• Title/Summary/Keyword: 로직회로

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Design of Synchronous 256-bit OTP Memory (동기식 256-bit OTP 메모리 설계)

  • Li, Long-Zhen;Kim, Tae-Hoon;Shim, Oe-Yong;Park, Mu-Hun;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.7
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    • pp.1227-1234
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    • 2008
  • In this paper is designed a 256-bit synchronous OTP(one-time programmable) memory required in application fields such as automobile appliance power ICs, display ICs, and CMOS image sensors. A 256-bit synchronous memory cell consists of NMOS capacitor as antifuse and access transistor without a high-voltage blocking transistor. A gate bias voltage circuit for the additional blocking transistor is removed since logic supply voltage VDD(=1.5V) and external program voltage VPPE(=5.5V) are used instead of conventional three supply voltages. And loading current of cell to be programmed increases according to RON(on resistance) of the antifuse and process variation in case of the voltage driving without current constraint in programming. Therefore, there is a problem that program voltage can be increased relatively due to resistive voltage drop on supply voltage VPP. And so loading current can be made to flow constantly by using the current driving method instead of the voltage driving counterpart in programming. Therefore, program voltage VPP can be lowered from 5.9V to 5.5V when measurement is done on the manufactured wafer. And the sens amplifier circuit is simplified by using the sens amplifier of clocked inverter type instead of the conventional current sent amplifier. The synchronous OTP of 256 bits is designed with Magnachip $0.13{\mu}m$ CMOS process. The layout area if $298.4{\times}314{\mu}m2$.

12-bit SAR A/D Converter with 6MSB sharing (상위 6비트를 공유하는 12 비트 SAR A/D 변환기)

  • Lee, Ho-Yong;Yoon, Kwang-Sub
    • Journal of IKEEE
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    • v.22 no.4
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    • pp.1012-1018
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    • 2018
  • In this paper, CMOS SAR (Successive Approximation Register) A/D converter with 1.8V supply voltage is designed for IoT sensor processing. This paper proposes design of a 12-bit SAR A/D converter with two A / D converters in parallel to improve the sampling rate. A/D converter1 of the two A/D converters determines all the 12-bit bits, and another A/D converter2 uses the upper six bits of the other A/D converters to minimize power consumption and switching energy. Since the second A/D converter2 does not determine the upper 6 bits, the control circuits and SAR Logic are not needed and the area is minimized. In addition, the switching energy increases as the large capacitor capacity and the large voltage change in the C-DAC, and the second A/D converter does not determine the upper 6 bits, thereby reducing the switching energy. It is also possible to reduce the process variation in the C-DAC by proposed structure by the split capacitor capacity in the C-DAC equals the unit capacitor capacity. The proposed SAR A/D converter was designed using 0.18um CMOS process, and the supply voltage of 1.8V, the conversion speed of 10MS/s, and the Effective Number of Bit (ENOB) of 10.2 bits were measured. The area of core block is $600{\times}900um^2$, the total power consumption is $79.58{\mu}W$, and the FOM (Figure of Merit) is 6.716fJ / step.

A Non-Calibrated 2x Interleaved 10b 120MS/s Pipeline SAR ADC with Minimized Channel Offset Mismatch (보정기법 없이 채널 간 오프셋 부정합을 최소화한 2x Interleaved 10비트 120MS/s 파이프라인 SAR ADC)

  • Cho, Young-Sae;Shim, Hyun-Sun;Lee, Seung-Hoon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.9
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    • pp.63-73
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    • 2015
  • This work proposes a 2-channel time-interleaved (T-I) 10b 120MS/s pipeline SAR ADC minimizing offset mismatch between channels without any calibration scheme. The proposed ADC employs a 2-channel SAR and T-I topology based on a 2-step pipeline ADC with 4b and 7b in the first and second stage for high conversion rate and low power consumption. Analog circuits such as comparator and residue amplifier are shared between channels to minimize power consumption, chip area, and offset mismatch which limits the ADC linearity in the conventional T-I architecture, without any calibration scheme. The TSPC D flip-flop with a short propagation delay and a small number of transistors is used in the SAR logic instead of the conventional static D flip-flop to achieve high-speed SAR operation as well as low power consumption and chip area. Three separate reference voltage drivers for 4b SAR, 7b SAR circuits and a single residue amplifier prevent undesirable disturbance among the reference voltages due to each different switching operation and minimize gain mismatch between channels. High-frequency clocks with a controllable duty cycle are generated on chip to eliminate the need of external complicated high-frequency clocks for SAR operation. The prototype ADC in a 45nm CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 0.77LSB, with a maximum SNDR and SFDR of 50.9dB and 59.7dB at 120MS/s, respectively. The proposed ADC occupies an active die area of 0.36mm2 and consumes 8.8mW at a 1.1V supply voltage.

Low-Power Discrete-Event SoC for 3DTV Active Shutter Glasses (3DTV 엑티브 셔터 안경을 위한 저전력 이산-사건 SoC)

  • Park, Dae-Jin;Kwak, Sung-Ho;Kim, Chang-Min;Kim, Tag-Gon
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.48 no.6
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    • pp.18-26
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    • 2011
  • Debates concerning the competitive edge of leading 3DTV technology of the shutter glasses (SG) 3D and the film-type patterned retarder (FPR) are flaring up. Although SG technology enables Full-HD 3D vision, it requires complex systems including the sync transmitter (emitter), the sync processor chip, and the LCD lens in the active shutter glasses. In addition, the transferred sync-signal is easily affected by the external noise and a 3DTV viewer may feel flicker-effect caused by cross-talk of the left and right image. The operating current of the sync processor in the 3DTV active shutter glasses is gradually increasing to compensate the sync reconstruction error. The proposed chip is a low-power hardware sync processor based discrete-event SoC(system on a chip) designed specifically for the 3DTV active shutter glasses. This processor implements the newly designed power-saving techniques targeted for low-power operation in a noisy environment between 3DTV and the active shutter glasses. This design includes a hardware pre-processor based on a universal edge tracer and provides a perfect sync reconstruction based on a floating-point timer to advance the prior commercial 3DTV shutter glasses in terms of their power consumption. These two techniques enable an accurate sync reconstruction in the slow clock frequency of the synchronization timer and reduce the power consumption to less than about a maximum of 20% compared with other major commercial processors. This article describes the system's architecture and the details of the proposed techniques, also identifying the key concepts and functions.