• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1858-1860
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• 2001

최근에 특정 주파수 대역에서 전자기파의 전파를 억제하는 주기 구조인 PBG(Photonic Band Gap) 구조에 대한 연구가 활발히 이루어지고 있다. 본 논문에서는 마이크로스트립 선로에서 사용될 수 있는 새로운 PBG cell을 제안하였다. 제안된 구조는 단일 cell 만으로도 대역저지 특성을 얻을 수 있고, cell의 치수를 조절하여 저지대역을 조절할 수 있다. 또한, 방사 효과 등으로 인한 손실을 고려하여 정확한 등가 모델링을 할 수 있다. 본 논문에서는 제안된 구조를 마이크로스트립 패치안테나의 하모닉 억제를 위해 사용하여 그 유용성을 입증하였다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.83-88
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• 2003

The optoelectronic characteristics of semiconducto-atomic superlattice as a function of deposition temperature and annealing conditions have been studied. The nanocrystalline silicon/adsorbed oxygen superlattice formed by molecular beam epitaxy(MBE) system. As an experimental result, the superlattice with multilayer Si-O structure showed a stable photoluminescence(PL) and good insulating behavior with high breakdown voltage. This is very useful promise for Si-based optoelectronics and quantum devices as well as for the replacement of silicon-on-insulator (SOI) in ultra-high speed and lower power CMOS devices in the future, and it can be directly integrated with silicon ULSI processing.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.10
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• pp.1269-1274
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• 2019

The paper presents a design of simple four-element microstrip-patch array antenna that is suitable for 5G applications. The proposed array consists of four rectangular microstrip patch elements with semicircular etches made on both sides of each elements. The antenna is fed using the combination of series and corporate feeding networks. The size of the ground is also changed to improve the antenna frequency. Finally, yagi elements are also added to improve the directive gain of the antenna. The presented microstrip patch array is able to achieve wide frequency bandwidth of 21.95-31.86 GHz. The antenna has also attained gain of 9.7 dB at 28 GHz and has maintained high gain and high directivity throughout the frequency band. The proposed array antenna fed by series-corporate feeding network, with low profile and simple structure is a good candidate for 5G applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.325-325
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• 2008

스크린 프린팅에 의한 압전 후막은 MEMS 공정을 이용하여 마이크로 펌프, 마이크로 벨브, 마이크로 센서, 마이크로 로봇 등 여러 초소형 기계부품에 응용되고 있으며, Sol-Gel, PLD를 이용해 증착된 막 등에 비해 수십${\mu}m$의 비교적 두꺼운 막을 형성시킬 수 있는 장점을 가지고 있다. 그러나 실리콘 기판을 사용하여 스크린 프린팅으로 형성된 압전 후막의 경우, 공정상 바인더를 연소시키는 과정을 거치게 되므로, 밀집된(Dense) 구조를 가지는 막을 만들기가 어렵다. 이로 인해 스크린 프린팅에 의한 후막은 전기적 특성 및 기계적 특성이 떨어지는 경향이 있다. 본 연구에서는 스크린 프린팅에 의한 압전 후막의 밀집된 구조 및 특성을 향상시키기 위해 0.01Pb$(Mg_{1/2}W_{1/2})$O3-0.41Pb$(Ni_{1/3}Nb_{2/3})O_3-0.35PbTiO_3-0.23PbZrO_3$의 powder와 Attrition 밀링 처리된 powder를 비율별로 혼합하여 입자의 크기를 변화시켜 막의 충진 밀도를 향상시켰으며, 열처리 효과를 극대화시키기 위해 RTA(Rapidly Thermal Annealing)를 통해 열처리 하였다. Attrition 밀링에 의한 파우더를 각각 비율별로 100%, 50%, 25%로 혼합하여 만든 압전 세라믹 페이스트는 P-type(100)Si Wafer sample 위에 $1{\mu}m$의 하부전극용($1100^{\circ}C$) Ag 전극을 screen print하여 소결했다. 그리고 다시 전극이 형성된 Si wafer 위에 스크린 프린팅하고, 건조 한 후 RTA로 300초 동안 열처리 한 결과 밀집된 구조를 가지는 압전 후막을 제작 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.7-11
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• 2003

The semiconductor chips or electronic components generate heat, which causes malfunction of the parts when it was not cooled properly. Bulky heat sink and cooling fan are used to get rid of the heat. However, with this bulky system, it is hard to integrate the electronics system in a small scale. The cooling efficiency of the system depends on the surface area of the heat sink, thermal conductivity of the material and the method of integration. In order to develop a novel cooling system, a micro-heatsink with a large surface area while retaining small volume was fabricated by electroless deposition of gold/copper inside a Track-etched membrane. The structure of the micro-heatsink was investigated using SEM or optical microscope. It was also found that the micro-heatsink is more efficient than a flat copper plate.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.143-152
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• 2001

A method for miniaturization of microstrip patch antenna without degrading its radiation characteristics is investigated in this paper. It involves perforating the patch to form a microstrip square-ring antenna, and it's BW enhancement is investigated numerically and experimentally. A ring geometry introduces additional parameters to the antenna, and those are used to control impedances, resonance frequencies, and bandwidths. For a single square ring antenna, an increase of the size of perforation increases its input impedance, decreases the resonance frequency, and bandwidths. But it affects little on directivity of the antenna. To match the antenna to a transmission line and also enhance its bandwidth, the ring is stacked by a square patch or another square ring. Also numerically simulated results by the IE3D, and experimental data are compared for proof.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.225-226
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• 2012

전기방사법으로 형성한 마이크로 크기의 실리카($SiO_2$) 코팅층 위에 광환원법(photo-reduction mothod)를 이용하여 나노 크기의 금속 나노입자를 형성하여 마이크로-나노 계층구조(hierarchical structure)의 코팅층을 형성하였다. 자외선(UV선) 조사강도 및 조사시간의 변화에 따른 미세구조 및 표면 평활도지수(roughness factor) 변화 거동을 관찰하였고, 이 코팅층에 불소화 처리를 하여 초소수성 표면을 형성하였다.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.75-80
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• 2013

According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.4
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• pp.487-493
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• 2001

In this paper, A new microstrip bandpass filter is proposed. The novelty of the proposed structures is to use a interdigital capacitor and embeded slot that are fanned on a patch resonator such that its insertion loss and size can be significantly reduced simultaneously. As a result, it is found that the resonant frequency of patch filter designed at 5 GHz is decreased to 1.8946 GHz and the insertion loss is reduced from -2.168 dB to -0.379 dB. This proposed filter has small size and low insertion loss in comparison with the conventional parallel edge coupled bandpass filter.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.363-366
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• 2005

A micro flow sensor on silicon substrate allows the fabrication of small components where many different functions can be integrated so that the functionality of the sensors can be increased. Further more, due to the small size of the elements the sensors can be quite fast. A thermal mass flow sensor measures the asymmetry of temperature profile around the heater which is modulated by the fluid flow. In normal, a mass flow sensor is composed of a central heater and a pair of temperature sensing elements around the heater. A new 2-D wide range micro flow sensor structure with three pairs of temperature sensors and a central heater was proposed and numerically simulated by the Finite difference formulation to confirm the feasibility of the flow sensor structure.