• Polymer(Korea)
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• v.37 no.4
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• pp.547-552
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• 2013

Polyimide (PI) containing carboxyl functional group was prepared and reacted with diaminosiloxane during high temperature film casting. The morphology of resulting film was observed by using transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDX), which revealed that globular 100 nm-sized PI domains and continuous polysiloxane phase were formed. X-ray photoelectron spectroscopy (XPS) study indicated that air-film interface mainly consisted of polysiloxane blocks. Poly(imidesiloxane) thin layer was thermostable until $400^{\circ}C$ and its pressure- sensitive adhesive property was retained up to $300^{\circ}C$. The comparative experiments revealed that grafting between carboxyl groups of polyimide and aminosiloxane was crucial for formation of microdomain structure and pressure-sensitive adhesive property.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.51-57
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• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Composites Research
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• v.33 no.1
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• pp.19-24
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• 2020

In this paper, the microwave irradiation process was conducted during the Poly(vinylidene fluoride) (PVDF) nano-composite film fabrication process to analyze how the β-crystalline is increased. TiO₂ was added as a nanoparticle reinforcement to further improve the β-crystalline conformation of the PVDF films by van der Waals force due to the difference of electronegativity between PVDF and the metal oxide nanoparticle. The crystalline conformation of the fabricated films was analyzed by X-ray diffraction and Fourier transform infrared spectroscopy. According to these analysis results, it was confirmed that the microwave irradiation process during the solvent evaporation process increases the crystallinity of the PVDF films, and more β-crystalline can be obtained after additional film stretching process. It was also found that the PVDF nano-composite films with the metal oxide have relatively higher β-crystalline conformation rather than the neat PVDF films.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.448-448
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• 2013

최근 생물학적 분석 기구에서 시료를 처리, 분리, 검출, 샘플링 또는 분석하기 위해 사용되는 마이크로펌프(Micropump)에 대한 관심이 높아지고 있다. 또한 전자소자의 성능과 신뢰성의 증진을 위한 전자소자의 열 문제를 해결하기 위해 냉각장치로 마이크로 펌프가 적용되기도 한다. 그 외에도 마이크로펌프는 다양한 분야에 응용이 가능하다. 마이크로펌프는 작동 방식에 따라 압전형, 공압형, 열공압형, 연동형 등의 여러 종류로 분류되고 있다. 그중에서도 최근에는 연동형 마이크로 펌프의 개발이 각광받고 있다. 기존의 연동형 펌프들은 다중 챔버를 가지고 있으며, 각각의 챔버 내에서 Dead volume이 많이 발생할 뿐만 아니라 이상적인 연동운동과는 차이가 많이 나는 문제점을 가지고 있다. 또한 압전방식과 열공압방식은 느린 응답성으로 인해 효율적인 유체 이동이 어렵다. 본 논문에서는 이상적인 연동운동을 구현하기 위하여 기존의 연동형 펌프의 단점을 보완하고, 하나의 챔버에 다중전극 구조를 가지는 정전기력방식의 연동형 펌프를 개발하였다. 정전기력방식으로 펌프를 구동함으로써, 저전력으로 펌프구동이 가능하며, 하나의 챔버에 다중전극을 설치함으로써 이상적인 연동운동을 재현하였다. 그리고 Dead volume을 최소화 하였다. 또한, 빠른 반응속도로 인해 효율적인 유체 이동을 실현시킬 수 있었다. 본 연구에서 제안된 마이크로 펌프의 구성은 크게 챔버, 박막, Inlet/outlet hole으로 구성되었다. 챔버는 Si-wafer에 wet etching 공정으로 제작 하였고 그 위에 알루미늄 박막을 200 nm 증착시켰다. 챔버는 가로 32 mm, 세로 5 mm, 깊이는 $15{\mu}m$, 부피는 $200{\mu}l$으로 제작되었다. 박막은 폴리이미드(polyimide)를 사용하여 $3{\mu}m$의 두께로 제작 되었으며, 폴리이미드 박막 사이에는 200 nm 두께의 4개의 알루미늄 박막 전극을 삽입시켰다. 삽입된 4개의 전극에 개별적인 전기신호를 보냄으로써 연동운동이 가능하다. Inlet/outlet hole은 직경 2 mm의 크기로 제작되었으며, 튜브를 연결하여 유체가 흐를 수 있는 체널을 형성하였다. 제작된 마이크로 펌프의 구동전압은 115 V이며, 인가되는 주파수를 1 Hz~100 KHz까지 변화시켜 유량을 측정하였다. 작동 유체는 공기이며, 유량측정은 튜브 내에 물방울을 삽입하여 시간에 따른 이동거리를 관측하였다. 측정결과 2.2 KHz에서 2.4 mm/min의 가장 높은 유량을 확인할 수 있었다. 본 연구를 통해 제안된 연동형 마이크로펌프는 이상적인 연동운동이 가능함으로써 기존의 연동형 방식의 문제점을 보완하였으며, 생명과학, 의학, 화학 등의 분야에서 적용이 가능하리라 기대된다.

