 910 MHz and 2.45 GHz. A dual-band power amplifier has two circuits. One matching circuit is composed lumped element in the band of 910 MHz. The other matching circuit using distributed element in the high band of 2.45 GHz. So, this dual-band power amplifier works as Band Rejection Filter in the band of 910 MHz but in the high band of 2.45 GHz works as Band Pass Filter. Therefore, this is composed a microstrip transmission line. A power amplifier is showed gains of 8 dB output power at 910 MHz and 1.5 dB output power at 2.45 GHz. If input power is 10 dBm, both of bands output 20 dBm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.13-20
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• 2004

In order to set up the design of micro optical bench, optical coupling efficiencies of two sets of test benches are calculated. Simple linear connections of incoming and outgoing optical fibers with and without ball lenses are designed. Positional errors that are possible in actual fabrication processes we considered in the calculations and their tolerances are determined from -3 ㏈ conditions. For a simple fiber-to-fiber connection, the lateral misalignment should be limited to 2.7 um and tilt error 5.8o. In case of the fiber-to-fiber with ball lens, the working distance between fibers can be extended over 60 um. The optical coupling efficiency depends strongly on the positional errors of ball lenses along the optical axis, and it is also found that the lateral and vertical positional errors should be considered simultaneously in order to keep the high coupling efficiency.