• Applied Chemistry for Engineering
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• v.33 no.1
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• pp.11-16
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• 2022

Metal-organic frameworks (MOFs) are porous materials with nano-sized pores. The degree of gas adsorption and pore size can be controlled according to types of metal ions and organic ligands. Many studies have been conducted on MOFs in the fields of gas storage and separation, and gas sensors. For rapid and quantitative gas adsorption/desorption analyses, it is necessary to form various MOF structures in uniform films on a sensor surface. In this review, some of representative direct methods for uniformly synthesizing MOFs such as MIL-53 (Al), ZIF-8, and Cu-BDC from anodized aluminum oxide, zinc oxide nanorods, and copper thin films, respectively on the surface of a microresonator are highlighted. In addition, the operation principle of quartz crystal microbalance and microcantilever, which are representative microresonators, and the interpretation of signals that change when gas is adsorbed to MOFs are covered. This is intended to enhance the understanding of gas adsorption/desorption analysis of MOFs using microresonators.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.33-38
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• 2004

We have demonstrated a tunable Inter based on an asymmetric directional coupler made of a side-polished polarization maintaining fiber coupled with a polymer planar waveguide. The thermo-optic effects of the polymer planar waveguide induced by a micro-strip heater placed on the top layer of the device leads to shift of resonance wavelength of the coupler. The fabricated device exhibited wide tunable range exceeding 230 nm with 720 ㎽ of applied electrical power.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1527_1528
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• 2009

떠 있는 열선 구조를 채택한 고온 구동 마이크로 MEMS 히터의 특성을 평가하고 분석하였다. 고온 MEMS 히터는 적외선을 이용한 광학식 가스센서의 주요한 핵심 부품인 적외선 발광원으로 활용할 수 있다. MEMS 기술을 이용하여 대량생산이 가능하여 가격을 낮출 수 있고 소비전력이 작아 적외선 센서의 광원으로 응용되는 등 관련 분야의 연구가 많이 이루어지고 있다. 본 논문에서는 실리콘 기판으로부터 떠 있는 실리콘 지지구조물 위에 형성된 백금 저항성으로 고온 발열 동작하는 새로운 구조의 MEMS 히터에 대한 온도 특성을 고해상도 적외선 카메라로 측정한 이미지를 이용하여 분석하였다.

• Information and Communications Magazine
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• v.20 no.5
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• pp.645-656
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• 2003

최근에 정보 산업과 이동 통신 기술이 발전함에 따라 퍼스널 컴퓨터를 넘어 컴퓨터의 개념이 매우 빠르게 확장되고 있다. 이동 정보 단말 형태의 PDA, HPC(hand-held PC), 휴대폰 등이 개발되었고, 셋탑박스(set-top box), 지능형 디지털 TV, 인터넷 냉장고 등의 정보가전은 임베디드 운영체제(embedded OS)를 내장하여 컴퓨터로 발전하고 있으며, 제어 및 계측 기기들도 마이크로 프로세서를 내장하여 임베디드 시스템으로 발전하고 있다. 이렇게 새롭게 확장된 컴퓨터 시스템들은 인간 생활의 편리성과 다양성을 위해 상호 연결되어 하나의 네트워크를 형성하고 있으며, 상호간에 정보를 공유하고 협력하여 언제 어디서나 통신 및 컴퓨팅이 가능한 유비쿼터스 네트워킹(Ubiquitous Networking)으로 발전하고 있다. 본 논문에서는 이러한 유비쿼터스 네트워킹에서 필요한 컴퓨팅 미들웨어(Middleware) 기술의 최근 동향을 살펴보고 본 연구에서 제안하는 새로운 미들웨어 기술을 설계한다. 이러한 미들웨어 기술은 편재(遍在)되어 있는 컴퓨팅 장치를 상호 이용하기 위해 컴퓨터의 환경을 탐지하여 저장하고 재이용하는 상황 인식 기술, 편재된 장치들이 네트워크에 연결되면서 정보를 전달하는 Ad-hoc 네트워킹과 동적 라우팅 기술, 그리고 정보 전달을 위해 제어 코드와 데이터를 패킷 (packet) 형태로 전달하는 협력 메시지(Cooperative Message) 기술 등이 포함된다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.83-88
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• 2010

The composite electroplating is accomplished by adding inert materials during the electroplating. Permalloy is the term for Ni-Fe alloy and it is used for industrial applications due to its high magnetic permeability. Microhardness for microdevices is enhanced after composite coating and it increases the life cycle. However, the hydroxyl group on the silica makes their surface susceptible to moisture and it causes the silica nanoparticles to be agglomerated in the aqueous solution. The agglomeration problem causes poor dispersion which eventually interrupts uniform deposition of silica nanoparticles. In this study, the dispersion of silica nanoparticles in the permalloy electroplated layer is reported with variation of additives and sonication time. Longer sonication period guaranteed better silica nanopowder dispersion and sonication period also influenced on composition of deposits. The amount of silica nanopowder codeposition and surface morphologies were influenced with variation of additives. In alkaline bath, smooth surface morphology and relatively high contents of silica nanopowder codeposition were obtained with addition of sodium lauryl sulfate.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.65-69
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• 2012

Composite coating can be manufactured during the electroplating with the bath containing a suspension of particles: ceramic, polymer, nanopowders. Improvement of hardness, wear resistance, corrosion resistance and lubrication properties are well-known advantage of composite coating. In this study, nano $TiO_2$ powder dispersed Ni composite plating was investigated. The improvement of surface hardness and photo decomposition effects can be expected in this coating. Zeta potential was measured with pH. The effect of ultrasonication time and types of ultrasonicator were studied to minimize the agglomeration of $TiO_2$ nanopowders in the electrolyte. Optimum conditions for nano $TiO_2$ dispersed Ni composite coating were $40mA/cm^2$ of current density, pH 3.5, and $50^{\circ}C$. At these conditions, $TiO_2$ nanoparticles contents in the Ni deposit was 15-20 at.%.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.17-23
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• 2001

The 3-D Hall sensor has two horizontal magnetic field sensing parts ($\chi$, y components) and one vertical magnetic field sensing part (z component). For conventional, 3-D Hall sensor it is general that the sensitivity for $B_{z}$ is about 1/10 compared with those for $B_\chi$ or $B_y$. Therefore, in this work, we proposed 3-D Hall sensor with new structure. We have increased the sensitivity about 6 times to form the trench using anisotropic etching. And we have increased the sensitivity for the $B_z$ by 80% compared with those of $B_\chi$ and$B_y$ using deposition of the ferromagnetic thin films on the bottom surface of the wafer to concentrate the magnetic fluxes. When the input current was 3 mA, sensitivities of the fabricated sensor with Ni/Fe film for $B_\chi, B_y$ and $B_{z}$ were measured as 120.1 mV/T, 111.7 mV/T, 95.3 mV/T, respectively. The measured linearity of the sensor was within $\pm$3% of error.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.