• Journal of the Korea institute for structural maintenance and inspection
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• v.28 no.3
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• pp.47-58
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• 2024

This study were conduced experimentally to analyze the heat-generating performance, flexural strength, and microstructure of conductive mortar mixed with micro steel fiber and multi-wall carbon nanotube (MWCNT). In the conductive mortar heat-generating performance and flexural strength tests, the mixing concentration of MWCNT was selected as 0.0wt%, 0.5wt%, and 1.0wt% relative to the weight of cement, and micro steel fibers were mixed at 2.0vol% relative to the volume. The performance experiments were conducted with various applied voltages (DC 10V, 30V, 60V) and different electrode spacings (40 mm, 120 mm) as parameters, and the flexural strength was measured at the curing age of 28 days and compared and analyzed with the normal mortar. Furthermore, the surface shape and microstructure of conductive mortar were analyzed using a field emission scanning electron microscope (FE-SEM). The results showed that the heat-generating performance improved as the mixing concentration of MWCNT and the applied voltage increased, and it further improved as the electrode spacing became narrower. However, even if the mixing concentration of MWCNT was added up to 1.0 wt%, the heat-generating performance was not significantly improved. As a result of the flexural strength test, the average flexural strength of all specimens except the PM specimen and the MWCNT mixed specimens was 4.5 MPa or more, showing high flexural strength due to the incorporation of micro steel fibers. Through FE-SEM image analysis, Through FE-SEM image analysis, it was confirmed that a conductive network was formed between micro steel fibers and MWCNT particles in the cement matrix.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.354-359
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• 2006

Recently, the interest in lithography without photo exposure has been increased compare to the conventional photolithography in nano meter and micrometer size patterning area. We studied a self aligned dipping of Ag solution through micro contact printing (${\mu}-CP$) with octadecyltrichlorosilane (OTS) treated polydimethylsiloxane (PDMS) soft mold. The OTS monolayer on the patterned PDMS was formed by dipping it into OTS solution. We transferred the OTS monolayer from PDMS mold to the glass. The OTS monolayer changed the surface energy from hydrophilic surface to hydrophobic surface, And then we made self aligned Ag solution patterns just after dipping the substrate, using adhesion difference of Ag solution between OTS treated hydrophobic area and non-OTS treated hydrophilic area. We finally get the Ag patterns through only dip-coating after the ${\mu}-CP$ process. And we observed surface energies on the glass substrate through the contact angle measurements as time goes on.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of Power System Engineering
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• v.14 no.5
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• pp.41-47
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• 2010

티타늄과 티타늄 합금은 재료적 특이성 때문에 심장 혈관 임플란트에서 일반적으로 사용되어 왔다. 일찍이 적용된 예로는 인공심장판막, 심박조율기의 보호케이스, 혈액 순환 장치 등이 있다. 하지만 물질유도혈전증(Material-induced thrombosis)은 혈전폐색에 의해 기인한 기능 손실로 심장혈관 임플란트 장치의 주된 합병증으로 존재하고 있으며, 심장혈관 임플란트의 혈전유전자는 심장혈관장치의 발달에 주된 난관 중 하나로 남아있다. 그리고 텍스처 혈액 접합 물질(Textured blood-contacting material)은 1960년대 초반 이후부터 혈액순환 보조 장치의 임상실험에 사용되고 있다. 접합 물질에 내장된 텍스처 섬유조직 표면은 형성, 성장, 안정적 부착, 생물학적 내벽(neointimal layer) 등 유도 혈액(entrapping blood) 성분에 의해 형성된다. 공동(cavity) 형상의 용해 가능한 미립자를 사용하는 SCPL법(Solvent casting/particulate leaching method)은 티타늄 기질 이전에 형성된 폴리우레탄 위에 텍스처(texture)를 생성하기 위해 사용되었다. 또한 콜라겐의 부동화(不動化)에 의한 공동(cavity)은 혈액 접합면에 잔존하기 위한 내피세포를 고정할 수 있는 효과가 있다. cpTi로 층화된 PU 기소공성(microporous)은 구조적 특성과 혈전증 감소를 위한 생물학적 내벽 사용의 잠재성을 평가하기 위한 세포 공동체 실험을 통해서 평가되었다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.55-59
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• 2018

In this paper, we investigated the characteristics of shear stress type piezoresistor on a diaphragm structure formed by MEMS (Microelectromechanical System) technology of silicon-direct-bonding (SDB) wafers with Si/$SiO_2$/Si-sub. The diaphragm structure formed by etching the backside of the wafer using a TMAH aqueous solution can be used for manufacturing various sensors. In this study, the optimum shape condition of the shear stress type piezoresistor formed on the diaphragm is found through ANSYS simulation, and the diaphragm structure is formed by using the semiconductor microfabrication technique and the shear stress formed by boron implantation. The characteristics of the piezoelectric resistance are compared with the simulation results. The sensing diaphragm was made in the shape of an exact square. It has been experimentally found that the maximum shear stress for the same pressure at the center of the edge of the diaphragm is generated when the structure is in the exact square shape. Thus, the sensing part of the sensor has been designed to be placed at the center of the edge of the diaphragm. The prepared shear stress type piezoresistor was in good agreement with the simulation results, and the sensitivity of the piezoresistor formed on the $2200{\mu}m{\times}2200{\mu}m$ diaphragm was $183.7{\mu}V/kPa$ and the linearity of 1.3 %FS at the pressure range of 0~100 kPa and the symmetry of sensitivity was also excellent.