• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.294-294
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• 2012

본 연구에서는 마그네트론 스퍼터를 이용한 경사 코팅법으로 질화 티타늄을 합성하였으며, 온도, 시편 인가전압, 외부 자기장 등 여러 코팅 조건에 따른 박막의 특성변화를 평가하였다. 스퍼터 소스에 장착된 타겟은 6"의 Ti 타겟을 사용하였으며, 시편과 타겟간의 거리는 약 10 cm, 시편은 Si-wafer와 SUS를 사용하였다. 시편을 진공용기에 장착하고 진공배기를 실시한 후 Ar 가스를 진공용기 내로 공급하여 시편에 전압을 인가한 후 플라즈마를 발생시켜 청정을 실시하였다. 플라즈마 청정이 끝나면 질소유량 (5~60 sccm), 온도 ($0{\sim}300^{\circ}C$), 시편 인가전압 (0~100 V), 외부 자기장 (0~3 A) 등 여러 공정변수를 변화시키며 코팅하였다. 질화 티타늄의 두께는 약 $1.5{\mu}m$로 동일하게 코팅하였다. 그 결과 온도와 시편 인가전압은 각각 $200^{\circ}C$와 100 V 일 때 가장 높은 경도를 보였으며, 외부 자기장의 변화는 경도에 큰 영향을 미치지 않았다. 코팅 변수의 변화에 따른 질화 티타늄 박막의 색차, 경도, 조도, 반사도, 마모도 등의 물성 변화를 분석하였으며, 본 연구에서 얻어진 결과를 이용하여 공정변수 제어를 통한 원하는 특성을 가진 TiN 박막을 쉽게 형성할 수 있을 것으로 예상된다.

• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.375-379
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• 2014

Nanocrystalline TiAlN coatings were prepared by reactively sputtering TiAl metal target with $N_2$ gas. This was done using a magnetron sputtering system operated in DC and ICP (inductively coupled plasma) conditions at various power levels. The effect of ICP power (from 0 to 300 W) on the coating microstructure, corrosion and mechanical properties were systematically investigated using FE-SEM, AFM and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of TiAlN coatings. With increasing ICP power, the coating microstructure evolved from the columnar structure typical of DC sputtering processes to a highly dense one. Average grain size of TiAlN coatings decreased from 15.6 to 5.9 nm with increasing ICP power. The maximum nano-hardness (67.9 GPa) was obtained for the coatings deposited at 300 W of ICP power. The smoothest surface morphology (Ra roughness 5.1 nm) was obtained for the TiAlN coating sputtered at 300 W ICP power.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.155-157
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• 2009

3성분계 Ti-Si-N코팅은 $N_2$와 Ar 혼합가스 분위기하에서 Ti 소스는 아크 이온 플레이팅, Si 소스는 직류 마그네트론 스퍼터링 증착기법을 이용해 스테인리스 스틸 기판위에 합성되었다. Ti-Si-N 코팅에서 Si 함유량이 증가함에 따라 주상정 구조가 TiN 나노결정질을 $SiN_x$ 비정질이 둘러싸고 있는 독특한 나노복합체구조로 변화되었다. 상온 NaCl 3wt% 용액에서 Anodic Polarization measurement 법으로 측정된 결과에서 Si 함유량이 높아짐에 따라 나노복합체 구조로 인하여 더 우수한 내식성을 나타내었다.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.287-291
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• 2008

Reactively magnetron sputtered TiN films were deposited on Si wafers under varying bias voltage and characterized by X-ray diffraction, field-emission scanning electron microscopy and Nanoindentation. The films deposited under an Ar + $N_2$ atmosphere exhibited a mixed (200)-(111) orientation with a strong (200) texture, which subsequently changed to a strong (111) texture with increasing bias voltage. The changes in texture and grain size of the TiN thin films are due to one or a combination of factors such as strain energy, surface free energy, surface diffusivity and adatom mobility. The influence of each factor depends on the processing conditions. The average deposition rate and grain size were calculated from FE-SEM images of the films indicating that the deposition rate was lower at the films deposited under bias voltage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.7
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• pp.660-664
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• 2008

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness, chemical stability, low friction and good adhesion properties. In this study, we investigated the effect of DC power on the characteristics of TiN thin films deposited on Si and glass substrates by DC magnetron sputtering using TiN target. We made TiN films of 300 nm thickness with various DC powers. The structural properties of films are investigated by x-ray diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester. The rms roughness was measured by atomic forced microscopy (AFM). In the result, TiN films had the smooth surface and exhibited (111) directions with the increase of DC Power. Also, especially in case of 175 W DC power, TiN film exhibited the maximum hardness about 8 GPa, and the critical load near 25.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.354-354
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• 2007

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness. In this paper, we wanted see how the films properties are changed according to DC power. TiN thin films were deposited by direct current (DC) magnetron sputtering method using TiN compound target on silicon substrates. The films structural properties are examined by X-ray Diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester, nano-stress tester. Especially in DC power of 150 W, the maximum hardness and the minimum residual stress of TiN film exhibited about 25 GPa and 1 GPa, respectively. And also, the critical load of TiN film prepared by magnetron sputtering method were measured over 30 N.